公开(公告)号：US20210265248A1

公开(公告)日：2021-08-26

申请号：US16796260

申请日：2020-02-20

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Qing YANG ,  Lihu HOU

IPC: H01L23/498 ,  H01R12/58 ,  H01L21/48 ,  H01R43/02

Abstract: A casing for semiconductor packages that includes a plurality of press-fit pins is disclosed. Specific implementations include a shaft including a first end and a second end. The first end may include a head. The press-fit pin may include a bonding portion included at the second end. The bonding portion may include a first section extending substantially perpendicular from a longest length of the shaft. The bonding portion may also include an angled section coupled to a bonding foot. The bonding foot may be configured to be ultrasonically welded to a substrate.