公开(公告)号：US11089673B2

公开(公告)日：2021-08-10

申请号：US16517043

申请日：2019-07-19

申请人： RAYTHEON COMPANY

发明人： Andrew Southworth ,  Kevin Wilder ,  James Benedict ,  Mary K. Herndon ,  Thomas V. Sikina ,  John P. Haven

IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/04 ,  H05K3/10 ,  H05K3/22 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46 ,  H01L21/00 ,  H01L21/205 ,  H01L23/48 ,  H01L23/60 ,  H01L23/522 ,  H01L23/528 ,  H05K9/00 ,  H01Q1/38 ,  H01Q1/52 ,  H05K3/30

摘要： A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

公开(公告)号：US20210022238A1

公开(公告)日：2021-01-21

申请号：US16517043

申请日：2019-07-19

申请人： RAYTHEON COMPANY

发明人： Andrew Southworth ,  Kevin Wilder ,  James Benedict ,  Mary K. Herndon ,  Thomas V. Sikina ,  John P. Haven

IPC分类号： H05K1/02 ,  H05K3/00 ,  H05K3/30 ,  H01Q1/38 ,  H01Q1/52

摘要： A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

公开(公告)号：US11470725B2

公开(公告)日：2022-10-11

申请号：US17395977

申请日：2021-08-06

申请人： RAYTHEON COMPANY

发明人： Mikhail Pevzner ,  James E. Benedict ,  Andrew R. Southworth ,  Thomas V. Sikina ,  Kevin Wilder ,  Matthew Souza ,  Aaron Michael Torberg

IPC分类号： H05K3/10 ,  B21F11/00

摘要： An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

公开(公告)号：US11444365B2

公开(公告)日：2022-09-13

申请号：US16822399

申请日：2020-03-18

申请人： RAYTHEON COMPANY

发明人： James Benedict ,  Erika Klek ,  John P. Haven ,  Michael Souliotis ,  Thomas V. Sikina ,  Andrew R. Southworth ,  Kevin Wilder

IPC分类号： H01P5/08 ,  H01P3/08

摘要： A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstrip-to-stripline transition element operably connectable to the microstrip interface and to the stripline interface.

公开(公告)号：US20210151855A1

公开(公告)日：2021-05-20

申请号：US16683593

申请日：2019-11-14

申请人： RAYTHEON COMPANY

发明人： Thomas V. Sikina ,  John P. Haven ,  Kevin Wilder ,  James E. Benedict ,  Andrew R. Southworth ,  Mary K. Herndon

IPC分类号： H01Q1/24 ,  H01Q21/00 ,  H01Q21/06 ,  H01Q1/52

摘要： A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.

公开(公告)号：US20190150296A1

公开(公告)日：2019-05-16

申请号：US15988296

申请日：2018-05-24

申请人： RAYTHEON COMPANY

发明人： Andrew R. Southworth ,  Thomas V. Sikina ,  John P. Haven ,  James E. Benedict ,  Kevin Wilder

IPC分类号： H05K3/34 ,  H05K1/02

摘要： Electromagnetic circuit structures and methods are provided for a circuit board that includes a hole disposed through a substrate to provide access to an electrical component, such as a signal trace line (or stripline), that is at least partially encapsulated (e.g., sandwiched) between substrates. The electrical component includes a portion substantially aligned with the hole, and an electrical conductor is disposed within the hole. The electrical conductor is soldered to the portion of the electrical component.

公开(公告)号：US20210337651A1

公开(公告)日：2021-10-28

申请号：US17366836

申请日：2021-07-02

申请人： RAYTHEON COMPANY

发明人： Andrew Southworth ,  Kevin Wilder ,  James Benedict ,  Mary K. Herndon ,  Thomas V. Sikina ,  John P. Haven

IPC分类号： H05K1/02 ,  H01Q1/38 ,  H01Q1/52 ,  H05K3/00 ,  H05K3/30

摘要： A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

公开(公告)号：US20210296751A1

公开(公告)日：2021-09-23

申请号：US16822399

申请日：2020-03-18

申请人： RAYTHEON COMPANY

发明人： JAMES BENEDICT ,  Erika Klek ,  John P. Haven ,  Michael Souliotis ,  Thomas V. Sikina ,  Andrew R. Southworth ,  Kevin Wilder

IPC分类号： H01P5/08 ,  H01P3/08

摘要： A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstrip-to-stripline transition element operably connectable to the microstrip interface and to the stripline interface.

公开(公告)号：US20210051805A1

公开(公告)日：2021-02-18

申请号：US16541789

申请日：2019-08-15

申请人： RAYTHEON COMPANY

发明人： Mikhail Pevzner ,  James E. Benedict ,  Andrew R. Southworth ,  Thomas V. Sikina ,  Kevin Wilder ,  Matthew Souza ,  Aaron Michael Torberg

IPC分类号： H05K3/10 ,  B21F11/00

摘要： An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

公开(公告)号：US11482795B2

公开(公告)日：2022-10-25

申请号：US16744774

申请日：2020-01-16

申请人： RAYTHEON COMPANY

发明人： Thomas V. Sikina ,  John P. Haven ,  Gregory M. Fagerlund ,  James Benedict ,  Andrew Southworth ,  Kevin Wilder

IPC分类号： H01Q21/06 ,  B33Y80/00 ,  H01Q1/38 ,  H01Q9/04

摘要： An antenna and method of manufacturing an antenna. The antenna includes a radiator feed layer, a first radiator patch assembly attached to the radiator feed layer, and a second radiator patch assembly attached to the radiator feed layer. The first radiator patch assembly is separated from the second radiator patch assembly by an air gap. The first radiator patch assembly is attached to the radiator feed layer and the second radiator patch assembly is attached to the radiator feed layer separated from the first radiator patch assembly by the air gap.