公开(公告)号：US20140291812A1

公开(公告)日：2014-10-02

申请号：US13853856

申请日：2013-03-29

Applicant: STMICROELECTRONICS PTE LTD.

Inventor： Kim-Yong Goh ,  Xueren Zhang ,  Yiyi Ma

IPC: H01L29/06 ,  H01L21/50 ,  H01L21/78

CPC classification number: H01L21/78 ,  B81B7/0048 ,  H01L23/053 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/29198 ,  H01L2224/32058 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83007 ,  H01L2924/00014 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/16151 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhesive material, thus increasing adhesion between the electric device and a substrate of the package while at the same time allowing for lower adhesive fillets.

Abstract translation: 实施例涉及包括具有凹部的电气装置的包装。 在一个实施例中，电气设备是传感器，并且凹部减小由于封装的热膨胀引起的传感器的信号漂移。 在另一个实施例中，凹部基本上填充有粘合剂材料，从而增加了电子装置与包装的基底之间的粘合性，同时允许较低的粘合剂片。