摘要:
A system and method for simulating LCM mold filling utilizes at least one processor, suitable RAM and storage memory, input means, display means, and logic for simulating the injection of resin into a mold cavity containing a preform based upon mold cavity design parameters, mold filling processing parameters, physical property parameters, and system processing parameters, and identifying the current state of selected mold filling conditions at selected points in time during the simulated mold filling process. The system includes logic for identifying incipient dry spots, and also preferably includes means for interrupting the operation of the program at selected points to vary selected parameters to eliminate incipient dry spots and otherwise maximize the mold filling process. The system may additionally include logic for determining whether the output from a mold filling simulation satisfies a set of predefined criteria to determine whether a particular mold design and/or filling process is acceptable for use in production and, if so, record the approved mold filling process parameters for transfer and input to an RTM mold control. Alternatively, the system may be incorporated into a conventional mold control for direct input of developed mold filling process parameters into the control for use in operating the mold to produce liquid composite plastic parts.
摘要:
A method for preparing exfoliated clay nanocomposites by in-situ polymerization comprising the steps of (a) providing a mixture of at least one type of monomer and at least one type of organophilic clay; and (b) initiating an in-situ polymerization reaction in the mixture so as to cause the at least one type of monomer to polymerize thereby forming the exfoliated clay nanocomposite. The exfoliated clay nanocomposite produces an x-ray diffraction pattern that is substantially devoid of an intercalation peak. The exfoliated clay nanocomposite may then be used as a masterbatch.
摘要:
A new resin gas-assisted injection technique, which can achieve both bonding and surface modification of microfluidic devices. A sealing resin is injected with a surface modification agent into the microfluidic platform to fill the micron and submicron sized channels and reservoirs, as well as the gap between the platform and the lid. A gas (e.g., air or nitrogen) is then injected to replace most of the resin inside the channels and reservoirs. The remaining resin is cured (fully or partially) by ultraviolet light. By applying a masking technique, local modification of the channel surface can also be achieved through this method. Also provided are methods and structures related to micro-fluidic devices.