公开(公告)号：US12013481B2

公开(公告)日：2024-06-18

申请号：US18161487

申请日：2023-01-30

Applicant: INTEL CORPORATION

Inventor： Arnaud Lucres Amadjikpe ,  Tae Young Yang ,  Ofer Markish

IPC: H01Q1/32 ,  G01S7/02 ,  G01S7/03 ,  H01Q1/36 ,  H01Q1/52 ,  H04B7/04 ,  H04B7/0456 ,  H05K1/02 ,  H01Q1/42

CPC classification number: G01S7/03 ,  H04B7/046 ,  H05K1/0234 ,  H01Q1/3233 ,  H01Q1/42 ,  H05K2201/0323

Abstract: For example, an apparatus may include a Printed Circuit Board (PCB); a Multiple-Input-Multiple-Output (MIMO) radar antenna on the PCB, the MIMO radar antenna comprising a plurality of Transmit (Tx) antenna elements configured to transmit Tx radar signals, and a plurality of receive (Rx) antenna elements configured to receive Rx radar signals based on the Tx radar signals; and a surface wave mitigator connected to the PCB, the surface wave mitigator configured to mitigate an impact of surface waves via the PCB on a radiation pattern of the MIMO radar antenna.

公开(公告)号：US11864313B2

公开(公告)日：2024-01-02

申请号：US17368905

申请日：2021-07-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Atsushi Kishimoto ,  Masatoshi Kakue ,  Shuichi Kawata ,  Hiroshi Nishikawa

IPC: H05K1/02 ,  B32B3/26 ,  B32B9/00

CPC classification number: H05K1/0298 ,  B32B3/266 ,  B32B9/007 ,  H05K1/0207 ,  H05K1/0218 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2457/08 ,  H05K2201/0323 ,  H05K2201/0723

Abstract: A multilayer wiring substrate according to the present invention includes a dielectric base body, a signal line in or on the dielectric base body, a ground conductor in the dielectric base body, and a graphite sheet in the dielectric base body. The dielectric base body is a laminate including dielectric sheets stacked on top of each other. The ground conductor and the signal line face each other in a stacking direction of the dielectric sheets. The ground conductor overlaps the signal line when viewed in plan in the stacking direction. The graphite sheet and the signal line face each other in the stacking direction without the signal line being located between the graphite sheet and the ground conductor. An upper surface of the graphite sheet is coplanar with an upper surface of the ground conductor or is located below the upper surface of the ground conductor.

公开(公告)号：US11690173B2

公开(公告)日：2023-06-27

申请号：US17674837

申请日：2022-02-18

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Chin-Sheng Wang ,  Ra-Min Tain

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/023 ,  H05K1/181 ,  H05K1/185 ,  H05K1/032 ,  H05K1/036 ,  H05K1/092 ,  H05K1/113 ,  H05K2201/0323

Abstract: A circuit board structure includes a dielectric substrate, at least one embedded block, at least one electronic component, at least one first build-up circuit layer, and at least one second build-up circuit layer. The dielectric substrate includes a through cavity penetrating the dielectric substrate. The embedded block is fixed in the through cavity. The embedded block includes a first through hole and a second through hole. The electronic component is disposed in the through hole of the embedded block. The first build-up circuit layer is disposed on the top surface of the dielectric substrate and covers the embedded block. The second build-up circuit layer is disposed on the bottom surface of the dielectric substrate and covers the embedded block.

公开(公告)号：US20190233668A1

公开(公告)日：2019-08-01

申请号：US16382895

申请日：2019-04-12

Applicant: CORNING INCORPORATED

Inventor： Tzu-Han Chen ,  Ruei-ming Huang ,  Yongsheng Yan

IPC: C09D11/324 ,  G06F1/16 ,  C09D11/102 ,  C09D11/36

CPC classification number: C09D11/324 ,  C08K3/04 ,  C08K5/06 ,  C08K2201/005 ,  C08K2201/011 ,  C09D7/68 ,  C09D11/102 ,  C09D11/36 ,  G06F1/16 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0323 ,  H05K2203/013

Abstract: A jet ink composition, a jet ink coating method and a resulting jet ink coated article are all predicated upon the jet ink composition which includes in addition to a particulate pigment material and a solvent composition a resin composition. The resin composition includes an uncured silicone resin, an uncured epoxy resin and an uncured melamine resin. Upon thermal cure the uncured resin composition forms a cured resin composition with superior adhesion to substrates such as but not limited to glass substrates, ceramic substrates and metal oxide substrates.

