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公开(公告)号：US12057409B2
公开(公告)日：2024-08-06
申请号：US17571901
申请日：2022-01-10
发明人： Chih-Hsien Chiu , Wen-Jung Tsai , Chien-Cheng Lin , Ko-Wei Chang , Yu-Wei Yeh , Shun-Yu Chien , Chia-Yang Chen
IPC分类号： H01L23/00 , H01L23/16 , H01L23/31 , H01L23/498 , H01L23/58
CPC分类号： H01L23/562 , H01L23/3121 , H01L23/49822
摘要： An electronic package and a manufacturing method of the electronic package are provided, in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure nor cover the electronic component is embedded in the packaging layer.
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公开(公告)号：US20230154873A1
公开(公告)日：2023-05-18
申请号：US18097965
申请日：2023-01-17
发明人： Chih-Hsien Chiu , Ko-Wei CHANG
CPC分类号： H01L23/645 , H01L24/16 , H01L23/3128 , H01L23/49838 , H01L21/4853 , H01L21/565 , H01L28/10 , H01L2924/19103 , H01L2224/16227 , H01L2924/19042
摘要： An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.
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公开(公告)号：US11587892B2
公开(公告)日：2023-02-21
申请号：US17159527
申请日：2021-01-27
发明人： Chih-Hsien Chiu , Ko-Wei Chang
IPC分类号： H01L25/065 , H01L23/64 , H01L23/00 , H01L23/31 , H01L23/498 , H01L21/48 , H01L21/56 , H01L49/02
摘要： An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.
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公开(公告)号：US11476572B2
公开(公告)日：2022-10-18
申请号：US16750459
申请日：2020-01-23
发明人： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC分类号： H01Q1/52 , H01Q9/42 , H01Q1/24 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/552 , H01L23/66 , H01Q1/22 , H01Q1/48
摘要： An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
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公开(公告)号：US20210375783A1
公开(公告)日：2021-12-02
申请号：US16931180
申请日：2020-07-16
发明人： Chih-Hsien Chiu , Wen-Jung Tsai , Yu-Wei Yeh , Tsung-Hsien Tsai , Chi-Liang Shih , Sheng-Ming Yang , Ping-Hung Liao
IPC分类号： H01L23/552 , H01L23/00 , H01L23/31 , H01L23/498
摘要： An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.
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公开(公告)号：US11069633B2
公开(公告)日：2021-07-20
申请号：US16028798
申请日：2018-07-06
IPC分类号： H01L23/66 , H01L23/498 , H01L23/552 , H01L23/04 , H01Q1/22 , H01Q1/52 , H01Q1/24 , H01Q9/42 , H01L23/31 , H01L23/00
摘要： The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.
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公开(公告)号：US10916526B2
公开(公告)日：2021-02-09
申请号：US16837470
申请日：2020-04-01
发明人： Chih-Hsien Chiu , Chia-Yang Chen , Chih-Chiang He
IPC分类号： H01L25/065 , H01L25/00 , H01L25/10 , H01L25/16
摘要： A method for fabricating an electronic package includes providing a metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate. A circuit structure is coupled to the conductive pillars. An electronic component is disposed on the metal member and electrically connected to the circuit structure. An encapsulant encapsulates the conductive pillars and the electronic component. Subsequently, the supporting plate is removed. Any mold can be used for fabricating the electronic package, no matter what the size of the electronic package is. Therefore, the fabricating cost of the electronic package is reduced.
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公开(公告)号：US20200227390A1
公开(公告)日：2020-07-16
申请号：US16837470
申请日：2020-04-01
发明人： Chih-Hsien Chiu , Chia-Yang Chen , Chih-Chiang He
IPC分类号： H01L25/065 , H01L25/00 , H01L25/10 , H01L25/16
摘要： A method for fabricating an electronic package includes providing a metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate. A circuit structure is coupled to the conductive pillars. An electronic component is disposed on the metal member and electrically connected to the circuit structure. An encapsulant encapsulates the conductive pillars and the electronic component. Subsequently, the supporting plate is removed. Any mold can be used for fabricating the electronic package, no matter what the size of the electronic package is. Therefore, the fabricating cost of the electronic package is reduced.
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公开(公告)号：US20190279937A1
公开(公告)日：2019-09-12
申请号：US15993108
申请日：2018-05-30
发明人： Chih-Hsien Chiu , Chia-Yang Chen
IPC分类号： H01L23/538 , H01L23/31 , H01L23/552 , H01L23/00 , H01L25/10 , H01L21/48 , H01L21/56 , H01L25/00
摘要： An electronic package is provided. An electronic component and a plurality of conductive pillars are provided on a carrier structure. An encapsulation layer encapsulates the electronic component and the conductive pillars. Each of the conductive pillars has a peripheral surface narrower than two end surfaces of the conductive pillar. Therefore, the encapsulation layer is better bonded to the conductive pillars. A method for fabricating the electronic package is also provided.
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公开(公告)号：US09907186B1
公开(公告)日：2018-02-27
申请号：US15607872
申请日：2017-05-30
发明人： Chih-Hsien Chiu , Chen-Wen Huang , Hsin-Lung Chung , Wen-Jung Tsai , Jia-Huei Hung , Fu-Tang Huang
IPC分类号： H01L23/495 , H05K3/32 , H01L23/00 , H01L23/373 , H01L21/48
CPC分类号： H05K3/323 , H01L21/4853 , H01L23/373 , H01L24/73
摘要： An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.
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