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公开(公告)号：US20230021469A1
公开(公告)日：2023-01-26
申请号：US17742260
申请日：2022-05-11
Applicant: SAMSUNG SDI CO., LTD. , SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ran NAMGUNG , Hyeon PARK , Shinhyo BAE , Daeseok SONG , Minki CHON , Jun Soo KIM , Hyun-Woo KIM , Hyun-Ji SONG , Young Joo CHOI , Suk-Koo HONG
IPC: C09D167/04 , C08G63/682 , C08G63/47 , C07D285/15 , C07C37/02 , C07C31/38 , C07C323/03 , G03F7/16 , G03F7/004
Abstract: A resist topcoat composition and a method of forming patterns using the resist topcoat composition. The resist topcoat composition includes an acrylic copolymer including a first structural unit represented by Chemical Formula M-1, and a second structural unit represented by Chemical Formula M-2; an acid compound; and a solvent
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公开(公告)号：US20220260914A1
公开(公告)日：2022-08-18
申请号：US17732807
申请日：2022-04-29
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Jaeyeol BAEK , Shinhyo BAE , Yoojeong CHOI , Soonhyung KWON , Hyeon PARK
Abstract: A resist underlayer composition and a method of forming patterns, the composition including a polymer including at least one of a first moiety represented by Chemical Formula 1-1 and a second moiety represented by Chemical Formula 1-2; a thermal acid generator including a salt composed of an anion of an acid and a cation of a base, the base having pKa of greater than or equal to about 7; and a solvent,
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公开(公告)号：US20180224744A1
公开(公告)日：2018-08-09
申请号：US15866809
申请日：2018-01-10
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Shinhyo BAE , Soonhyung KWON , Hyeon PARK , Jaeyeol BAEK , Beomjun JOO , Yoojeong CHOI , Kwen-Woo HAN
Abstract: A resist underlayer composition and a method of forming patterns using the resist underlayer composition, the resist underlayer composition including a polymer including a moiety represented by Chemical Formula 1 and a moiety represented by Chemical Formula 2, and a solvent,
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