公开(公告)号：US10818515B2

公开(公告)日：2020-10-27

申请号：US16196503

申请日：2018-11-20

申请人： Siliconware Precision Industries Co., Ltd.

发明人： Yu-Wei Yeh ,  Yen-Hung Lin ,  Chih-Yi Liao ,  Chih-Hsien Chiu

IPC分类号： H01L21/48 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L25/065 ,  H01L23/00

摘要： The present disclosure provides an electronic package and a method for fabricating the same. A protective layer is formed on a carrier of the electronic component. The electronic component and the protective layer are covered by a covering layer. A through hole is formed in the covering layer and extends through the protective layer, such that a portion of a surface of the carrier is exposed to the through hole. A conductive structure is disposed in the through hole and electrically connected with the carrier. Through the formation of the protective layer, the buffering effect of the protective layer can prevent the laser from directly burning through the covering layer and the protective layer to avoid damages to the carrier.