公开(公告)号：US10080286B2

公开(公告)日：2018-09-18

申请号：US13985363

申请日：2012-02-15

Applicant: Hiroyuki Waku

Inventor： Hiroyuki Waku

IPC: H05K1/11 ,  B29C70/88 ,  B64C3/20 ,  B64C3/26 ,  B64D45/02 ,  H05K13/00 ,  B64C3/18 ,  B29K307/04 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K1/115 ,  B29C70/882 ,  B29K2307/04 ,  B64C3/18 ,  B64C3/20 ,  B64C3/26 ,  B64D45/02 ,  H05K1/0366 ,  H05K3/4602 ,  H05K3/4632 ,  H05K13/00 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/10363 ,  Y02T50/43 ,  Y10T29/49117

Abstract: A spar includes a conductive layer laminated and formed on a carbon-fiber prepreg, and a jumper formed of a conductor which penetrates through the conductive layer and the carbon-fiber prepreg.

公开(公告)号：US20180263118A1

公开(公告)日：2018-09-13

申请号：US15978268

申请日：2018-05-14

Applicant: Compass Technology Company Limited

Inventor： Kelvin Po Leung Pun ,  Chee Wah Cheung

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/0041 ,  G06F3/041 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06K9/00013 ,  H01L29/1606 ,  H05K1/0278 ,  H05K1/0306 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/144 ,  H05K3/0064 ,  H05K3/025 ,  H05K3/027 ,  H05K3/381 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0323 ,  H05K2201/042 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/095 ,  H05K2203/1545

Abstract: A process for forming a graphene circuit pattern on an object is described. A graphene layer is grown on a metal foil. A bonding layer is formed on a protective film and a surface of the bonding layer is roughened. The graphene layer is transferred onto the roughened surface of the bonding layer. The protective film is removed and the bonding layer is laminated to a first core dielectric substrate. The metal foil is etched away. Thereafter the graphene layer is etched using oxygen plasma etching to form graphene circuits on the first core dielectric substrate. The first core dielectric substrate having graphene circuits thereon is bonded together with a second core dielectric substrate wherein the graphene circuits are on a side facing the second core dielectric substrate wherein an air gap is left there between.

公开(公告)号：US20180233250A1

公开(公告)日：2018-08-16

申请号：US15952705

申请日：2018-04-13

Applicant: Sumitomo Riko Company Limited

Inventor： Yutaro TAGUCHI ,  Hiroaki ITO ,  Yusaku TAKAGAKI

IPC: H01B1/24 ,  H01B5/16 ,  H01B13/00

CPC classification number: H01B1/24 ,  H01B5/16 ,  H01B13/0036 ,  H05K1/0283 ,  H05K1/0393 ,  H05K1/092 ,  H05K2201/0314 ,  H05K2201/0323

Abstract: A conductive film of the present invention includes an elastomer and a flake-like carbon material. An amount of the flake-like carbon material in the conductive film is 20 parts by mass or more and 60 parts by mass or less when a total solid content excluding a conductive agent is 100 parts by mass. A gloss level of a surface of the conductive film measured at an incidence angle of 20° is more than 0.4% and less than 10%. A method for producing a conductive film of the present invention includes the steps of preparing a liquid composition including an elastomer, a conductive agent including at least one of graphite powder and expanded graphite powder, and a solvent; subjecting the liquid composition to a grinding treatment using a wet jet mill; and applying the liquid composition after the grinding treatment to a base material, and curing the coating film.

