公开(公告)号：US12216560B2

公开(公告)日：2025-02-04

申请号：US18215599

申请日：2023-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungkeun Lee ,  Bumjun Kim ,  Seunghan Lee

IPC: G06F11/30 ,  G06F21/60

Abstract: Disclosed is a method of operating an electronic device which includes a host device and a storage device. The host device includes a processor and a baseboard management controller (BMC), the storage device includes a storage controller and a micro controller unit (MCU), and the BMC and the MCU support out-of-band communication. The method of operating the electronic device includes providing, by the BMC, a first request including information about environment data to the MCU through the out-of-band communication, and providing, by the MCU, a first response corresponding to the first request to the BMC through the out-of-band communication.

公开(公告)号：US20240259303A1

公开(公告)日：2024-08-01

申请号：US18352497

申请日：2023-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungsoo Kim ,  Hyunjoon Yoo ,  Bumjun Kim ,  Mehee Yun ,  Sang-Hwa Jin

IPC: H04L45/00 ,  H04L45/302 ,  H04L47/2425

CPC classification number: H04L45/38 ,  G06F13/4226 ,  H04L45/3065 ,  H04L47/2433 ,  G06F2213/0026

Abstract: A routing method that may be performed by a system on chip of a backplane that is connected between a plurality of hosts and a plurality of devices. The routing method may include: monitoring traffic of the plurality of devices; determining mode types of the plurality of devices according to the monitored traffic; and performing routing to allocate lanes between the plurality of devices and the backplane according to the mode types.

公开(公告)号：US11800686B2

公开(公告)日：2023-10-24

申请号：US17659766

申请日：2022-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchul Hur ,  Jaehong Park ,  Bumjun Kim ,  Yusuf Cinar ,  Hanhong Lee ,  Youngseok Hong ,  Doil Kong ,  Jaeheon Ma

IPC: H05K7/20 ,  G11B33/14 ,  H05K1/02

CPC classification number: H05K7/20436 ,  G11B33/1426 ,  H05K1/0201 ,  H05K1/0203 ,  H05K7/20163 ,  G11B33/142

Abstract: A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.