公开(公告)号：US20190233961A1

公开(公告)日：2019-08-01

申请号：US16176332

申请日：2018-10-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kenji TAKAI ,  Sang Eui LEE ,  Daiki MINAMI

IPC: C25D3/38 ,  C25D7/06 ,  H01B1/04 ,  H05K1/09 ,  H05K3/18

CPC classification number: C25D3/38 ,  C25D7/0607 ,  H01B1/04 ,  H05K1/028 ,  H05K1/092 ,  H05K3/188 ,  H05K2201/0323 ,  H05K2203/0723

Abstract: A plating solution including a metal salt, a hydrophilic fullerene, and water, a metal composite material including a hydrophilic fullerene and a method of manufacturing the same, and a wire, a flexible printed circuit (FPC), and an electronic device including the metal composite material.