公开(公告)号：US20190129307A1

公开(公告)日：2019-05-02

申请号：US16174524

申请日：2018-10-30

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Soonhyung KWON ,  Shinhyo BAE ,  Hyeon PARK ,  Jaeyeol BAEK ,  Beomjun JOO ,  Yoojeong CHOI ,  Kwen-Woo HAN

IPC: G03F7/11 ,  H01L21/027 ,  C08G12/34 ,  C09D161/30 ,  G03F7/16 ,  G03F7/20 ,  G03F7/30 ,  H01L21/311

Abstract: A resist underlayer composition and a method of forming patterns, the composition including a solvent; and a polymer that includes a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2,

公开(公告)号：US20230098338A1

公开(公告)日：2023-03-30

申请号：US17942394

申请日：2022-09-12

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Inkeol PARK ,  Beomjun JOO

IPC: G03F7/11 ,  G03F7/16 ,  C09D4/00

Abstract: A hardmask composition, a hardmask layer including a cured product of the hardmask composition, and a method of forming patterns from the hardmask composition, the hardmask composition includes a compound represented by Chemical Formula 1, and a solvent,

公开(公告)号：US20180224744A1

公开(公告)日：2018-08-09

申请号：US15866809

申请日：2018-01-10

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Shinhyo BAE ,  Soonhyung KWON ,  Hyeon PARK ,  Jaeyeol BAEK ,  Beomjun JOO ,  Yoojeong CHOI ,  Kwen-Woo HAN

IPC: G03F7/09 ,  H01L21/308 ,  C08G59/42 ,  G03F7/11 ,  G03F7/039 ,  C08G59/24

Abstract: A resist underlayer composition and a method of forming patterns using the resist underlayer composition, the resist underlayer composition including a polymer including a moiety represented by Chemical Formula 1 and a moiety represented by Chemical Formula 2, and a solvent,