公开(公告)号：US20210206625A1

公开(公告)日：2021-07-08

申请号：US17208918

申请日：2021-03-22

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Dario PACI ,  Domenico GIUSTI ,  Irene MARTINI

IPC: B81B3/00 ,  H04N5/232 ,  H04N5/225 ,  B81B7/02

Abstract: A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction.

公开(公告)号：US20210166949A1

公开(公告)日：2021-06-03

申请号：US17108471

申请日：2020-12-01

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics (Malta) Ltd

Inventor： Roseanne DUCA ,  Dario PACI ,  Pierpaolo RECANATINI

IPC: H01L21/324 ,  H01L23/16 ,  H01L23/31

Abstract: A leadframe includes a die pad and a set of electrically conductive leads. A semiconductor die, having a front surface and a back surface opposed to the front surface, is arranged on the die pad with the front surface facing away from the die pad. The semiconductor die is electrically coupled to the electrically conductive leads. A package molding material is molded over the semiconductor die arranged on the die pad. A stress absorbing material contained within a cavity delimited by a peripheral wall on the front surface of the semiconductor die is positioned intermediate at least one selected portion of the front surface of the semiconductor die and the package molding material.

公开(公告)号：US20200326530A1

公开(公告)日：2020-10-15

申请号：US16847514

申请日：2020-04-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Dario PACI ,  Lorenzo BALDO ,  Domenico GIUSTI

IPC: G02B26/08 ,  B81B3/00 ,  H01L27/146

Abstract: A MEMS optical device including: a semiconductor body; a main cavity, which extends within the semiconductor body; a membrane suspended over the main cavity; a piezoelectric actuator, which is mechanically coupled to the membrane and can be electronically controlled so as to deform the membrane; a micro-lens, mechanically coupled to the membrane so as to undergo deformation following the deformation of the membrane; and a rigid optical element, which contacts the micro-lens and is arranged so that the micro-lens is interposed between the rigid optical element and the membrane. The micro-lens and the main cavity are arranged on opposite sides of the membrane.

公开(公告)号：US20150082856A1

公开(公告)日：2015-03-26

申请号：US14498966

申请日：2014-09-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Dario PACI ,  Francesco PROCOPIO ,  Carlo VALZASINA ,  Paolo ANGELINI ,  Francesco DIAZZI ,  Roberto Pio BAORDA ,  Danilo Karim KADDOURI

IPC: G01D18/00 ,  H05B3/16 ,  G01K13/00

CPC classification number: G01D18/00 ,  B81B2207/012 ,  B81B2207/03 ,  B81C99/003 ,  G01K13/00 ,  G01R33/0017 ,  G01R33/09 ,  H05B3/16

Abstract: An integrated sensor device including a first die, housing a sensor element to detect a quantity external to the sensor device and transduce the external quantity into an electrical sensing signal; a second die mechanically coupled to the first die so that the first and second dies are stacked on one another along one and the same axis; and at least one heater of a resistive type integrated in the first die and/or in the second die, having a first conduction terminal and a second conduction terminal configured to couple respective first and second conduction terminals of a signal generator for causing an electric current to flow, in use, between the first and second conduction terminals of the heater and generate heat by the Joule effect. It is possible to carry out calibration in temperature of the sensor element.

Abstract translation: 一种集成传感器装置，包括第一管芯，容纳传感器元件以检测传感器装置外部的量并将外部量转换成电感测信号; 机械地耦合到第一模具的第二模具，使得第一和第二模具沿着同一轴线彼此堆叠; 以及集成在第一管芯和/或第二管芯中的至少一个电阻型加热器，具有第一导电端子和第二导电端子，该第二导电端子被配置为耦合信号发生器的相应的第一和第二导电端子，用于引起电流 在使用中在加热器的第一和第二导电端子之间流动，并通过焦耳效应产生热量。 可以在传感器元件的温度下进行校准。