公开(公告)号：US20180199436A1

公开(公告)日：2018-07-12

申请号：US15911623

申请日：2018-03-05

Applicant: THE TRUSTEES OF PRINCETON UNIVERSITY ,  VORBECK MATERIALS CORPORATION

Inventor： John M. CRAIN ,  John S. LETTOW ,  Ilhan A. AKSAY ,  Sibel KORKUT ,  Katherine S. CHIANG ,  Chuan-Hua CHEN ,  Robert K. PRUD'HOMME

IPC: H05K1/09 ,  C09D11/037 ,  C09D7/65 ,  C09C1/46

CPC classification number: H05K1/095 ,  B82Y30/00 ,  B82Y40/00 ,  C01P2004/02 ,  C01P2006/12 ,  C01P2006/40 ,  C08K3/04 ,  C09C1/46 ,  C09D7/65 ,  C09D7/70 ,  C09D11/037 ,  C09D11/102 ,  C09D11/52 ,  C09D171/02 ,  C09D177/00 ,  H01L2924/0002 ,  H05K1/092 ,  H05K3/0091 ,  H05K3/12 ,  H05K2201/0323 ,  Y10S977/734 ,  Y10S977/847 ,  Y10S977/932 ,  H01L2924/00

Abstract: Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed.

公开(公告)号：US09987827B2

公开(公告)日：2018-06-05

申请号：US14967349

申请日：2015-12-13

Applicant: Tsinghua University ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Yuan-Hao Jin ,  Qun-Qing Li ,  Shou-Shan Fan

IPC: G06F3/044 ,  C03C17/09 ,  B32B15/08 ,  C23C14/20 ,  C23C14/58 ,  C23C16/06 ,  C23C16/56 ,  C23C30/00 ,  C23F4/00 ,  G06F3/047 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  B32B5/02 ,  H01B1/02 ,  H01B1/16

CPC classification number: B32B15/08 ,  B32B5/028 ,  B32B2307/202 ,  C03C17/09 ,  C03C2217/252 ,  C03C2217/253 ,  C03C2217/255 ,  C03C2218/15 ,  C03C2218/33 ,  C03C2218/34 ,  C23C14/20 ,  C23C14/5826 ,  C23C14/5873 ,  C23C16/06 ,  C23C16/56 ,  C23C30/00 ,  C23F4/00 ,  G06F3/044 ,  G06F3/047 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/026 ,  H01B1/16 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/03 ,  H05K1/09 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0364 ,  H05K2201/09681

Abstract: The disclosure relates to a touch panel. The touch panel includes a substrate having a surface, a transparent conductive layer, at least one electrode, and a conductive trace. The transparent conductive layer includes a metal nanowire film. The metal nanowire film includes a number of first metal nanowire bundles parallel with and spaced from each other. Each of the number of first metal nanowire bundles includes a number of first metal nanowires parallel with each other. The first distance between adjacent two of the number of first metal nanowires is less than the second distance between adjacent two of the number of first metal nanowire bundles.

公开(公告)号：US20180148584A1

公开(公告)日：2018-05-31

申请号：US15499376

申请日：2017-04-27

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  FOUNDATION OF SOONGSIL UNIVERSITY-INDUSTRY COOPERATION

Inventor： Kunmo CHU ,  Byonggwon SONG ,  Sunghoon PARK ,  Kiyeon YANG ,  Changseung LEE

IPC: C09D5/24 ,  C09D7/12 ,  C09D183/04 ,  H01L23/00

CPC classification number: C09D5/24 ,  C08K3/041 ,  C08K3/08 ,  C08K3/10 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/011 ,  C09D7/61 ,  C09D7/69 ,  C09D7/70 ,  C09D11/52 ,  C09D183/04 ,  H01B1/22 ,  H01B1/24 ,  H01L21/4867 ,  H01L23/49883 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/27515 ,  H01L2224/29105 ,  H01L2224/29191 ,  H01L2224/29193 ,  H01L2224/3003 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/15159 ,  H01R13/2414 ,  H05K1/028 ,  H05K1/095 ,  H05K1/189 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/128 ,  H01L2924/014 ,  H01L2224/45099

Abstract: Provided are a paste material, a method of forming the paste material, a wiring member formed from the paste material, and an electronic device including the wiring member. The paste material may include a plurality of liquid metal particles and a polymer binder. The paste material may further include a plurality of nanofillers. At least some of the plurality of nanofillers may each have an aspect ratio equal to or greater than about 3. A content of the plurality of liquid metal particles may be greater than a content of the polymer binder and may be greater than a content of the plurality of nanofillers. The wiring member may be formed by using the paste material, and the wiring member may be used in various electronic devices.