公开(公告)号：US20240258181A1

公开(公告)日：2024-08-01

申请号：US18160450

申请日：2023-01-27

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  Chee Hiong CHEW ,  Yushuang YAO ,  Vemmond Jeng Hung NG

IPC: H01L23/13 ,  B32B3/02 ,  B32B9/00 ,  B32B9/04 ,  B32B15/20 ,  H01L21/48 ,  H01L23/373

CPC classification number: H01L23/13 ,  B32B3/02 ,  B32B9/005 ,  B32B9/041 ,  B32B15/20 ,  H01L21/4871 ,  H01L23/3735 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2307/206 ,  B32B2457/00

Abstract: Implementations of a substrate may include an electrically insulative layer having a first largest planar side and a second largest planar side opposing the first largest planar side; a first electrically conductive layer coupled to the first largest planar side and including a first scalloped edge having a first pattern; and a second electrically conductive layer coupled to the second largest planar side and including a second scalloped edge having a second pattern. The first pattern and the second pattern may alternate along at least one edge of the first largest planar side and at least one edge of the second largest planar side, respectively.

公开(公告)号：US20240038632A1

公开(公告)日：2024-02-01

申请号：US17814949

申请日：2022-07-26

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  Chee Hiong CHEW ,  Yushuang YAO

IPC: H01L23/473 ,  H01L25/07 ,  H01L23/00 ,  H01L23/373 ,  H01L21/48

CPC classification number: H01L23/473 ,  H01L25/072 ,  H01L24/40 ,  H01L23/3735 ,  H01L21/4807 ,  H01L2224/40155 ,  H01L2924/10272 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091

Abstract: A method includes disposing at least one power device between a first direct bonded metal (DBM) substrate and a second DMB substrate and thermally coupling a plurality of pipes to a top side of the first DBM substrate opposite a side of the first DBM substrate with the at least one power device. The plurality of pipes is configured to carry cooling fluids in thermal contact with the first DBM substrate.

公开(公告)号：US20210050272A1

公开(公告)日：2021-02-18

申请号：US17086932

申请日：2020-11-02

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Chee Hiong CHEW ,  Atapol PRAJUCKAMOL

IPC: H01L23/053 ,  H01L23/08 ,  H01L23/18 ,  H01L23/498

Abstract: Implementations of a semiconductor package may include: a substrate, a case coupled to the substrate, and a plurality of press-fit pins. The plurality of press-fit pins may be fixedly coupled with the case. The plurality of press-fit pins may have at least one locking portion that extends from a side of the plurality of press-fit pins into the case and the plurality of press-fit pins may be electrically and mechanically coupled to the substrate.

公开(公告)号：US20190173215A1

公开(公告)日：2019-06-06

申请号：US16249429

申请日：2019-01-16

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Chee Hiong CHEW ,  Atapol PRAJUCKAMOL

IPC: H01R13/05 ,  H01R43/16 ,  H01R12/58 ,  H01R12/57 ,  H01R43/02

CPC classification number: H01R13/05 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01R12/57 ,  H01R12/585 ,  H01R43/02 ,  H01R43/16 ,  H01L2924/00014

Abstract: Implementations of pins for semiconductor packages may include: an upper contact portion having a contact surface configured to mechanically and electrically couple with a pin receiver; a lower portion having a vertical stop and at least two curved legs; a horizontal base coupled directly to the at least two curved legs and configured to be soldered to a substrate to mechanically and electrically couple the pin to the substrate, the horizontal base having an upper contact surface, and; a gap between a bottom contact surface of the vertical stop and the upper contact surface of the horizontal base; wherein the at least two curved legs are configured to flex to allow the bottom contact surface of the vertical stop to move toward the upper contact surface of the horizontal base in response to a pressure applied to the pin along a direction collinear with a longest length of the pin toward the upper contact surface, and; wherein the vertical stop is configured to stop movement of the pin when the bottom contact surface contacts the upper contact surface.

