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公开(公告)号：US20190382618A1
公开(公告)日：2019-12-19
申请号：US16421633
申请日：2019-05-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kenji TAKAI , Sang Eui LEE , Hiroshi MIYAZAKI
IPC: C09G1/02 , C01B32/156 , B24B37/04 , H01L21/321 , H01L21/768
Abstract: A method of preparing a hydroxyl fullerene dispersion including mixing fullerene, a dispersing agent, a first oxidizing agent, or a combination thereof, in water, crushing the fullerene to obtain pulverized fullerene and oxidizing the pulverized fullerene to obtain hydroxyl fullerene represented by Cx(OH)y, wherein, x is 60, 70, 74, 76 or 78 and y is 12 to 44, and to prepare the hydroxyl fullerene dispersion.
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公开(公告)号：US20170221599A1
公开(公告)日：2017-08-03
申请号：US15190909
申请日：2016-06-23
Applicant: SAMSUNG ELECTRONICS CO., LTD. , The Industry & Academic Cooperation in Chungnam National University
Inventor： Sang Eui LEE , Yeonggyu JEONG , Kyoung-Seok MOON , Hiesang SOHN , Taewon LEE , In Taek HAN
CPC classification number: H01B1/24 , B82Y30/00 , C08J5/005 , C08J2301/02 , H01B1/22 , Y10S977/752 , Y10S977/762 , Y10S977/783 , Y10S977/932
Abstract: A conductive composite including: a polymer matrix including a microcellulose fiber; and at least two conductive nanomaterials dispersed in the polymer matrix, wherein the conductive nanomaterial includes a metal nanowire, wherein the at least two of the conductive nanomaterials provide an assembled layer surrounding a surface of the microcellulose fiber.
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公开(公告)号：US20210222311A1
公开(公告)日：2021-07-22
申请号：US17222287
申请日：2021-04-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kenji TAKAI , Sang Eui LEE , Daiki MINAMI
Abstract: A plating solution including a metal salt, a hydrophilic fullerene, and water, a metal composite material including a hydrophilic fullerene and a method of manufacturing the same, and a wire, a flexible printed circuit (FPC), and an electronic device including the metal composite material.
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4.发明申请公开(公告)号：US20170278603A1
公开(公告)日：2017-09-28
申请号：US15338649
申请日：2016-10-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyoung-Seok MOON , Sang Eui LEE , Young Min KANG , Dong Hun KIM , Min Seok KIM , Hiesang SOHN , In Taek HAN
CPC classification number: H01F1/0551 , C04B35/2633 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3217 , C04B2235/3232 , C04B2235/3244 , C04B2235/3262 , C04B2235/3275 , C04B2235/3279 , C04B2235/3281 , C04B2235/3284 , C04B2235/81 , H01F1/348 , H01F1/37 , H01F41/0246 , H01F41/0253 , H01Q17/00 , H01Q17/004
Abstract: A magnetic composite includes a polymeric substrate and a magnetic material including a Z-type phase and represented by the following Chemical Formula: Ba1.5-xSr1.5-xCa2xM2Fe24O41 Chemical Formula wherein, in the Chemical Formula, M is at least one selected from Co, Ni, Cu, Mg, Mn, Ti, Al, Zn, and Zr, and 0≦x
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5.发明申请COMPOSITIONS FOR PREPARING ELECTRICALLY CONDUCTIVE COMPOSITES, COMPOSITES PREPARED THEREFROM, AND ELECTRONIC DEVICES INCLUDING THE SAME 审中-公开用于制备电导电复合材料的组合物，其制备的复合材料和包括其的电子器件公开(公告)号：US20160293290A1
公开(公告)日：2016-10-06
申请号：US15047790
申请日：2016-02-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Soichiro MIZUSAKI , Sang Eui LEE , Won Suk CHANG , In Taek HAN
IPC: H01B1/24
CPC classification number: H01B1/24 , B82Y30/00 , Y10S977/752 , Y10S977/932
Abstract: A composition for preparing an electrically conductive composite includes, based on the total weight of the composition: about 37 weight percent to about 84 weight percent of an epoxy; about 0.001 weight percent to about 22 weight percent of an electrically conductive filler; and about 15 weight percent to about 45 weight percent of a thermoplastic resin, wherein the thermoplastic resin is a liquid at about 25° C., is miscible with the epoxy, and forms a domain upon heat curing that is phase-separated from the epoxy and the electrically conductive inorganic filler. Also composites prepared therefrom and an electronic device including the same.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20150070932A1
公开(公告)日：2015-03-12
申请号：US14445678
申请日：2014-07-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dong Earn KIM , Jeong Hee LEE , Eun Joo JANG , Min Jong BAE , Sang Eui LEE
IPC: F21V8/00
CPC classification number: G02B6/0028 , B82Y20/00 , G02B6/0023 , G02B6/0068 , Y10S977/774 , Y10S977/95
Abstract: A light source unit includes: a light guiding plate having a front surface and a rear surface facing each other, and a side surface between the front surface and the rear surface; a light guiding bar disposed on the side surface of the light guiding plate; a quantum dot package disposed on a surface of the light guiding bar; and a dot light source which provides light to the quantum dot package.
