-
公开(公告)号：US12025914B2
公开(公告)日：2024-07-02
申请号：US18327785
申请日：2023-06-01
发明人： You-Hua Chou , Kuosheng Chuang
IPC分类号： H01L21/00 , G03F7/06 , H01L21/033
CPC分类号： G03F7/06 , H01L21/0332 , H01L21/0337
摘要： A method for forming a semiconductor structure is provided. The method includes depositing a hard mask layer over a substrate. The method further includes depositing a silver precursor layer over the hard mask layer. The method further includes exposing portions of the silver precursor layer to a radiation, the radiation causing a reduction of silver ions in the irradiated portions of the silver precursor layer. The method further includes removing non-irradiated portions of the silver precursor layer, resulting in a plurality of silver seed structures.
-
公开(公告)号：US20210272799A1
公开(公告)日：2021-09-02
申请号：US16803885
申请日：2020-02-27
发明人： You-Hua Chou , Kuo-Sheng Chuang
IPC分类号： H01L21/027 , G03F7/06
摘要： A method for forming a semiconductor structure is provided. The method includes depositing a hard mask layer over a substrate. The method further includes depositing a silver precursor layer over the hard mask layer. The method further includes exposing portions of the silver precursor layer to a radiation, the radiation causing a reduction of silver ions in the irradiated portions of the silver precursor layer. The method further includes removing non-irradiated portions of the silver precursor layer, resulting in a plurality of silver seed structures.
-
公开(公告)号：US10604671B2
公开(公告)日：2020-03-31
申请号：US15888486
申请日：2018-02-05
申请人： FUJIFILM Corporation
发明人： Kensuke Katagiri , Shin Tajiri
IPC分类号： G06F3/041 , C09D113/02 , H01B1/22 , G03C1/04 , C08K3/08 , B32B27/18 , G03F7/40 , C08J7/04 , H01B5/14 , C08J3/24 , C09D5/24 , C09D189/06 , G03F7/06 , G03F7/16 , G03F7/20 , G03F7/32 , G06F3/044 , H01B13/00 , H03K17/96 , C08L39/04 , C08L33/02
摘要： A method for producing a conductive film having a substrate and a conductive layer disposed on the substrate has a first step of forming a precursor layer on the substrate, the precursor layer including a metal component or its precursor, a water-insoluble polymer X having a cross-linking group, a water-insoluble polymer Y having a reactive group that reacts with the cross-linking group, and a water-soluble polymer Z different from polymer X and polymer Y; a second step of reacting the cross-linking group in the water-insoluble polymer X with the reactive group in the water-insoluble polymer Y; and a third step of forming the conductive layer by removing the water-soluble polymer Z.
-
公开(公告)号：US10314173B2
公开(公告)日：2019-06-04
申请号：US15231857
申请日：2016-08-09
摘要： A precursor article has a substrate and a photosensitive thin film or photosensitive thin film pattern on one or both supporting sides. A non-hydroxylic-solvent soluble silver complex is present that is represented by the following formula (I): (Ag+)a(L)b(P)c (I) wherein L represents an α-oxy carboxylate; P represents a primary alkylamine; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. A photosensitizer can also be present to enhance photosensitivity for conversion of reducible silver ions to electrically-conductive silver metal in a resulting product article or device. The electrically-conductive silver metal can be provided as a uniform electrically-conductive silver metal-containing thin film or layer, or as one or more electrically-conductive silver metal-containing thin film patterns.
-
公开(公告)号：US10186342B2
公开(公告)日：2019-01-22
申请号：US15231811
申请日：2016-08-09
发明人： Deepak Shukla
摘要： A photosensitive reducible silver ion-containing composition can be used to provide electrically-conductive silver metal in thin films or patterns. This composition comprises: a) a non-hydroxylic-solvent soluble silver complex represented by the following formula (I): (Ag+)a(L)b(P)c (I) wherein L represents an α-oxy carboxylate; P represents a 5- or 6-membered N-heteroaromatic compound; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2; b) optionally, a photosensitizer that can either reduce the reducible silver ion or oxidize the α-oxy carboxylate; and c) a solvent medium comprising at least one non-hydroxylic solvent. Electrically-conductive silver can be provided by photochemical conversion of the reducible silver ions in the complex.
-
公开(公告)号：US09809606B1
公开(公告)日：2017-11-07
申请号：US15231804
申请日：2016-08-09
发明人： Deepak Shukla
摘要： A non-hydroxylic-solvent soluble silver complex comprises a reducible silver ion complexed with an α-oxy carboxylate and a 5- or 6-membered N-heteroaromatic compound. The non-hydroxylic-solvent soluble silver complex can be represented by the following formula (I): (Ag+)a(L)b(P)c (I) wherein L represents the α-oxy carboxylate; P represents the 5- or 6-membered N-heteroaromatic compound; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. Such complexes can be incorporated into photosensitive compositions for thin films or patterns in various articles to provide electrically-conductive silver metal.
-
公开(公告)号：US09523915B2
公开(公告)日：2016-12-20
申请号：US14868503
申请日：2015-09-29
发明人： Erin C. Pavlacky
CPC分类号： G03F7/06 , G03C1/49863 , G03F7/36
摘要： Coating compositions and image forming materials made therefrom, the coating compositions comprising at least one non-photosensitive source of reducible silver ions, at least one reducing agent capable of reducing the reducible silver ions, a first binder comprising vinyl butyral repeat units and vinyl alcohol repeat units, a second binder comprising vinyl butyral repeat units and vinyl alcohol repeat units, the second binder having a composition differing from that of the first binder, and a third binder comprising vinyl pyrrolidone repeat units and vinyl acetate repeat units.
