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    ANTENNAS MOUNTED UNDER DIELECTRIC PLATES
    12.
    发明申请
    ANTENNAS MOUNTED UNDER DIELECTRIC PLATES 有权
    天线安装在电介质板下

    公开(公告)号：US20120050114A1

    公开(公告)日：2012-03-01

    申请号：US12870766

    申请日：2010-08-27

    申请人： Qingxiang Li ,  Robert W. Schlub ,  Fletcher R. Rothkopf ,  Adam D. Mittleman ,  Yi Jiang ,  Emily McMilin ,  Lijun Zhang

    发明人： Qingxiang Li ,  Robert W. Schlub ,  Fletcher R. Rothkopf ,  Adam D. Mittleman ,  Yi Jiang ,  Emily McMilin ,  Lijun Zhang

    IPC分类号： H01Q1/24

    CPC分类号： H01Q1/38 ,  H01Q1/2266 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/44 ,  H01Q1/48 ,  H01Q9/0421 ,  H01Q9/42 ,  H01Q13/10

    摘要： Electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include antennas such as inverted-F antennas that contain antenna resonating elements and antenna ground elements. Antenna resonating elements may be formed from patterned conductive traces on substrates such as flex circuit substrates. Antenna ground elements may be formed from conductive device structures such as metal housing walls. Support and biasing structures such as dielectric support members and layer of foam may be used to support and bias antenna resonating elements against planar device structures. The planar device structures against which the antenna resonating elements are biased may be planar dielectric members such as transparent layers of display cover glass or other planar structures. Adhesive may be interposed between the planar structures and the antenna resonating elements.

    摘要翻译： 提供包含无线通信电路的电子设备。 无线通信电路可以包括射频收发器电路和天线结构。 天线结构可以包括天线，例如包含天线谐振元件和天线接地元件的倒F天线。 天线谐振元件可以由诸如柔性电路基板的基板上的图案化导电迹线形成。 天线接地元件可以由诸如金属外壳壁的导电器件结构形成。 诸如电介质支撑构件和泡沫层的支撑和偏置结构可用于支撑和偏置天线谐振元件抵抗平面装置结构。 天线谐振元件被偏压的平面器件结构可以是诸如显示器盖玻璃或其它平面结构的透明层的平面电介质构件。 粘合剂可以介于平面结构和天线谐振元件之间。

    CAVITY-BACKED ANTENNA FOR TABLET DEVICE
    13.
    发明申请
    CAVITY-BACKED ANTENNA FOR TABLET DEVICE 有权
    用于片材设备的CA-BACKED天线

    公开(公告)号：US20110050509A1

    公开(公告)日：2011-03-03

    申请号：US12553944

    申请日：2009-09-03

    申请人： Enrique Ayala Vazquez ,  Robert W. Schlub ,  Yi Jiang ,  Rodney Andres Gomez Angulo ,  Ruben Caballero ,  Qingxiang Li

    发明人： Enrique Ayala Vazquez ,  Robert W. Schlub ,  Yi Jiang ,  Rodney Andres Gomez Angulo ,  Ruben Caballero ,  Qingxiang Li

    IPC分类号： H01Q1/38 ,  H01Q1/24

    CPC分类号： H01Q1/2266 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q13/18

    摘要： An electronic device may have a cavity antenna. The cavity antenna may have a logo-shaped dielectric window. An antenna resonating element for the cavity antenna may be formed from conductive traces on a printed circuit board. An antenna resonating element may be formed from the traces. The antenna resonating element may be mounted on an antenna support structure. A conductive cavity structure for the cavity antenna may have a planar lip that is mounted flush with an interior surface of a conductive housing wall. The cavity structure may have more than one depth. Shallower planar portions of the cavity structure may lie in a plane. The antenna resonating element may be located between the plane of the shallow cavity walls and an external surface of the conductive housing wall.

    摘要翻译： 电子设备可以具有空腔天线。 空腔天线可以具有标志形状的电介质窗口。 用于空腔天线的天线谐振元件可以由印刷电路板上的导电迹线形成。 天线谐振元件可以由迹线形成。 天线谐振元件可以安装在天线支撑结构上。 用于空腔天线的导电腔结构可以具有与导电壳体壁的内表面齐平安装的平面唇缘。 空腔结构可以具有多于一个的深度。 空腔结构的较浅平面部分可以位于平面中。 天线谐振元件可以位于浅腔壁的平面和导电壳体壁的外表面之间。

    Laminated flex circuit layers for electronic device components
    15.
    发明授权
    Laminated flex circuit layers for electronic device components 有权
    用于电子器件部件的层压柔性电路层

