公开(公告)号：US20180061553A1

公开(公告)日：2018-03-01

申请号：US15629259

申请日：2017-06-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Jin JEON ,  Je Ik MOON ,  Jung Wook SEO ,  Young Seuck YOO ,  Seon Woo OH ,  Woo Jin LEE

IPC: H01F27/28 ,  H01F27/255 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/255 ,  H01F27/292 ,  H01F2017/048

Abstract: A chip electronic component includes a body including a coil portion disposed therein and a magnetic metallic powder, and a stress buffer layer disposed on a surface of the body. A Young's modulus of the stress buffer layer is less than that of the body.