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    INDUCTOR
    2.
    发明申请
    INDUCTOR 审中-公开

    公开(公告)号：US20190122810A1

    公开(公告)日：2019-04-25

    申请号：US16031216

    申请日：2018-07-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seon Woo OH ,  Hyung Jin JEON ,  Jung Wook SEO ,  Young Seuck YOO ,  Byoung Hwa LEE ,  Kwang Sun CHOI ,  Kun Ho KOO

    IPC: H01F27/29 ,  H01F27/32 ,  H01F27/06

    Abstract: An inductor includes a body including an internal coil having first and second end portions and an encapsulant encapsulating the internal coil and containing magnetic particles. First and second external electrodes are on external surfaces of the body and electrically connected to the internal coil. A first metal expansion portion encloses the first end portion while coming into direct contact with the first end portion of the internal coil, and may be between the body and the first external electrode. A second metal expansion portion encloses the second end portion while coming into direct contact with the second end portion of the internal coil, and may be between the body and the second external electrode.

    PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
    4.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20150000958A1

    公开(公告)日：2015-01-01

    申请号：US14074338

    申请日：2013-11-07

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Kyoung Moo HARR ,  Hyung Jin JEON ,  Jin Gu KIM ,  Young Jae LEE ,  Young Do KWEON ,  Chang Bae LEE

    IPC: H05K1/02 ,  H05K3/46 ,  H05K3/00

    CPC classification number: H05K3/4647 ,  H05K2201/09827

    Abstract: The present invention discloses a printed circuit board including a lower wiring layer, an insulating layer which buries the lower wiring layer, and an upper wiring layer formed on the insulating layer to improve reliability of interlayer electrical connection between the wiring layers, wherein the interlayer connection between the upper wiring layer and the lower wiring layer is performed by a via electrode which is provided between the upper wiring layer and the lower wiring layer and has an upper surface bonded to the upper wiring layer and a lower surface bonded to the lower wiring layer, wherein the lower surface of the via electrode is larger than the upper surface thereof.

    Abstract translation: 本发明公开了一种印刷电路板，包括下布线层，埋置下布线层的绝缘层和形成在绝缘层上的上布线层，以提高布线层之间的层间电连接的可靠性，其中层间连接 上布线层和下布线层之间的通孔电极通过设置在上布线层和下布线层之间的通孔电极进行，并且具有与上布线层接合的上表面和接合到下布线层的下表面 其中，所述通孔电极的下表面大于其上表面。

    COIL ELECTRONIC COMPONENT
    5.
    发明申请
    COIL ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210027933A1

    公开(公告)日：2021-01-28

    申请号：US16834250

    申请日：2020-03-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyung Jin JEON ,  Soon Kwang KWON

    IPC: H01F27/28 ,  H01F27/32 ,  H01F27/29

    Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, at least one metal thin plate disposed on an upper portion of the coil pattern and having a shape bent toward the core region, an encapsulant sealing at least a portion of the support substrate, the coil pattern, and the at least one metal thin plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.

    ANTENNA DEVICE AND NEAR FIELD COMMUNICATION DEVICE INCLUDING THE SAME
    6.
    发明申请
    ANTENNA DEVICE AND NEAR FIELD COMMUNICATION DEVICE INCLUDING THE SAME 审中-公开
    天线装置和包括其的近场通信装置

    公开(公告)号：US20160149305A1

    公开(公告)日：2016-05-26

    申请号：US14859199

    申请日：2015-09-18

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyung Jin JEON ,  Jung Wook SEO

    IPC: H01Q7/06 ,  H01Q1/48

    CPC classification number: H01Q7/06

    Abstract: An antenna device may include a substrate, a first coil formed on the substrate, a second coil formed on the substrate and formed outside of the first coil, and a magnetic sheet interposed between the substrate and the first coil. Whereby, the second coil formed around the first coil removes electromotive force formed by a magnetic field passing through the outside of the first coil such that a communication distance and communication strength may be improved.

    Abstract translation: 天线装置可以包括基板，形成在基板上的第一线圈，形成在基板上并形成在第一线圈外侧的第二线圈，以及介于基板和第一线圈之间的磁性薄板。 由此，围绕第一线圈形成的第二线圈消除由穿过第一线圈的外部的磁场形成的电动势，从而可以提高通信距离和通信强度。

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