公开(公告)号：US11367558B2

公开(公告)日：2022-06-21

申请号：US16668504

申请日：2019-10-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Se Hyung Lee ,  Je Ik Moon ,  Jung Wook Seo ,  Jun Sung Lee ,  Woo Jin Lee ,  Kang Ryong Choi ,  Il Jin Park ,  Gwang Hwan Hwang

IPC: H01F27/28 ,  H01F27/255 ,  H01F1/26 ,  H01F1/33 ,  H01F17/00 ,  H01F17/04 ,  H01F27/29

Abstract: A magnetic composition includes first, second, and third magnetic metal particles. The first magnetic metal particles have an average particle size of 10 μm to 28 μm; the second magnetic metal particles have an average particle size of 1 μm to 4.5 μm; and the third magnetic metal particles include insulating layers disposed on surfaces thereof and have a particle size of 300 nm or less. Therefore, eddy current loss of an inductor having a body formed of the magnetic composition may be improved, and high efficiency and inductance of the inductor may be secured.

公开(公告)号：US10902988B2

公开(公告)日：2021-01-26

申请号：US15146470

申请日：2016-05-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Woon Chul Choi ,  Jung Hyuk Jung ,  Woo Jin Lee ,  Han Wool Ryu

IPC: H01F5/00 ,  H01F17/00 ,  H01F17/04 ,  H01F27/29 ,  H01F41/04

Abstract: A coil electronic component includes a magnetic body that includes a substrate and a coil part. The coil part includes patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. The plating layer may be formed in a single plating operation, and may have a thickness of 200 μm or more.

公开(公告)号：US20130186679A1

公开(公告)日：2013-07-25

申请号：US13735813

申请日：2013-01-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Uk Lee ,  Woo Jin Lee ,  Dong Hwan Lee

IPC: H05K3/40 ,  H05K1/11

CPC classification number: H05K3/4038 ,  H05K1/115 ,  H05K3/403

Abstract: The multilayer wiring structure includes: a substrate; a connection hole formed to pass through one surface and another surface of the substrate; and electrode wirings formed on the substrate, wherein the electrode wirings includes: a plurality of first wirings formed on one surface of the substrate; a plurality of second wirings formed on another surface of the substrate; and a plurality of connection wirings formed on an inner surface of the connection hole and electrically connecting the plurality of first wirings and the plurality of second wirings, respectively.

Abstract translation: 多层布线结构包括：基板; 形成为穿过基板的一个表面和另一个表面的连接孔; 以及形成在所述基板上的电极布线，其中所述电极布线包括：形成在所述基板的一个表面上的多个第一布线; 形成在所述基板的另一表面上的多个第二布线; 以及形成在所述连接孔的内表面上并分别电连接所述多个第一配线和所述多个第二配线的多个连接配线。