公开(公告)号：US20170170582A1

公开(公告)日：2017-06-15

申请号：US15443671

申请日：2017-02-27

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Chee Hiong CHEW ,  Atapol PRAJUCKAMOL

IPC: H01R12/58 ,  H01R43/02 ,  H01R43/16

CPC classification number: H01R13/05 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01R12/57 ,  H01R12/585 ,  H01R43/02 ,  H01R43/16 ,  H01L2924/00014

Abstract: Implementations of pins for semiconductor packages may include: an upper contact portion having a contact surface configured to mechanically and electrically couple with a pin receiver; a lower portion having a vertical stop and at least two curved legs; a horizontal base coupled directly to the at least two curved legs and configured to be soldered to a substrate to mechanically and electrically couple the pin to the substrate, the horizontal base having an upper contact surface, and; a gap between a bottom contact surface of the vertical stop and the upper contact surface of the horizontal base; wherein the at least two curved legs are configured to flex to allow the bottom contact surface of the vertical stop to move toward the upper contact surface of the horizontal base in response to a pressure applied to the pin along a direction collinear with a longest length of the pin toward the upper contact surface, and; wherein the vertical stop is configured to stop movement of the pin when the bottom contact surface contacts the upper contact surface.

公开(公告)号：US20220159853A1

公开(公告)日：2022-05-19

申请号：US17588660

申请日：2022-01-31

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  Yushuang YAO ,  Chee Hiong CHEW

IPC: H05K5/02 ,  H01L23/053 ,  H01L23/40

Abstract: In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.

公开(公告)号：US20200344905A1

公开(公告)日：2020-10-29

申请号：US16587549

申请日：2019-09-30

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  Chee Hiong CHEW ,  Yushuang YAO

IPC: H05K5/06 ,  H05K7/20

Abstract: A fin frame baseplate is disclosed. Specific implementations include a baseplate configured to be coupled to a substrate, a fin frame including a base portion coupled to the baseplate, and a plurality of fins extending from the base portion, the plurality of fins protruding from the base portion. The fin frame may include a plurality of openings therethrough.

公开(公告)号：US20200105648A1

公开(公告)日：2020-04-02

申请号：US16145517

申请日：2018-09-28

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  Chee Hiong CHEW ,  Yushuang YAO

IPC: H01L23/495 ,  H01L23/00

Abstract: A semiconductor package assembly having a connecting clip disposed on both a first material stack and a second material stack having different thicknesses and disposed on a conducting substrate. This connecting clip has a first portion disposed on to the first material stack and second portion disposed on the second material stack, such that the surfaces of the first portion and second portion opposite the conducting substrate are at the same perpendicular distance from the conducting substrate. For example, in some implementations, when the thickness of the second material stack is smaller than the thickness of the first material stack, the second portion of the connecting clip may include a vertical support disposed on the second material stack to equalize the heights of the surfaces of the first portion and second portion of the connecting clip.

公开(公告)号：US20180197836A1

公开(公告)日：2018-07-12

申请号：US15912267

申请日：2018-03-05

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Chee Hiong CHEW ,  Atapol PRAJUCKAMOL ,  Yushuang YAO

IPC: H01L23/00 ,  H01L25/07 ,  H01L25/065 ,  H01L23/495

CPC classification number: H01L24/83 ,  H01L23/49524 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27418 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37012 ,  H01L2224/37111 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/40139 ,  H01L2224/40175 ,  H01L2224/40499 ,  H01L2224/45124 ,  H01L2224/73263 ,  H01L2224/83101 ,  H01L2224/83193 ,  H01L2224/83385 ,  H01L2224/83438 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/84385 ,  H01L2224/84438 ,  H01L2224/84447 ,  H01L2224/8484 ,  H01L2224/92246 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/01014

Abstract: Implementations of a clip for a semiconductor package may include: an electrically conductive clip having a first end and a second end and a middle section between the first end and the second end. The first end may be configured to couple to a first die through a bonding material. The second end may be configured to couple to a second die through a bonding material. The middle section may be configured to couple to an emitter structure through a bonding material. The clip may include an integrally formed electrically conductive material and include an M-shape. A middle of the M-shape may be coupled to the emitter structure.

公开(公告)号：US20170347456A1

公开(公告)日：2017-11-30

申请号：US15165813

申请日：2016-05-26

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Atapol PRAJUCKAMOL ,  Chee Hiong CHEW ,  Francis J. CARNEY ,  Yusheng LIN

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/09 ,  H05K3/34 ,  H05K1/03

CPC classification number: H05K1/181 ,  H01L23/48 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/341 ,  H05K3/3431 ,  H05K3/3494 ,  H05K3/4015 ,  H05K2201/10189 ,  H05K2201/10257 ,  H05K2201/10333 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/16

Abstract: A method, in some embodiments, comprises: providing a direct bonded copper (DBC) substrate including a plurality of copper traces; providing a guide plate having protrusions on a surface of the guide plate; mounting hollow bush rings onto the protrusions; mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces; attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces; and after said simultaneous reflow, removing the protrusions from the bush rings.