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公开(公告)号:US11275478B2
公开(公告)日:2022-03-15
申请号:US16966985
申请日:2019-02-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jeong Woo , Seungwon Oh , Soyoung Lee
Abstract: According to various embodiments, an electronic device comprises: a housing; a sensing circuit; a processor operatively connected to the sensing circuit; and a memory operably connected to the processor, wherein the memory can store instructions that when executed, cause the processor to: identify output values of the sensing circuit associated with a touch or a pressure applied to the sensing circuit; when at least a portion of the output values are changed, obtain bending information of the sensing circuit at least on the basis of the changed output values; and control to change an operation mode of the electronic device to at least one of specified operation modes at least on the basis of the bending information of the sensing circuit. Other embodiments are possible.
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公开(公告)号:US11254698B2
公开(公告)日:2022-02-22
申请号:US16702791
申请日:2019-12-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Soyoung Lee , Hiroshi Nihei , Takamasa Miyazaki , Yousuke Satou , Kouhei Sugimoto , Masashi Shirai , Jaesoon Lim , Younsoo Kim , Younjoung Cho
IPC: C23C16/18 , H01L21/02 , H01L21/3213 , C07F15/06 , C23C16/455
Abstract: The inventive concept relates to a cobalt precursor, a method for manufacturing a cobalt-containing layer using the same, and a method for manufacturing a semiconductor device using the same. More particularly, the cobalt precursor of the inventive concept includes at least one compound selected from the group consisting of a compound of Formula 1 and a compound of Formula 2.
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公开(公告)号:US11019736B2
公开(公告)日:2021-05-25
申请号:US16567280
申请日:2019-09-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jeong Woo , Kwonho Song , Seungki Choi , Youngsik Choi , Soyoung Lee
Abstract: Disclosed is an electronic device. An electronic device according to an embodiment may include: a housing including a first plate oriented in a first direction, a second plate oriented in a second direction opposite the first direction, and a side face surrounding a space between the first plate and the second plate; a first PCB disposed in the space and including a first face oriented in the first direction, a second face oriented in the second direction, and a first electrical connector disposed on the first face; a second PCB disposed in the space closer to the second plate than the first PCB, and including a second electrical connector; a third electrical connector detachably coupled to the first electrical connector; a fourth electrical connector detachably coupled to the second electrical connector; an FPCB electrically connected between the third connector and the fourth electrical connector, and including a first portion facing the second face; and a flexible conductive member comprising a conductor disposed between the second face and the first portion.
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公开(公告)号:USD877197S1
公开(公告)日:2020-03-03
申请号:US29704482
申请日:2019-09-05
Applicant: Samsung Electronics Co., Ltd.
Designer: Heon Woo Lee , Miyeon Park , Yongman Park , Jakyoung Lee , Hyerim Kwak , Soyoung Lee
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公开(公告)号:USD873300S1
公开(公告)日:2020-01-21
申请号:US29698312
申请日:2019-07-16
Applicant: Samsung Electronics Co., Ltd.
Designer: Heon Woo Lee , Miyeon Park , Yongman Park , Jakyoung Lee , Hyerim Kwak , Soyoung Lee
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公开(公告)号:USD862521S1
公开(公告)日:2019-10-08
申请号:US29685648
申请日:2019-03-29
Applicant: Samsung Electronics Co., Ltd.
Designer: Heon Woo Lee , Miyeon Park , Yongman Park , Jakyoung Lee , Hyerim Kwak , Soyoung Lee
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公开(公告)号:USD826273S1
公开(公告)日:2018-08-21
申请号:US29610562
申请日:2017-07-13
Applicant: Samsung Electronics Co., Ltd.
Designer: Heon Woo Lee , Miyeon Park , Yongman Park , Jakyoung Lee , Hyerim Kwak , Soyoung Lee
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公开(公告)号:USD806751S1
公开(公告)日:2018-01-02
申请号:US29609860
申请日:2017-07-06
Applicant: Samsung Electronics Co., Ltd.
Designer: Heon Woo Lee , Miyeon Park , Yongman Park , Jakyoung Lee , Hyerim Kwak , Soyoung Lee
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公开(公告)号:US20170298507A1
公开(公告)日:2017-10-19
申请号:US15398284
申请日:2017-01-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Soyoung Lee , Hyunsu Kim , Kiju Sohn , Kuntack Lee , Jongwon Hong
IPC: C23C16/455 , H01L27/115 , H01L21/768 , H01L21/02
CPC classification number: C23C16/45525 , C23C16/4481 , H01L21/0228 , H01L21/76831 , H01L27/11556 , H01L27/11582
Abstract: A semiconductor fabrication apparatus can include a plurality of reaction containers that can be coupled together to provide a plurality of sequential respective stages in a process of generating a process gas for semiconductor fabrication, where each reaction container can include a respective semiconductor fabrication solid source material in a respective configuration that is different than in others of the reaction containers.
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公开(公告)号:USD797123S1
公开(公告)日:2017-09-12
申请号:US29564972
申请日:2016-05-17
Applicant: Samsung Electronics Co., Ltd.
Designer: Heon Woo Lee , Miyeon Park , Yongman Park , Jakyoung Lee , Hyerim Kwak , Soyoung Lee
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