公开(公告)号：US20140116753A1

公开(公告)日：2014-05-01

申请号：US13745047

申请日：2013-01-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han Ul LEE ,  Yong Sam LEE ,  Suk Hwan AHN

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K1/09 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15192 ,  H05K1/0306 ,  H05K3/108 ,  H05K2201/0338 ,  H05K2203/1476

Abstract: There are provided a wiring board in which plating layers constituting wiring patterns are formed to have uniform thicknesses, and a method of manufacturing the wiring board. The wiring board includes an insulating layer; and wiring patterns formed on the insulating layer, wherein at least one of the wiring patterns is formed by stacking two or more plating layers.

Abstract translation: 提供一种布线板，其中构成布线图案的镀层形成为具有均匀的厚度，以及制造布线板的方法。 布线板包括绝缘层; 以及形成在所述绝缘层上的布线图案，其中，通过层叠两层以上的镀层来形成所述布线图案中的至少一个。