公开(公告)号：US20030143406A1

公开(公告)日：2003-07-31

申请号：US10066245

申请日：2002-01-31

Applicant: STMicroelectronics, Inc.

Inventor： Harry Michael Siegel ,  Anthony M. Chiu

IPC: B32B009/04 ,  B29C045/00

CPC classification number: H01L21/566 ,  H01L23/3107 ,  H01L2924/0002 ,  Y10T428/31663 ,  H01L2924/00

Abstract: A system and method is disclosed for using a pre-formed film in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit with a molding compound. A film of compliant material is pre-formed to conform the shape of the film to a mold cavity surface of the transfer mold. The pre-formed film is then placed adjacent to the surfaces of the mold cavity of the transfer mold. The mold cavity is filled with molding compound and the integrated circuit is encapsulated. The pre-formation of the film allows materials to be used that are not suitable for use with prior art methods.

Abstract translation: 公开了一种用于在传递模塑工艺中使用预成型膜的系统和方法，该方法使用转移模具将模制化合物的集成电路的部分封装。 预先形成柔顺材料薄膜以使膜的形状符合转移模具的模腔表面。 然后将预成型的膜放置在传送模具的模腔的表面附近。 模腔充满模塑料，集成电路封装。 该膜的预成型允许使用不适用于现有技术方法的材料。

公开(公告)号：US20030140678A1

公开(公告)日：2003-07-31

申请号：US10062595

申请日：2002-01-31

Applicant: STMicroelectronics, Inc.

Inventor： Harry Michael Siegel ,  Anthony M. Chiu

IPC: B21J013/04

CPC classification number: H01L21/52 ,  H01L23/544 ,  H01L24/48 ,  H01L24/83 ,  H01L2223/54473 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A system and method is disclosed for aligning an integrated circuit die on an integrated circuit substrate. A plurality of deposits of deformable material are placed on the substrate where the integrated circuit die is to be aligned. In one advantageous embodiment a stamping tool is indexed to a first tooling hole and to a second tooling hole in the substrate. The stamping tool imprints the deposits of deformable material to a tolerance of less than one hundred microns with respect to the first and second tooling holes. The imprinted portions of the deposits to form a pocket for receiving the integrated circuit die. This enables the integrated circuit die to be precisely aligned on the substrate in three dimensions.

Abstract translation: 公开了用于使集成电路基板上的集成电路管芯对准的系统和方法。 将多个可变形材料的沉积物放置在集成电路芯片对准的基板上。 在一个有利的实施例中，冲压工具被转位到第一工具孔和衬底中的第二工具孔。 冲压工具将可变形材料的沉积物相对于第一和第二工具孔印刷到小于百微米的公差。 沉积物的印迹部分形成用于接收集成电路管芯的口袋。 这使得集成电路管芯能够在三维尺寸上精确地对准衬底。