公开(公告)号：US20220238485A1

公开(公告)日：2022-07-28

申请号：US17580480

申请日：2022-01-20

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Dario PACI ,  Silvia ADORNO ,  Marco DEL SARTO ,  Fabrizio CERINI ,  Alex GRITTI

IPC: H01L25/065 ,  H01L23/64 ,  H01L23/00 ,  H01L23/538

Abstract: A packaged electronic system having a support formed by an insulating organic substrate housing a buried conductive region that is floating. A first die is fixed to the support and carries, on a first main surface, a first die contact region capacitively coupled to a first portion of the buried conductive region. A second die is fixed to the support and carries, on a first main surface, a second die contact region capacitively coupled to a second portion of the buried conductive region. A packaging mass encloses the first die, the second die, the first die contact region, the second die contact region, and, at least partially, the support.

公开(公告)号：US20190127214A1

公开(公告)日：2019-05-02

申请号：US16165828

申请日：2018-10-19

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Dario PACI ,  Marco FERRERA ,  Andrea PICCO

IPC: B81B3/00 ,  B81C1/00 ,  H01L41/09 ,  H01L25/16 ,  H01L41/31

Abstract: A MEMS device comprising a body, having a first surface and a second surface; a diaphragm cavity in the body extending from the second surface of the body; a deformable portion in the body between the first surface and the diaphragm cavity; and a piezoelectric actuator, extending on the first surface of the body, over the deformable portion. The MEMS device is characterized in that it comprises a recess structure extending in the body and delimiting a stopper portion for the deformable portion.

公开(公告)号：US20230204974A1

公开(公告)日：2023-06-29

申请号：US18111073

申请日：2023-02-17

Applicant: STMicroelectronics S.r.l.

Inventor： Domenico GIUSTI ,  Dario PACI

IPC: G02B27/64 ,  G03B5/06 ,  H02N2/02 ,  H02N2/00 ,  B81B3/00 ,  H10N30/01 ,  H10N30/20

CPC classification number: G02B27/646 ,  B81B3/0021 ,  G03B5/06 ,  H02N2/22 ,  H02N2/028 ,  H10N30/01 ,  H10N30/2044 ,  B81B2201/032 ,  B81B2201/047 ,  B81B2203/053 ,  B81B2203/058 ,  G03B2205/0023

Abstract: A method of making a MEMS actuator with a monolithic body of semiconductor material includes forming a supporting portion of semiconductor material, orientable with respect to first and second rotation axes, the first rotation axis being transverse with respect to the second rotation axis, and forming a first frame of semiconductor material. The method further includes forming first deformable elements, of semiconductor material, coupled to the first frame, and configured to control a rotation of the supporting portion about the first rotation axis. The method also includes forming a second frame of semiconductor material, and forming second deformable elements, of semiconductor material, coupled to the first frame and to the second frame, and configured to control a rotation of the supporting portion about the second rotation axis. The first and second deformable elements are formed to carry respective first and second piezoelectric actuation elements.

公开(公告)号：US20210296578A1

公开(公告)日：2021-09-23

申请号：US17343388

申请日：2021-06-09

Applicant: STMicroelectronics S.r.l.

Inventor： Dario PACI ,  Marco MORELLI ,  Caterina RIVA

IPC: H01L43/12 ,  B82Y25/00 ,  G01R33/09 ,  H01L27/22 ,  G01R33/00 ,  H01L43/08 ,  G01R33/02

Abstract: An integrated magnetoresistive device includes a substrate of semiconductor material that is covered, on a first surface, by an insulating layer. A magnetoresistor of ferromagnetic material extends within the insulating layer and defines a sensitivity plane of the sensor. A concentrator of ferromagnetic material includes at least one arm that extends in a transversal direction to the sensitivity plane and is vertically offset from the magnetoresistor. The concentrator concentrates deflects magnetic flux lines perpendicular to the sensitivity plane so as to generate magnetic-field components directed in a parallel direction to the sensitivity plane.

公开(公告)号：US20230005755A1

公开(公告)日：2023-01-05

申请号：US17942843

申请日：2022-09-12

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics (MALTA) Ltd

Inventor： Roseanne DUCA ,  Dario PACI ,  Pierpaolo RECANATINI

IPC: H01L21/324 ,  H01L23/16 ,  H01L23/31

Abstract: A leadframe includes a die pad and a set of electrically conductive leads. A semiconductor die, having a front surface and a back surface opposed to the front surface, is arranged on the die pad with the front surface facing away from the die pad. The semiconductor die is electrically coupled to the electrically conductive leads. A package molding material is molded over the semiconductor die arranged on the die pad. A stress absorbing material contained within a cavity delimited by a peripheral wall on the front surface of the semiconductor die is positioned intermediate at least one selected portion of the front surface of the semiconductor die and the package molding material.