Abstract translation: 光源单元包括：具有彼此面对的前表面和后表面的导光板，以及前表面和后表面之间的侧表面; 设置在所述导光板的侧面的导光杆; 设置在所述导光杆的表面上的量子点封装; 以及向量子点封装提供光的点光源。
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7.发明申请公开(公告)号：US20200024482A1
公开(公告)日：2020-01-23
申请号：US16421568
申请日：2019-05-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kenji TAKAI , Sang Eui LEE , Ken KOKUBO , Eigo MIYAZAKI , Do Yoon KIM
IPC: C09G1/02 , H01L21/321
Abstract: A polishing slurry including a composite including a hydrophilic fullerene and an ionic compound, a method of manufacturing the same, and a method of manufacturing a semiconductor device.
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公开(公告)号：US20190233961A1
公开(公告)日：2019-08-01
申请号：US16176332
申请日：2018-10-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kenji TAKAI , Sang Eui LEE , Daiki MINAMI
CPC classification number: C25D3/38 , C25D7/0607 , H01B1/04 , H05K1/028 , H05K1/092 , H05K3/188 , H05K2201/0323 , H05K2203/0723
Abstract: A plating solution including a metal salt, a hydrophilic fullerene, and water, a metal composite material including a hydrophilic fullerene and a method of manufacturing the same, and a wire, a flexible printed circuit (FPC), and an electronic device including the metal composite material.
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公开(公告)号：US20170306222A1
公开(公告)日：2017-10-26
申请号：US15644984
申请日：2017-07-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jeong Hee LEE , Hyun A KANG , Eun Joo JANG , Sang Eui LEE , Shin Ae JUN , Oul CHO , Tae Gon KIM , Tae Hyung KIM
CPC classification number: C09K11/025 , B24B1/00 , C01B17/20 , C08L33/04 , C09K11/59 , G02F1/1335 , G02F1/3615
Abstract: A method of grinding a semiconductor nanocrystal-polymer composite, the method including obtaining a semiconductor nanocrystal-polymer composite including a semiconductor nanocrystal and a first polymer, contacting the semiconductor nanocrystal-polymer composite with an inert organic solvent; and grinding the semiconductor nanocrystal-polymer composite in the presence of the inert organic solvent to grind the semiconductor nanocrystal-polymer composite.
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10.发明申请公开(公告)号：US20170092388A1
公开(公告)日：2017-03-30
申请号：US15273898
申请日：2016-09-23
Applicant: SAMSUNG ELECTRONICS CO., LTD. , The Industry & Academic Cooperation in Chungnam National University , KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY
Inventor： Sang Eui LEE , Yeonggyu JEONG , Taewon LEE , Mi Jeong HAN , In Taek HAN
Abstract: An electrically conductive composite including: a polymer matrix including a cellulose, and a plurality of electrically conductive carbon nanoparticles dispersed in the polymer matrix, wherein the electrically conductive carbon nanoparticles have a multiple hydrogen bonding moiety covalently bound to a surface thereof.
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