公开(公告)号：US20200090952A1

公开(公告)日：2020-03-19

申请号：US16196503

申请日：2018-11-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Wei Yeh ,  Yen-Hung Lin ,  Chih-Yi Liao ,  Chih-Hsien Chiu

IPC: H01L21/48 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56

Abstract: The present disclosure provides an electronic package and a method for fabricating the same. A protective layer is formed on a carrier of the electronic component. The electronic component and the protective layer are covered by a covering layer. A through hole is formed in the covering layer and extends through the protective layer, such that a portion of a surface of the carrier is exposed to the through hole. A conductive structure is disposed in the through hole and electrically connected with the carrier. Through the formation of the protective layer, the buffering effect of the protective layer can prevent the laser from directly burning through the covering layer and the protective layer to avoid damages to the carrier.

公开(公告)号：US20200251395A1

公开(公告)日：2020-08-06

申请号：US16460766

申请日：2019-07-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Chiang He ,  Yu-Wei Yeh ,  Chia-Yang Chen ,  Chih-Yi Liao ,  Chih-Hsien Chiu ,  Chang-Chao Su

IPC: H01L23/31 ,  H01L23/498

Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulating layer encapsulates the electronic component and the conductive elements. The encapsulating layer is formed with recessed portions corresponding in position to the conductive elements. A gap is formed between the conductive elements and the recessed portions.

公开(公告)号：US20210351097A1

公开(公告)日：2021-11-11

申请号：US17241199

申请日：2021-04-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Chiang He ,  Yu-Wei Yeh ,  Chia-Yang Chen ,  Chih-Yi Liao ,  Chih-Hsien Chiu ,  Chang-Chao Su

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538 ,  H01L21/768

Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulation layer encapsulates the electronic component and the conductive elements. The encapsulation layer has concave portions corresponding in position to the conductive elements. Each of the conductive elements is in no contact with corresponding one of the concave portions.

公开(公告)号：US20210005524A1

公开(公告)日：2021-01-07

申请号：US16793667

申请日：2020-02-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Chiang He ,  Yu-Wei Yeh ,  Chia-Yang Chen ,  Chih-Yi Liao ,  Chih-Hsien Chiu ,  Chang-Chao Su

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/768 ,  H01L23/498 ,  H01L23/538

Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulation layer encapsulates the electronic component and the conductive elements. The encapsulation layer has concave portions corresponding in position to the conductive elements. Each of the conductive elements is in no contact with corresponding one of the concave portions.

公开(公告)号：US10818515B2

公开(公告)日：2020-10-27

申请号：US16196503

申请日：2018-11-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Wei Yeh ,  Yen-Hung Lin ,  Chih-Yi Liao ,  Chih-Hsien Chiu

IPC: H01L21/48 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L25/065 ,  H01L23/00

Abstract: The present disclosure provides an electronic package and a method for fabricating the same. A protective layer is formed on a carrier of the electronic component. The electronic component and the protective layer are covered by a covering layer. A through hole is formed in the covering layer and extends through the protective layer, such that a portion of a surface of the carrier is exposed to the through hole. A conductive structure is disposed in the through hole and electrically connected with the carrier. Through the formation of the protective layer, the buffering effect of the protective layer can prevent the laser from directly burning through the covering layer and the protective layer to avoid damages to the carrier.