    公开(公告)号：US08686297B2

    公开(公告)日：2014-04-01

    申请号：US13220230

    申请日：2011-08-29

    申请人： Boon W. Shiu ,  Yi Jiang ,  Chun-Lung Chen ,  Robert W. Schlub ,  Ruben Caballero

    发明人： Boon W. Shiu ,  Yi Jiang ,  Chun-Lung Chen ,  Robert W. Schlub ,  Ruben Caballero

    IPC分类号： H05K1/02

    CPC分类号： H01Q1/38 ,  H01Q1/243 ,  H01Q1/44 ,  H01Q5/364 ,  H05K1/028 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/09063 ,  H05K2201/10151 ,  H05K2203/041 ,  H05K2203/167 ,  Y10T156/1031

    摘要： An electronic device may have a housing in which an antenna and a proximity sensor formed from flex circuit structures are mounted. The flex circuit structures may include first and second flex circuit layers. The first and second flex circuit layers may include metal antenna structures and metal proximity sensor electrode structures. Solder may be used to attach electrical components to the flex circuit layers and may be used to electrically connect metal structures on the first and second flex circuit layers to each other. The first and second flex circuit layers may be laminated together using a compressive fixture. The compressive fixture may have a first fixture with a convex surface and a second fixture with a concave surface so that the laminated flex circuit layers are provided with a bend.

    摘要翻译： 电子设备可以具有外壳，其中安装由柔性电路结构形成的天线和接近传感器。 柔性电路结构可以包括第一和第二柔性电路层。 第一和第二柔性电路层可以包括金属天线结构和金属接近传感器电极结构。 可以使用焊料来将电气部件附接到柔性电路层，并且可以用于将第一和第二柔性电路层上的金属结构彼此电连接。 第一和第二柔性电路层可以使用压缩夹具层压在一起。 压缩固定装置可以具有带有凸面的第一固定装置和具有凹面的第二固定装置，使得层叠的柔性电路层设置有弯曲部。

    LAMINATED FLEX CIRCUIT LAYERS FOR ELECTRONIC DEVICE COMPONENTS
    16.
    发明申请
    LAMINATED FLEX CIRCUIT LAYERS FOR ELECTRONIC DEVICE COMPONENTS 有权
    用于电子设备组件的层压柔性电路层

    公开(公告)号：US20130048347A1

    公开(公告)日：2013-02-28

    申请号：US13220230

    申请日：2011-08-29

    申请人： Boon W. Shiu ,  Yi Jiang ,  Chun-Lung Chen ,  Robert W. Schlub ,  Ruben Caballero

    发明人： Boon W. Shiu ,  Yi Jiang ,  Chun-Lung Chen ,  Robert W. Schlub ,  Ruben Caballero

    IPC分类号： H05K1/02 ,  B29C63/04 ,  B32B38/18

    CPC分类号： H01Q1/38 ,  H01Q1/243 ,  H01Q1/44 ,  H01Q5/364 ,  H05K1/028 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/09063 ,  H05K2201/10151 ,  H05K2203/041 ,  H05K2203/167 ,  Y10T156/1031

    摘要： An electronic device may have a housing in which an antenna and a proximity sensor formed from flex circuit structures are mounted. The flex circuit structures may include first and second flex circuit layers. The first and second flex circuit layers may include metal antenna structures and metal proximity sensor electrode structures. Solder may be used to attach electrical components to the flex circuit layers and may be used to electrically connect metal structures on the first and second flex circuit layers to each other. The first and second flex circuit layers may be laminated together using a compressive fixture. The compressive fixture may have a first fixture with a convex surface and a second fixture with a concave surface so that the laminated flex circuit layers are provided with a bend.

    摘要翻译： 电子设备可以具有外壳，其中安装由柔性电路结构形成的天线和接近传感器。 柔性电路结构可以包括第一和第二柔性电路层。 第一和第二柔性电路层可以包括金属天线结构和金属接近传感器电极结构。 可以使用焊料来将电气部件附接到柔性电路层，并且可以用于将第一和第二柔性电路层上的金属结构彼此电连接。 第一和第二柔性电路层可以使用压缩夹具层压在一起。 压缩固定装置可以具有带有凸面的第一固定装置和具有凹面的第二固定装置，使得层叠的柔性电路层设置有弯曲部。

    DIELECTRIC WINDOW ANTENNAS FOR ELECTRONIC DEVICES
    17.
    发明申请
    DIELECTRIC WINDOW ANTENNAS FOR ELECTRONIC DEVICES 有权
    电子设备用电子窗户天线

