公开(公告)号：US20240159924A1

公开(公告)日：2024-05-16

申请号：US18470937

申请日：2023-09-20

Applicant: REDLEN TECHNOLOGIES, INC.

Inventor： Krzysztof INIEWSKI ,  Olivier TOUSIGNANT ,  Michael AYUKAWA

IPC: G01T1/24 ,  G01T1/29

CPC classification number: G01T1/241 ,  G01T1/243 ,  G01T1/244 ,  G01T1/2985

Abstract: A radiation detector unit including an interposer configured to electrically connect a pixelated radiation sensor positioned on a front side of the interposer to an application-specific integrated circuit (ASIC) positioned on a back side of the interposer, where the interposer has at least one feature which equalizes the energy resolution (ER) response of edge and center pixel detectors of the pixelated radiation sensor within 10% of one another.

公开(公告)号：US20230243985A1

公开(公告)日：2023-08-03

申请号：US18158695

申请日：2023-01-24

Applicant: REDLEN TECHNOLOGIES, INC.

Inventor： Glenn BINDLEY ,  Krzysztof INIEWSKI ,  Michael AYUKAWA ,  James FUJIMOTO

IPC: G01T1/24 ,  G01N23/046 ,  G01N23/083

CPC classification number: G01T1/247 ,  G01N23/046 ,  G01N23/083 ,  G01N2223/401 ,  G01N2223/04 ,  G01N2223/419 ,  G01N2223/50

Abstract: A radiation detector unit includes a read-out integrated circuit (ROIC) including a plurality of core circuit blocks located on a continuous uninterrupted substrate adjacent to one another along a first direction, and a plurality of radiation sensors bonded to a front side surface of the ROIC, where each radiation sensor of the plurality of radiation sensors is bonded to a respective core circuit block of the plurality of core circuit blocks of the ROIC. Additional embodiments include detector modules and detector arrays formed by assembling the detector units, and methods of operating and manufacturing the same.

公开(公告)号：US20210285897A1

公开(公告)日：2021-09-16

申请号：US17193219

申请日：2021-03-05

Applicant: REDLEN TECHNOLOGIES, INC.

Inventor： Christopher READ ,  Keira FLANAGAN ,  Michael AYUKAWA ,  Jeffrey Allan WALTON

IPC: G01N23/046 ,  G01N23/083

Abstract: A radiation detector module includes a frame, a module circuit board connected to the frame, detector units that each include radiation sensors disposed above the frame and electrically connected to the module circuit board, and an optically and infrared radiation opaque, X-ray transparent, electrically insulating detector shield covering a top surface and at least one side surface of the radiation sensors.