公开(公告)号：US20200371376A1

公开(公告)日：2020-11-26

申请号：US16880141

申请日：2020-05-21

Applicant: STMicroelectronics S.r.l.

Inventor： Domenico GIUSTI ,  Dario PACI

IPC: G02B27/64 ,  H02N2/02 ,  H02N2/00 ,  G03B5/06

Abstract: A MEMS actuator includes a monolithic body of semiconductor material, with a supporting portion of semiconductor material, orientable with respect to a first and second rotation axes, transverse to each other. A first frame of semiconductor material is coupled to the supporting portion through first deformable elements configured to control a rotation of the supporting portion about the first rotation axis. A second frame of semiconductor material is coupled to the first frame by second deformable elements, which are coupled between the first and the second frames and configured to control a rotation of the supporting portion about the second rotation axis. The first and second deformable elements carry respective piezoelectric actuation elements.

公开(公告)号：US20190219642A1

公开(公告)日：2019-07-18

申请号：US16367109

申请日：2019-03-27

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Dario PACI

IPC: G01R33/00 ,  G01R33/09 ,  H01L43/12 ,  H01L43/08

CPC classification number: G01R33/0011 ,  G01R33/0052 ,  G01R33/093 ,  G01R33/096 ,  H01L43/08 ,  H01L43/12

Abstract: An AMR-type integrated magnetoresistive sensor sensitive to perpendicular magnetic fields is formed on a body of semiconductor material covered by an insulating region. The insulating region houses a set/reset coil and a magnetoresistor arranged on the set/reset coil. The magnetoresistor is formed by a magnetoresistive strip of an elongated shape parallel to the preferential magnetization direction. A concentrator of ferromagnetic material is arranged on top of the insulating region as the last element of the sensor and is formed by a plurality of distinct ferromagnetic regions aligned parallel to the preferential magnetization direction.

公开(公告)号：US20220123105A1

公开(公告)日：2022-04-21

申请号：US17494475

申请日：2021-10-05

Applicant: STMicroelectronics S.r.l.

Inventor： Fabrizio CERINI ,  Silvia ADORNO ,  Dario PACI ,  Marco SALINA

IPC: H01L49/02 ,  H01L23/522

Abstract: An electrode structure includes a pad of conductive material, and a conductive strip having a first end physically and electrically coupled to the pad. The pad includes an annular element internally defining a through opening. The first end of the conductive strip is physically and electrically coupled to the annular element by a transition region so that, when the conductive strip undergoes expansion by the thermal effect, a stress spreads from the conductive strip to the annular element by the transition region.

公开(公告)号：US20190195964A1

公开(公告)日：2019-06-27

申请号：US16290778

申请日：2019-03-01

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giacomo LAGHI ,  Giacomo LANGFELDER ,  Gabriele GATTERE ,  Alessandro TOCCHIO ,  Dario PACI

IPC: G01R33/02 ,  G01R33/00 ,  G01R33/028 ,  G01R33/038

Abstract: A MEMS triaxial magnetic sensor device includes a sensing structure having: a substrate; an outer frame, which internally defines a window and is elastically coupled to first anchorages fixed with respect to the substrate by first elastic elements; a mobile structure arranged in the window, suspended above the substrate, which is elastically coupled to the outer frame by second elastic elements and carries a conductive path for flow of an electric current; and an elastic arrangement operatively coupled to the mobile structure. The mobile structure performs, due to the first and second elastic elements and the arrangement of elastic elements, first, second, and third sensing movements in response to Lorentz forces from first, second, and third magnetic-field components, respectively. The first, second, and third sensing movements are distinct and decoupled from one another.

公开(公告)号：US20180335326A1

公开(公告)日：2018-11-22

申请号：US16049262

申请日：2018-07-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Dario PACI ,  Francesco PROCOPIO ,  Carlo VALZASINA ,  Paolo ANGELINI ,  Francesco DIAZZI ,  Roberto Pio BAORDA ,  Danilo Karim KADDOURI

IPC: G01D18/00 ,  H05B3/16 ,  G01R33/09 ,  G01R33/00 ,  G01K13/00 ,  B81C99/00

CPC classification number: G01D18/00 ,  B81B2207/012 ,  B81B2207/03 ,  B81C99/003 ,  G01K13/00 ,  G01R33/0017 ,  G01R33/09 ,  H05B3/16

Abstract: An integrated sensor device including a first die, housing a sensor element to detect a quantity external to the sensor device and transduce the external quantity into an electrical sensing signal; a second die mechanically coupled to the first die so that the first and second dies are stacked on one another along one and the same axis; and at least one heater of a resistive type integrated in the first die and/or in the second die, having a first conduction terminal and a second conduction terminal configured to couple respective first and second conduction terminals of a signal generator for causing an electric current to flow, in use, between the first and second conduction terminals of the heater and generate heat by the Joule effect. It is possible to carry out calibration in temperature of the sensor element.