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公开(公告)号：US20250006603A1
公开(公告)日：2025-01-02
申请号：US18344292
申请日：2023-06-29
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
IPC: H01L23/495 , H01L21/56 , H01L23/00 , H01L23/31
Abstract: Devices and methods are disclosed for high power inverter modules with enhanced thermal and mechanical performance, for use in electric vehicles. The disclosed devices feature enlarged clips that cover an entire die, to distribute mechanical forces, thus preventing die cracks for improved reliability. In these power modules, semiconductor dies are sandwiched between a three-layer direct bond metal (DBM) structure and the enlarged clip. A pre-molded clip assembly can be used that includes integrated metalliization to eliminate the need for external wire bonds. Alternatively, semiconductor dies can be inverted in a flip-chip configuration to face a modified DBM structure that integrates the metallization. Simulations of the disclosed power inverters indicate improved efficiency in dissipating heat.
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公开(公告)号：US20220208653A1
公开(公告)日：2022-06-30
申请号：US17136299
申请日：2020-12-29
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
IPC: H01L23/492 , H01L23/373 , H01L23/00
Abstract: A dual-side cooling (DSC) semiconductor package includes a first metal-insulator-metal (MIM) substrate having a first insulator layer, first metallic layer, and second metallic layer. A second MIM substrate includes a second insulator layer, third metallic layer, and fourth metallic layer. The third metallic layer includes a first portion having a first contact area and a second portion, electrically isolated from the first portion, having a second contact area. A semiconductor die is coupled with the second metallic layer and is directly coupled with the third metallic layer through one or more solders, sintered layers, electrically conductive tapes, solderable top metal (STM) layers, and/or under bump metal (UBM) layers. The first contact area is electrically coupled with a first electrical contact of the die and the second contact area is electrically coupled with a second electrical contact of the die. The first and fourth metallic layers are exposed through an encapsulant.
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公开(公告)号：US20250149419A1
公开(公告)日：2025-05-08
申请号：US19016598
申请日：2025-01-10
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor： Yushuang YAO , Qing YANG , Lihu HOU
IPC: H01L23/498 , H01L21/48 , H01R12/58 , H01R43/02
Abstract: A casing for semiconductor packages that includes a plurality of press-fit pins is disclosed. Specific implementations include a shaft including a first end and a second end. The first end may include a head. The press-fit pin may include a bonding portion included at the second end. The bonding portion may include a first section extending substantially perpendicular from a longest length of the shaft. The bonding portion may also include an angled section coupled to a bonding foot. The bonding foot may be configured to be ultrasonically welded to a substrate.
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公开(公告)号：US20250096159A1
公开(公告)日：2025-03-20
申请号：US18970731
申请日：2024-12-05
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Abstract: In a general aspect, a method of producing a signal distribution assembly includes forming a first metal layer having a first, planar side and a second, non-planar side opposite the first side. The second side includes a first base portion, a first post extending from the first base portion; and a second post extending from the first base portion. The method also includes molding the first metal layer such that a molding compound is disposed on the second side of the first metal layer with respective upper surfaces of the first and second posts being exposed through the molding compound. The method further includes coupling the first side of the first metal layer to a first surface of a thermally conductive insulator layer and coupling a second metal layer with a second surface of the thermally conductive insulator layer opposite the first surface of the thermally conductive insulator layer.
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公开(公告)号：US20250069992A1
公开(公告)日：2025-02-27
申请号：US18940141
申请日：2024-11-07
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
IPC: H01L23/492 , H01L23/00 , H01L23/31 , H01L23/373
Abstract: A dual-side cooling (DSC) semiconductor package includes a first metal-insulator-metal (MIM) substrate having a first insulator layer, first metallic layer, and second metallic layer. A second MIM substrate includes a second insulator layer, third metallic layer, and fourth metallic layer. The third metallic layer includes a first portion having a first contact area and a second portion, electrically isolated from the first portion, having a second contact area. A semiconductor die is coupled with the second metallic layer and is directly coupled with the third metallic layer through one or more solders, sintered layers, electrically conductive tapes, solderable top metal (STM) layers, and/or under bump metal (UBM) layers. The first contact area is electrically coupled with a first electrical contact of the die and the second contact area is electrically coupled with a second electrical contact of the die. The first and fourth metallic layers are exposed through an encapsulant.
