公开(公告)号：US10541350B2

公开(公告)日：2020-01-21

申请号：US15985236

申请日：2018-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ju Heon Yoon ,  Jae In Sim ,  Tae Hun Kim ,  Gi Bum Kim

IPC: H01L33/10 ,  H01L33/38 ,  H01L33/50

Abstract: A light-emitting device includes a light-emitting chip having a first surface and a second surface. A first light reflection pattern is formed on the second surface. A plurality of terminals are disposed to be connected to the light-emitting chip by passing through the first light reflection pattern. A second light reflection pattern is formed on side surfaces of the light-emitting chip and the first light reflection pattern. A light-transmitting pattern is formed between the light-emitting chip and the second light reflection pattern and extends between the first light reflection pattern and the second light reflection pattern. A wavelength conversion layer is formed on the first surface of the light-emitting chip.