摘要翻译： 涂料组合物和由其制成的成像材料，涂料组合物包含至少一种可还原银离子的非光敏源，至少一种能还原可还原银离子的还原剂，包含乙烯基缩丁醛重复单元和乙烯醇重复单元的第一粘合剂 单元，包含乙烯基缩丁醛重复单元和乙烯醇重复单元的第二粘合剂，所述第二粘合剂具有与第一粘合剂不同的组成，以及包含乙烯基吡咯烷酮重复单元和乙酸乙烯酯重复单元的第三粘合剂。
-
公开(公告)号：US20160274460A1
公开(公告)日：2016-09-22
申请号：US14661235
申请日：2015-03-18
IPC分类号： G03F7/06
CPC分类号： G03F7/06 , B05D7/04 , C08F8/42 , C08K2003/0806 , C09D5/14 , C09D7/67 , C09D7/68 , C23C18/1608 , C23C18/1851 , C23C18/1889 , C23C18/1893 , C23C18/2006 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/36 , C23C18/38 , C23C18/40 , C23C18/44 , G03F7/0388 , G03F7/20 , G03F7/40
摘要： Silver-containing compositions contain a water-soluble complex of a reactive polymer with either reducible silver ions or silver nanoparticles, the reactive polymer comprising: (a) greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least mol % of recurring units comprising a pendant amide, hydroxyl, lactam, phosphoric acid, or carboxylic acid group, all amounts based on the total recurring units in the reactive polymer. Other silver-containing compositions contain a water-insoluble complex of a reacted polymer with either reducible silver ions or silver nanoparticles. The reacted polymers are derived from the reactive polymers.
摘要翻译： 含银组合物含有反应性聚合物与可还原银离子或银纳米颗粒的水溶性络合物，反应性聚合物包含：（a）大于1mol％的包含磺酸或磺酸盐基团的重复单元，（b） 至少5摩尔％的包含能够通过[2 + 2]光环加成交联的侧基的重复单元，以及任选地（c）至少含有酰胺，羟基，内酰胺，磷酸或羧酸基团的重复单元的摩尔％ ，基于反应性聚合物中的总重复单元的所有量。 其它含银组合物含有反应聚合物与可还原银离子或银纳米颗粒的水不溶性络合物。 反应的聚合物衍生自反应性聚合物。
-
公开(公告)号：US20160170301A1
公开(公告)日：2016-06-16
申请号：US14571462
申请日：2014-12-16
申请人： Deepak Shukla
发明人： Deepak Shukla
IPC分类号： G03F7/06
摘要： A non-aqueous metal catalytic composition includes (a) a complex of silver and a hindered aromatic N-heterocycle comprising reducible silver ions in an amount of at least 2 weight %, (b) a silver ion photoreducing composition in an amount of at least 1 weight %, and (c) a photocurable component, a non-curable polymer, or a combination of a photocurable component and a non-curable polymer. This non-aqueous metal catalytic composition can be used to form silver metal particles in situ during suitable reducing conditions. The silver metal can be provided in a suitable layer or pattern on a substrate, which can then be subsequently subjected to electroless plating to form electrically-conductive layers or patterns for use in various articles or as touch screen displays in electronic devices.
摘要翻译： 非水性金属催化剂组合物包括（a）银和受阻芳族N-杂环的配合物，其包含至少2重量％的可还原银离子，（b）银离子光还原组合物的量至少 1重量％，（c）光固化性成分，非固化性聚合物，光固化性成分和非固化性聚合物的组合。 该非水金属催化剂组合物可用于在合适的还原条件下原位形成银金属颗粒。 银金属可以以合适的层或图案提供在基底上，然后可随后对其进行化学镀以形成用于各种制品的导电层或图案或用作电子设备中的触摸屏显示器。
-
公开(公告)号：US09304395B2
公开(公告)日：2016-04-05
申请号：US14265418
申请日：2014-04-30
IPC分类号： G02F1/1333 , G03F7/06 , G03F7/30 , G03F7/20
CPC分类号： G03F7/06 , G03F7/091 , G03F7/2002 , G03F7/30
摘要： A black-and-white silver halide conductive film element precursor has at least one first non-color hydrophilic photosensitive layer comprising a silver halide and a first hydrophilic overcoat disposed over the first non-color hydrophilic photosensitive layer. This first hydrophilic overcoat is the outermost layer and contains one or more immobilized radiation absorbers such as immobilized ultraviolet radiation absorbers, in a total amount of at least 5 mg/m2. These precursors can be imagewise exposed and processed to provide conductive film elements with various conductive silver patterns (or grids) with narrow conductive silver lines on one or both sides. In many instances, the precursors have the same or different layers on both sides of a transparent substrate and the resulting conductive film element has the same or different conductive silver patterns on both sides.
摘要翻译： 黑白卤化银导电膜元件前体具有至少一个包含卤化银的第一非彩色亲水感光层和设置在第一非彩色亲水感光层之上的第一亲水外涂层。 该第一亲水外涂层是最外层，并且含有一种或多种固定的辐射吸收剂，例如固定的紫外线辐射吸收剂，其总量为至少5mg / m 2。 这些前体可以成像曝光和加工，以在一侧或两侧上提供具有窄导电银线的各种导电银图案（或网格）的导电膜元件。 在许多情况下，前体在透明基板的两侧具有相同或不同的层，并且所得到的导电膜元件在两侧具有相同或不同的导电银图案。
-
-
-
-
-
-
-
-
-
搜索结果
450 条记录 (耗时 0.028 秒)
