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公开(公告)号:US11276526B2
公开(公告)日:2022-03-15
申请号:US16521301
申请日:2019-07-24
发明人: So Ra Kang , Byeong Gyu Park , Jae Yeol Choi , Yong Jin Yun , Jung Min Park
摘要: A multilayer capacitor includes a body, a plurality of internal electrodes, and external electrodes. The corners of the cover portions of the body include curved surfaces, a length of each of internal electrodes disposed in the cover portions among the plurality of internal electrodes is smaller than a length of an internal electrode disposed in a central portion, and when a distance from a surface of the body to a closest internal electrode among the plurality of internal electrodes is defined as a margin, a portion of the margin region, located directly above or below the internal electrodes disposed in the cover portions in the stacking direction, includes at least two layers including different densities of dielectric layers.
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公开(公告)号:US11217394B2
公开(公告)日:2022-01-04
申请号:US16522126
申请日:2019-07-25
发明人: Byeong Gyu Park , So Ra Kang , Yong Jin Yun , Jea Yeol Choi , Jung Min Park
摘要: A multilayer capacitor includes a body, a plurality of internal electrodes and external electrodes disposed on external surfaces of the body and electrically connected to the internal electrodes, wherein in the body, corners of cover portions include curved surfaces, and 10 μm≤R≤T/4 in which R is a radius of curvature of the curved surface corners and T is a thickness of the body, and when a distance from a surface of the body to an internal electrode closest to the surface of the body among the plurality of internal electrodes is a margin, a margin (δ) of each of the corners formed as the curved surfaces in the cover portions is greater than or equal to a margin (Wg) of the body in a width direction.
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公开(公告)号:US11145463B2
公开(公告)日:2021-10-12
申请号:US16525981
申请日:2019-07-30
发明人: Byeong Gyu Park , Yong Jin Yun , So Ra Kang , Jung Min Park , Jea Yeol Choi
摘要: A multilayer capacitor includes a body, a plurality of internal electrodes, and an external electrode. A cover portion of the body has curved corners, and a radius of curvature, R, of each of the curved corners and a thickness, T, of the body satisfy a condition of 10 μm≤R≤T/3, and a width, W, and a thickness, T, of the body satisfy a condition of T/W
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公开(公告)号:US11094469B2
公开(公告)日:2021-08-17
申请号:US16529527
申请日:2019-08-01
发明人: Yong Jin Yun , Byeong Gyu Park , So Ra Kang , Jung Min Park , Jea Yeol Choi
摘要: A multilayer capacitor includes a body including a stacked structure of a plurality of dielectric layers and a plurality of internal electrodes, wherein, in the body, corners of cover portions are formed as curved surfaces, and 10 μm≤R≤T/4 in which R is a radius of curvature of the curved surface corners and T is a thickness of the body, and 0.8≤Tg/Wg≤1.2 in which Wg is a margin of the body in a width direction, and Tg is a margin of the body in a thickness direction.
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公开(公告)号:US20200075259A1
公开(公告)日:2020-03-05
申请号:US16525981
申请日:2019-07-30
发明人: Byeong Gyu Park , Yong Jin Yun , So Ra Kang , Jung Min Park , Jea Yeol Choi
摘要: A multilayer capacitor includes a body, a plurality of internal electrodes, and an external electrode. A cover portion of the body has curved corners, and a radius of curvature, R, of each of the curved corners and a thickness, T, of the body satisfy a condition of 10 μm≤R≤T/3, and a width, W, and a thickness, T, of the body satisfy a condition of T/W
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公开(公告)号:US20130162382A1
公开(公告)日:2013-06-27
申请号:US13725478
申请日:2012-12-21
发明人: Hye Yeon Cha , Kang Heon Hur , Sung Jin Park , Dong Jin Jeong , Jung Min Park , Hyeog Soo Shin , Sung Yong An , Hwan Soo Lee , Young Do KWEON , Jin Woo Hahn
CPC分类号: H01F27/29 , H01F5/00 , H01F17/0033 , H01F27/292 , H01F41/041 , H01F41/046 , Y10T29/4902
摘要: The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.
摘要翻译: 芯片电感器技术领域本发明涉及一种芯片电感器,包括:金属 - 聚合物复合体,其中金属颗粒和聚合物混合; 设置在金属 - 聚合物复合材料内部以形成线圈的布线图案; 设置在所述金属 - 聚合物复合材料的外周表面的一部分中的外部电极; 以及设置在金属 - 聚合物复合物和布线图案之间以及金属 - 聚合物复合材料和外部电极之间的绝缘部分及其制造方法。
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