公开(公告)号：US10818515B2

公开(公告)日：2020-10-27

申请号：US16196503

申请日：2018-11-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Wei Yeh ,  Yen-Hung Lin ,  Chih-Yi Liao ,  Chih-Hsien Chiu

IPC: H01L21/48 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L25/065 ,  H01L23/00

Abstract: The present disclosure provides an electronic package and a method for fabricating the same. A protective layer is formed on a carrier of the electronic component. The electronic component and the protective layer are covered by a covering layer. A through hole is formed in the covering layer and extends through the protective layer, such that a portion of a surface of the carrier is exposed to the through hole. A conductive structure is disposed in the through hole and electrically connected with the carrier. Through the formation of the protective layer, the buffering effect of the protective layer can prevent the laser from directly burning through the covering layer and the protective layer to avoid damages to the carrier.

公开(公告)号：US20200090952A1

公开(公告)日：2020-03-19

申请号：US16196503

申请日：2018-11-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Wei Yeh ,  Yen-Hung Lin ,  Chih-Yi Liao ,  Chih-Hsien Chiu

IPC: H01L21/48 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56

Abstract: The present disclosure provides an electronic package and a method for fabricating the same. A protective layer is formed on a carrier of the electronic component. The electronic component and the protective layer are covered by a covering layer. A through hole is formed in the covering layer and extends through the protective layer, such that a portion of a surface of the carrier is exposed to the through hole. A conductive structure is disposed in the through hole and electrically connected with the carrier. Through the formation of the protective layer, the buffering effect of the protective layer can prevent the laser from directly burning through the covering layer and the protective layer to avoid damages to the carrier.

公开(公告)号：US20180096967A1

公开(公告)日：2018-04-05

申请号：US15435437

申请日：2017-02-17

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wen-Jung Tsai ,  Cheng-Kai Chang ,  Yen-Hung Lin ,  Hsin-Lung Chung

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/58 ,  H01L25/00

CPC classification number: H01L25/0652 ,  H01L23/13 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49805 ,  H01L23/538 ,  H01L23/552 ,  H01L23/585 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic package structure is provided, which includes: a plurality of first and second electronic components disposed on opposite sides of a carrier; a blocking member formed between adjacent two of the first electronic components; an encapsulant encapsulating the first and second electronic components and the blocking member; and a shielding element formed on the encapsulant to improve the electromagnetic shielding effect. The present disclosure further provides a method for fabricating the electronic package structure.