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1.
公开(公告)号:US20230293131A1
公开(公告)日:2023-09-21
申请号:US18177460
申请日:2023-03-02
Applicant: REDLEN TECHNOLOGIES, INC.
Inventor: Glenn BINDLEY , Krzysztof INIEWSKI
IPC: A61B6/00 , G06V10/762
CPC classification number: A61B6/505 , A61B6/4241 , A61B6/5205 , G06V10/762
Abstract: A method for determining bone mass density (BMD) of a patient includes obtaining X-ray scan data of a region of interest (ROI) of the patient using an energy discriminating photon counting radiation detector, and calculating the bone mass density (BMD) of the region of interest of the patient based on detected X-ray photon counts within three or more energy bins.
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公开(公告)号:US20200150297A1
公开(公告)日:2020-05-14
申请号:US16185963
申请日:2018-11-09
Applicant: REDLEN TECHNOLOGIES, INC.
Inventor: Krzysztof INIEWSKI , Conny HANSSON , Robert CRESTANI , Glenn BINDLEY
Abstract: Various aspects include methods of compensating for issues caused by charge sharing between pixels in pixel radiation detectors. Various aspects may include measuring radiation energy spectra with circuitry capable of registering detection events occurring simultaneous or coincident in two or more pixels, adjusting energy measurements of simultaneous-multi-pixel detection events by a charge sharing correction factor, and determining a corrected energy spectrum by adding the adjusted energy measurements of simultaneous-multi-pixel detection events to energy spectra of detection events occurring in single pixels. Adjusting energy measurements of simultaneous-multi-pixel detection events may include multiplying measured energies of simultaneous-multi-pixel detection events by a factor of one plus the charge sharing correction factor.
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公开(公告)号:US20190339402A1
公开(公告)日:2019-11-07
申请号:US15972717
申请日:2018-05-07
Applicant: REDLEN TECHNOLOGIES, INC.
Inventor: Robert CRESTANI , Christopher READ , Michael AYUKAWA , Glenn BINDLEY , Kris INIEWSKI
Abstract: A radiation detector unit includes an interposer, at least one radiation sensor bonded to a front side of an interposer, an application-specific integrated chip (ASIC) bonded to a backside of the interposer, a carrier board bonded to the backside of the interposer and located on a backside of the ASIC, and at least one flex cable assembly attached to a respective side of the carrier board.
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公开(公告)号:US20210063589A1
公开(公告)日:2021-03-04
申请号:US16998676
申请日:2020-08-20
Applicant: REDLEN TECHNOLOGIES, INC.
Inventor: Krzysztof INIEWSKI , Saeid TAHERION , Conny HANSSON , Robert CRESTANI , Glenn BINDLEY
Abstract: Various aspects include methods of compensating for issues caused by charge sharing between pixels in pixel radiation detectors. Various aspects may include measuring radiation energy spectra with circuitry capable of registering detection events occurring simultaneous or coincident in two or more pixels, adjusting energy measurements of simultaneous-multi-pixel detection events by a charge sharing correction factor, and determining a corrected energy spectrum by adding the adjusted energy measurements of simultaneous-multi-pixel detection events to energy spectra of detection events occurring in single pixels. Adjusting energy measurements of simultaneous-multi-pixel detection events may include multiplying measured energies of simultaneous-multi-pixel detection events by a factor of one plus the charge sharing correction factor.
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公开(公告)号:US20200367839A1
公开(公告)日:2020-11-26
申请号:US16875133
申请日:2020-05-15
Applicant: REDLEN TECHNOLOGIES, INC.
Inventor: Krzysztof INIEWSKI , Saeid TAHERION , Glenn BINDLEY
IPC: A61B6/03 , G01N23/20066 , G01N23/046 , A61B6/00 , G01T1/164
Abstract: Various aspects include methods compensating for Compton scattering effects in pixel radiation detectors. Various aspects may include determining whether gamma ray detection events occurred in two or more detector pixels within an event frame, determining whether the detection events occurred in detector pixels within a threshold distance of each other in response to determining that detection events occurred in two or more detector pixels within the event frame, and recording the two or more detection events as a single detection event having an energy equal to the sum of the measured energies of the two or more detection events located in the detector pixel having a highest measured energy in response to determining that the detection events occurred in detector pixels within the threshold distance of each other.
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公开(公告)号:US20240377544A1
公开(公告)日:2024-11-14
申请号:US18612288
申请日:2024-03-21
Applicant: REDLEN TECHNOLOGIES, INC.
Inventor: Glenn BINDLEY , Krzysztof INIEWSKI , Michael AYUKAWA
Abstract: Direct attach radiation detector structures include an application specific integrated circuit (ASIC) including an array of unit cells including signal processing channel circuitry and at least one radiation sensor including an array of pixel detectors located over a front surface of the ASIC. In various embodiments, an ASIC having a fixed layout of unit cells may accommodate different radiation sensors having varying layouts of pixel detectors. In some embodiments, a redistribution layer on the front surface of the ASIC may route detection signals from pixel detectors to the corresponding unit cells. Alternatively, or in addition, a subset of the unit cells of the ASIC may be active unit cells that are electrically coupled to a pixel detector. The remaining unit cells may be inactive unit cells that may be powered down.
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7.
公开(公告)号:US20230243985A1
公开(公告)日:2023-08-03
申请号:US18158695
申请日:2023-01-24
Applicant: REDLEN TECHNOLOGIES, INC.
Inventor: Glenn BINDLEY , Krzysztof INIEWSKI , Michael AYUKAWA , James FUJIMOTO
IPC: G01T1/24 , G01N23/046 , G01N23/083
CPC classification number: G01T1/247 , G01N23/046 , G01N23/083 , G01N2223/401 , G01N2223/04 , G01N2223/419 , G01N2223/50
Abstract: A radiation detector unit includes a read-out integrated circuit (ROIC) including a plurality of core circuit blocks located on a continuous uninterrupted substrate adjacent to one another along a first direction, and a plurality of radiation sensors bonded to a front side surface of the ROIC, where each radiation sensor of the plurality of radiation sensors is bonded to a respective core circuit block of the plurality of core circuit blocks of the ROIC. Additional embodiments include detector modules and detector arrays formed by assembling the detector units, and methods of operating and manufacturing the same.
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8.
公开(公告)号:US20170322319A1
公开(公告)日:2017-11-09
申请号:US15144861
申请日:2016-05-03
Applicant: REDLEN TECHNOLOGIES, INC.
Inventor: Kris INIEWSKI , Glenn BINDLEY
Abstract: Various embodiments described herein may include a detector array for a CT imaging system. The detector array includes a pixel array in which each pair of adjacent pixels in the pixel array may be separated by a collimator (e.g., located between each row and column of the pixel array) that absorbs photons and each pixel in the pixel array includes a sub-pixel array. The collimator absorbs photons that strike at a boundary between adjacent pixels. Each sub-pixel may have an anode that is connected to an ASIC channel When a sub-pixel in a pixel detects a photon, signals of a plurality of sub-pixels in the pixel are automatically summed, including the sub-pixel that detected the photon.
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