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Patent Agency Ranking
公开(公告)号：US20220208666A1
公开(公告)日：2022-06-30
申请号：US17655216
申请日：2022-03-17
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor： Qing YANG , Yong LIU , Yushuang YAO
Abstract: A power module can include a casing mounted to a baseplate that contains a substrate with circuitry. The circuitry can include pins for coupling signals to/from the circuitry. These pins can extend through a cover portion of the casing so that an electronic substrate, such as a printed circuit board (PCB) can be press-fit onto the pins. When press-fit, the electronic substrate is supported and positioned by support pillars that extend from the base plate to above the cover portion of the casing. If the pins and the support pillars have different coefficients of thermal expansion, damage to connection points between the pins and the circuitry may occur. Here, a power module is disclosed that has thermally matched pins and support pillars so that when the system is thermally cycled over a range of temperatures, the connection points are not damaged by forces induced by thermal expansion.
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公开(公告)号：US20210343620A1
公开(公告)日：2021-11-04
申请号：US16865962
申请日：2020-05-04
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor： Yushuang YAO , Vemmond Jeng Hung NG , Chee Hiong CHEW , Qing YANG
IPC: H01L23/40 , H01L23/495
Abstract: A method includes disposing a series of protrusions on a rectangular side panel of an open four-sided box-like structure in a frame, and attaching an electronic substrate to the frame. The electronic substrate carries one or more circuit components. The series of protrusions acts as a spring-like compensator to compensate plastic deformation, twisting or warping of the frame, and to limit propagation of stress to the electronic substrate via the frame.
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公开(公告)号：US20230326876A1
公开(公告)日：2023-10-12
申请号：US17658118
申请日：2022-04-06
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
CPC classification number: H01L23/562 , H01L2924/351 , H01L25/18 , H01L24/40 , H01L24/48 , H01L23/3735 , H01L21/4807 , H01L21/565 , H01L25/50 , H01L2224/40225 , H01L2224/48225 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L25/072
Abstract: In some aspects, the techniques described herein relate to a signal distribution assembly configured to conduct signals in a semiconductor device module, the signal distribution assembly including: a metal layer, the metal layer having: a first side, the first side being planar; and a second side opposite the first side, the second side being non-planar and including: a base portion; a first post extending from the base portion; and a second post extending from the base portion. The metal layer can be pre-molded using a molding compound disposed on the second side of the metal later, with respective surfaces of the first post and the second posted exposed through the molding compound, and or the metal layer can be coupled with a thermally conductive insulator (e.g., ceramic) layer.
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公开(公告)号：US20230238307A1
公开(公告)日：2023-07-27
申请号：US18194780
申请日：2023-04-03
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
IPC: H01L23/492 , H01L23/00 , H01L23/373
CPC classification number: H01L23/4922 , H01L24/48 , H01L23/3735 , H01L24/32 , H01L2224/32258 , H01L2224/48245 , H01L23/3107
Abstract: A dual-side cooling (DSC) semiconductor package includes a first metal-insulator-metal (MIM) substrate having a first insulator layer, first metallic layer, and second metallic layer. A second MIM substrate includes a second insulator layer, third metallic layer, and fourth metallic layer. The third metallic layer includes a first portion having a first contact area and a second portion, electrically isolated from the first portion, having a second contact area. A semiconductor die is coupled with the second metallic layer and is directly coupled with the third metallic layer through one or more solders, sintered layers, electrically conductive tapes, solderable top metal (STM) layers, and/or under bump metal (UBM) layers. The first contact area is electrically coupled with a first electrical contact of the die and the second contact area is electrically coupled with a second electrical contact of the die. The first and fourth metallic layers are exposed through an encapsulant.
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公开(公告)号：US20220130740A1
公开(公告)日：2022-04-28
申请号：US16949262
申请日：2020-10-22
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor： Qing YANG , Yong LIU , Yushuang YAO
IPC: H01L23/498 , H01L25/18 , H01L21/48 , H01L25/07 , H01L23/00 , H01L23/32 , H01L23/373
Abstract: A power module can include a casing mounted to a baseplate that contains a substrate with circuitry. The circuitry can include pins for coupling signals to/from the circuitry. These pins can extend through a cover portion of the casing so that an electronic substrate, such as a printed circuit board (PCB) can be press-fit onto the pins. When press-fit, the electronic substrate is supported and positioned by support pillars that extend from the base plate to above the cover portion of the casing. If the pins and the support pillars have different coefficients of thermal expansion, damage to connection points between the pins and the circuitry may occur. Here, a power module is disclosed that has thermally matched pins and support pillars so that when the system is thermally cycled over a range of temperatures, the connection points are not damaged by forces induced by thermal expansion.
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