中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

15 records (took 0.021 seconds)

    PRINTED CIRCUIT BOARD
    1.
    发明申请
    PRINTED CIRCUIT BOARD 有权

    公开(公告)号：US20210410285A1

    公开(公告)日：2021-12-30

    申请号：US17215916

    申请日：2021-03-29

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seung Eun LEE ,  Jae Woong CHOI ,  Joo Hwan JUNG ,  Yong Hoon KIM ,  Jin Won LEE

    IPC: H05K1/11 ,  H05K1/18

    Abstract: A printed circuit board includes a first insulating layer, a second insulating layer disposed on a lower surface of the first insulating layer, an electronic component embedded in the second insulating layer and at least partially in contact with the first insulating layer, a first wiring layer disposed on an upper surface of the first insulating layer, a second wiring layer disposed on a lower surface of the second insulating layer, and a first wiring via penetrating through the first and second insulating layers and connecting at least portions of the first and second wiring layers to each other.

    SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN
    3.
    发明申请
    SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN 有权

    公开(公告)号：US20210193580A1

    公开(公告)日：2021-06-24

    申请号：US16817807

    申请日：2020-03-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dae Jung BYUN ,  Chang Hwa PARK ,  Sang Ho JEONG ,  Ki Ho NA ,  Je Sang PARK ,  Yong Duk LEE ,  Jin Won LEE

    IPC: H01L23/538 ,  H01L23/64

    Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.

    PRINTED CIRCUIT BOARD
    7.
    发明申请
    PRINTED CIRCUIT BOARD 有权

    公开(公告)号：US20220095449A1

    公开(公告)日：2022-03-24

    申请号：US17124893

    申请日：2020-12-17

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dae Jung BYUN ,  Jung Soo KIM ,  Sang Hyun SIM ,  Chang Min HA ,  Tae Hong MIN ,  Jin Won LEE

    IPC: H05K1/02

    Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

    SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN
    9.
    发明申请
    SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN 有权

    公开(公告)号：US20220130766A1

    公开(公告)日：2022-04-28

    申请号：US17569703

    申请日：2022-01-06

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dae Jung BYUN ,  Chang Hwa PARK ,  Sang Ho JEONG ,  Ki Ho NA ,  Je Sang PARK ,  Yong Duk LEE ,  Jin Won LEE

    IPC: H01L23/538 ,  H01L23/64

    Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.

Patent Agency Ranking