公开(公告)号：US20210082837A1

公开(公告)日：2021-03-18

申请号：US16867937

申请日：2020-05-06

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Yuan-Hung Hsu ,  Chi-Jen Chen

IPC: H01L23/00 ,  H01L23/538 ,  H01L21/768

Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.

公开(公告)号：US20210068260A1

公开(公告)日：2021-03-04

申请号：US17086888

申请日：2020-11-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Yuan-Hung Hsu

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/46 ,  H05K3/30

Abstract: A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.

公开(公告)号：US12205906B2

公开(公告)日：2025-01-21

申请号：US18537638

申请日：2023-12-12

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Yuan-Hung Hsu ,  Chi-Jen Chen

IPC: H01L23/00 ,  H01L21/768 ,  H01L23/538

Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.

公开(公告)号：US20200168523A1

公开(公告)日：2020-05-28

申请号：US16533716

申请日：2019-08-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kuo-Hua Yu ,  Wen-Shan Tsai ,  En-Li Lin ,  Kaun-I Cheng ,  Wei-Ping Wang

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/48 ,  F28F13/18

Abstract: An electronic package is provided. A heat dissipator is bonded via a thermal interface layer to an electronic component disposed on a carrier. The heat dissipator has a concave-convex structure to increase a heat-dissipating area of the thermal interface layer. Therefore, the heat dissipator has a better heat-dissipating effect.

公开(公告)号：US12278189B2

公开(公告)日：2025-04-15

申请号：US18376652

申请日：2023-10-04

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/498

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

公开(公告)号：US20240038670A1

公开(公告)日：2024-02-01

申请号：US18376652

申请日：2023-10-04

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/5381 ,  H01L21/481 ,  H01L23/49833 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/5385 ,  H01L21/4853

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

公开(公告)号：US11810862B2

公开(公告)日：2023-11-07

申请号：US17978493

申请日：2022-11-01

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/5381 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5385 ,  H01L21/4853

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

公开(公告)号：US20230014476A1

公开(公告)日：2023-01-19

申请号：US17850527

申请日：2022-06-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L23/42 ,  H01L23/40 ,  H01L21/54 ,  H01L21/56

Abstract: An electronic package, in which a heat dissipation structure is disposed on a carrier structure to form a packaging space for electronic components to be accommodated in the packaging space, and the electronic components are completely encapsulated by a heat dissipation material to prevent the electronic components exposing from the heat dissipation material so as to improve the heat dissipation effect.

公开(公告)号：US20220406642A1

公开(公告)日：2022-12-22

申请号：US17392462

申请日：2021-08-03

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chih-Ming Huang ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L21/683 ,  H01L23/00

Abstract: A flip-chip process is to provide a pressing jig with a channel, so that the pressing jig grips a chip module by vacuum suction through the channel, and the chip module can be bonded onto a circuit board via a plurality of solder bumps through the pressing jig, and then a heating device is provided to heat the plurality of solder bumps and reflow the plurality of solder bumps. Therefore, the chip module can be vacuum-gripped by the pressing jig to suppress deformation of the chip module, so that the solder bumps can effectively connect to corresponding contacts of the circuit board.

公开(公告)号：US11482470B2

公开(公告)日：2022-10-25

申请号：US16872740

申请日：2020-05-12

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Yuan-Hung Hsu

IPC: H01L23/433 ,  H01L21/48 ,  H01L23/00

Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.