公开(公告)号：US10950520B2

公开(公告)日：2021-03-16

申请号：US16533716

申请日：2019-08-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kuo-Hua Yu ,  Wen-Shan Tsai ,  En-Li Lin ,  Kaun-I Cheng ,  Wei-Ping Wang

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/48 ,  F28F13/18

Abstract: An electronic package is provided. A heat dissipator is bonded via a thermal interface layer to an electronic component disposed on a carrier. The heat dissipator has a concave-convex structure to increase a heat-dissipating area of the thermal interface layer. Therefore, the heat dissipator has a better heat-dissipating effect.

公开(公告)号：US20140099755A1

公开(公告)日：2014-04-10

申请号：US13729918

申请日：2012-12-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ping Kai Cheng ,  Wen-Shan Tsai

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A fabrication method of a stacked package structure is provided, which includes the steps of: providing a substrate having at least a semiconductor device disposed thereon; and disposing a semiconductor package on the substrate through a plurality of conductive elements such that the semiconductor device is located between the substrate and the semiconductor package, and forming an encapsulant between the substrate and the semiconductor package to encapsulate the semiconductor device. The encapsulant can be formed on the semiconductor package first and then laminated on the substrate to encapsulate the semiconductor device, or alternatively the encapsulant can be filled between the substrate and the semiconductor package driven by a capillary force after the semiconductor package is disposed on the substrate. Therefore, the present invention alleviates pressure and temperature effects on the package to prevent warpage of the substrate and facilitate fabrication of multi-layer stacked package structures.

Abstract translation: 提供了一种堆叠封装结构的制造方法，其包括以下步骤：提供至少设置有半导体器件的衬底; 以及通过多个导电元件将半导体封装设置在所述衬底上，使得所述半导体器件位于所述衬底和所述半导体封装之间，以及在所述衬底和所述半导体封装之间形成密封剂以封装所述半导体器件。 首先可以在半导体封装上形成密封剂，然后层压在衬底上以封装半导体器件，或者可选地，在将半导体封装设置在衬底上之后，密封剂可以填充在由毛细管力驱动的衬底和半导体封装之间 。 因此，本发明减轻了对包装件的压力和温度影响，以防止衬底的翘曲并且有利于多层堆叠包装结构的制造。

公开(公告)号：US10600708B2

公开(公告)日：2020-03-24

申请号：US16170904

申请日：2018-10-25

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wen-Shan Tsai ,  Chee-Key Chung ,  Chang-Fu Lin

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing on a carrier an electronic component having a plurality of conductors, encapsulating the electronic component with an encapsulant, and disposing an electronic device on the encapsulant. The electronic device and the carrier are electrically connected through the conductors, thereby reducing the overall thickness of the electronic package.

公开(公告)号：US20190057917A1

公开(公告)日：2019-02-21

申请号：US15860222

申请日：2018-01-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wen-Shan Tsai ,  Chee-Key Chung ,  Chang-Fu Lin

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/29 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48

Abstract: An electronic package and a method of fabricating the same are provided. The method includes disposing an electronic component on a first side of an interposer, forming a first encapsulant on the first side of the interposer to encapsulate the electronic component, forming a plurality of conductive elements on a second side of the interposer, and forming a second encapsulant on the second side of the interposer to encapsulate the conductive elements. During thermal cycling of the electronic package, shrinkage forces of the first encapsulant and the second encapsulant can offset each other so as to mitigate warping of the interposer.

公开(公告)号：US20200168523A1

公开(公告)日：2020-05-28

申请号：US16533716

申请日：2019-08-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kuo-Hua Yu ,  Wen-Shan Tsai ,  En-Li Lin ,  Kaun-I Cheng ,  Wei-Ping Wang

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/48 ,  F28F13/18

Abstract: An electronic package is provided. A heat dissipator is bonded via a thermal interface layer to an electronic component disposed on a carrier. The heat dissipator has a concave-convex structure to increase a heat-dissipating area of the thermal interface layer. Therefore, the heat dissipator has a better heat-dissipating effect.

公开(公告)号：US20190164861A1

公开(公告)日：2019-05-30

申请号：US16170904

申请日：2018-10-25

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wen-Shan Tsai ,  Chee-Key Chung ,  Chang-Fu Lin

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing on a carrier an electronic component having a plurality of conductors, encapsulating the electronic component with an encapsulant, and disposing an electronic device on the encapsulant. The electronic device and the carrier are electrically connected through the conductors, thereby reducing the overall thickness of the electronic package.