专利检索 ap:("SAMSUNG ELECTRO-MECHANICS CO., LTD.") AND inv:"Moon Il KIM" 第 2 页

11.

发明申请
PRINTED CIRCUIT BOARD HAVING EMBEDDED CAPACITOR AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：具有嵌入式电容器的印刷电路板及其制造方法

公开(公告)号：US20130170154A1

公开(公告)日：2013-07-04

申请号：US13734546

申请日：2013-01-04

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Doo Hwan LEE , Jong In RYU , Jin Won LEE , Moon Il KIM

IPC分类号： H05K3/32 , H05K1/16

CPC分类号： H05K3/32 , H05K1/162 , H05K1/185 , H05K3/4602 , H05K2201/10636 , H05K2203/0191 , H05K2203/1469 , Y02P70/611 , Y10T29/4913

摘要： Provided is a printed circuit board having an embedded capacitor including at least one sheet-shaped capacitor, an insulating material configured to cover the sheet-shaped capacitor, and a capacitor device mounted in the insulating material to be parallelly disposed at one side of the sheet-shaped capacitor, improving reliability of the substrate.

摘要翻译： 提供了一种印刷电路板，其具有包括至少一个片状电容器的嵌入式电容器，被配置为覆盖片状电容器的绝缘材料以及安装在绝缘材料中以平行布置在片材的一侧的电容器装置形电容器，提高了基板的可靠性。