    公开(公告)号：US20100321253A1

    公开(公告)日：2010-12-23

    申请号：US12486496

    申请日：2009-06-17

    申请人： Enrique Ayala Vazquez ,  Gregory A. Springer ,  Bing Chiang ,  Douglas B. Kough ,  Robert W. Schlub ,  Yi Jiang ,  Rodney Andres Gomez Angulo ,  Ruben Caballero

    发明人： Enrique Ayala Vazquez ,  Gregory A. Springer ,  Bing Chiang ,  Douglas B. Kough ,  Robert W. Schlub ,  Yi Jiang ,  Rodney Andres Gomez Angulo ,  Ruben Caballero

    IPC分类号： H01Q1/22

    CPC分类号： H01Q1/2258 ,  H01Q1/243 ,  H01Q1/42 ,  H01Q13/18

    摘要： Logo antennas are provided for electronic devices such as portable computers. An electronic device may have a housing with conductive housing walls. A logo antenna may be formed from an antenna resonating element such as a patch antenna resonating element, a monopole antenna resonating element, or other antenna resonating element structure. A conductive cavity may be placed behind the antenna resonating element. A dielectric antenna window that serves as a logo may be used to cover the antenna resonating element. The dielectric antenna window may be mounted in an opening in the conductive housing walls. A positive antenna feed terminal may be coupled to the antenna resonating element. A ground antenna feed terminal may be coupled to the cavity and portions of the conductive housing walls. The dielectric antenna window may be shaped in the form of a logo.

    摘要翻译： 为诸如便携式计算机之类的电子设备提供标识天线。 电子设备可以具有带有导电外壳壁的壳体。 标识天线可以由诸如贴片天线谐振元件，单极天线谐振元件或其它天线谐振元件结构的天线谐振元件形成。 导电腔可以放置在天线谐振元件的后面。 用作徽标的电介质天线窗可用于覆盖天线谐振元件。 电介质天线窗口可以安装在导电外壳壁中的开口中。 正天线馈电端子可以耦合到天线谐振元件。 接地天线馈电端子可以耦合到空腔和导电壳体壁的部分。 电介质天线窗口可以以标志的形式成形。

    Dielectric window antennas for electronic devices
    20.
    发明授权
    Dielectric window antennas for electronic devices 有权
    用于电子设备的电介质天线

    公开(公告)号：US08325094B2

    公开(公告)日：2012-12-04

    申请号：US12486496

    申请日：2009-06-17

    申请人： Enrique Ayala Vazquez ,  Gregory A. Springer ,  Bing Chiang ,  Douglas B. Kough ,  Robert W. Schlub ,  Yi Jiang ,  Rodney Andres Gomez Angulo ,  Ruben Caballero

    发明人： Enrique Ayala Vazquez ,  Gregory A. Springer ,  Bing Chiang ,  Douglas B. Kough ,  Robert W. Schlub ,  Yi Jiang ,  Rodney Andres Gomez Angulo ,  Ruben Caballero

    IPC分类号： H01Q1/24

    CPC分类号： H01Q1/2258 ,  H01Q1/243 ,  H01Q1/42 ,  H01Q13/18

    摘要： Logo antennas are provided for electronic devices such as portable computers. An electronic device may have a housing with conductive housing walls. A logo antenna may be formed from an antenna resonating element such as a patch antenna resonating element, a monopole antenna resonating element, or other antenna resonating element structure. A conductive cavity may be placed behind the antenna resonating element. A dielectric antenna window that serves as a logo may be used to cover the antenna resonating element. The dielectric antenna window may be mounted in an opening in the conductive housing walls. A positive antenna feed terminal may be coupled to the antenna resonating element. A ground antenna feed terminal may be coupled to the cavity and portions of the conductive housing walls. The dielectric antenna window may be shaped in the form of a logo.

    摘要翻译： 为诸如便携式计算机之类的电子设备提供标识天线。 电子设备可以具有带有导电外壳壁的壳体。 标识天线可以由诸如贴片天线谐振元件，单极天线谐振元件或其它天线谐振元件结构的天线谐振元件形成。 导电腔可以放置在天线谐振元件的后面。 用作徽标的电介质天线窗可用于覆盖天线谐振元件。 电介质天线窗口可以安装在导电外壳壁中的开口中。 正天线馈电端子可以耦合到天线谐振元件。 接地天线馈电端子可以耦合到空腔和导电壳体壁的部分。 电介质天线窗口可以以标志的形式成形。