THIN FILM TRANSISTOR SUBSTRATE, RELATED MANUFACTURING METHOD, AND RELATED DISPLAY DEVICE

    公开(公告)号:US20190334002A1

    公开(公告)日:2019-10-31

    申请号:US16273029

    申请日:2019-02-11

    Abstract: A thin film transistor substrate may include a base substrate, a semiconductor member, a gate electrode, a first insulation layer, and a source/drain electrode. The semiconductor member may overlap the base substrate. The gate electrode may overlap the semiconductor member and may be insulated from the semiconductor member. The first insulation layer may be positioned on the gate electrode and may include a first contact hole. The source/drain electrode may include a first discharge hole, may be electrically connected to the semiconductor member, and may be at least partially positioned inside the first contact hole. The first discharge hole may partially expose the semiconductor member.

    ORGANIC LIGHT EMITTING DISPLAY APPARATUS
    13.
    发明申请

    公开(公告)号:US20170256747A1

    公开(公告)日:2017-09-07

    申请号:US15440868

    申请日:2017-02-23

    Abstract: An organic light emitting display apparatus includes first to eighth pixels arranged in a 4*2 matrix form along first and second directions, and includes a camera which is configured to take a picture. Each of the first to eighth pixels has a width in the first direction and has a length in the second direction. Each of the first to eighth pixels has a light emitting structure and a first mirror pattern which defines an opening which overlaps the light emitting structure. The first mirror pattern defines one transmission window in every two or more pixels adjacent each other, the transmission window passes light, and the camera is configured to take a picture through the transmission window.

    UNIT PIXEL AND ORGANIC LIGHT EMITTING DISPLAY DEVICE INCLUDING THE SAME

    公开(公告)号:US20180366530A1

    公开(公告)日:2018-12-20

    申请号:US15960111

    申请日:2018-04-23

    Abstract: A unit pixel includes a circuit structure, first and second wiring patterns, an interlayer insulating layer, a planarization layer, and a light emission structure. The first wiring pattern disposed on the circuit structure has a first bump structure. The interlayer insulating layer covers the circuit structure and the first wiring pattern. The second wiring pattern disposed on the interlayer insulating layer overlaps the first wiring pattern and has a second bump structure. The planarization layer covers the interlayer insulating layer and the second wiring pattern and includes a via-hole exposing at least a portion of be second wiring pattern. The light emission structure contacts the second wiring pattern through the via-hole. The first and second wiring patterns and the interlayer insulating layer form a capacitor, the light emission structure includes an OLED, and the capacitor is directly connected to an anode of the OLED.

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