公开(公告)号：US20220231430A1

公开(公告)日：2022-07-21

申请号：US17713453

申请日：2022-04-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Ji Hyung JUNG ,  Chin Mo KIM ,  Sung Nam CHO ,  Sung Yong AN

IPC: H01Q21/06 ,  H01Q1/52 ,  H01Q1/22 ,  H01Q1/38

Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

公开(公告)号：US20220102872A1

公开(公告)日：2022-03-31

申请号：US17547633

申请日：2021-12-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ju Hyoung PARK ,  Kyu Bum HAN ,  Jae Yeong KIM ,  Jeong Ki RYOO ,  Sung Nam CHO ,  Sung Yong AN

IPC: H01Q21/00 ,  H01Q21/06 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q19/10 ,  H01Q9/04

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.

公开(公告)号：US20220029274A1

公开(公告)日：2022-01-27

申请号：US17499212

申请日：2021-10-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Sung Nam CHO ,  Sung Yong AN ,  Ji Hyung JUNG ,  Chin Mo KIM

IPC: H01Q1/22 ,  H01Q21/06 ,  H01Q1/48 ,  H01Q1/38 ,  H01Q9/40 ,  H01Q9/04

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.

公开(公告)号：US20210066814A1

公开(公告)日：2021-03-04

申请号：US16732661

申请日：2020-01-02

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Ji Hyung JUNG ,  Chin Mo KIM ,  Sung Nam CHO ,  Sung Yong AN

IPC: H01Q21/06 ,  H01Q1/38 ,  H01Q1/22 ,  H01Q1/52

Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

公开(公告)号：US20210066782A1

公开(公告)日：2021-03-04

申请号：US16743453

申请日：2020-01-15

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung Nam CHO ,  Sung Yong AN ,  Jae Yeong KIM ,  Ju Hyoung PARK

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q1/24

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.

公开(公告)号：US20210036407A1

公开(公告)日：2021-02-04

申请号：US16828788

申请日：2020-03-24

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chin Mo KIM ,  Sung Yong AN ,  Ji Hyung JUNG ,  Jae Yeong KIM ,  Ju Hyoung PARK ,  Sung Nam CHO

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q9/04 ,  H01Q21/08

Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.

公开(公告)号：US20200328530A1

公开(公告)日：2020-10-15

申请号：US16739177

申请日：2020-01-10

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Ju Hyoung PARK ,  Sung Yong AN ,  Myeong Woo HAN ,  Sung Nam CHO ,  Jae Yeong KIM

IPC: H01Q21/06

Abstract: A chip antenna module includes: a first dielectric layer; a first feed via extending through the first dielectric layer; a second feed via extending through the first dielectric layer; a first patch antenna pattern disposed on an upper surface of the first dielectric layer, electrically connected to the first feed via, and having a through-hole through which the second feed via passes; a second patch antenna pattern disposed above the first patch antenna pattern and electrically connected to the second feed via; and a second dielectric layer and a third dielectric layer, respectively located vertically between the first patch antenna pattern and the second patch antenna pattern, and having different dielectric constants that form a first dielectric constant boundary surface between the first and second patch antenna patterns.

公开(公告)号：US20230187832A1

公开(公告)日：2023-06-15

申请号：US17969888

申请日：2022-10-20

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chin Mo KIM ,  Juhyoung PARK ,  Hyunjun CHOI ,  Jae Yeong KIM ,  Sungyong AN

IPC: H01Q9/04

CPC classification number: H01Q9/045 ,  H01Q9/0414

Abstract: An antenna includes a first insulating layer; a second insulating layer disposed on the first insulating layer in a height direction; a third insulating layer disposed between the first and second insulating layers, a feed via including a first portion passing through the first insulating layer, a second portion passing through the second insulating layer, and a third portion passing through the third insulating layer and connected to the first and second portions; and an antenna patch disposed on the first insulating layer and fed from the feed via, wherein a permittivity of the third insulating layer is lower than permittivities of the first and second insulating layers, and in a direction perpendicular to the height direction, a width of the third portion is wider than a width of the first portion and/or a width of the second portion.

公开(公告)号：US20220216586A1

公开(公告)日：2022-07-07

申请号：US17343235

申请日：2021-06-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chin Mo KIM ,  Sungyong AN ,  Jae Yeong KIM

IPC: H01Q1/22 ,  H05K1/18 ,  H05K1/11 ,  H05K3/10 ,  H01Q9/04

Abstract: A chip antenna includes a substrate having a concavo-convex pattern on a surface thereof, and a conductor pattern disposed on the surface of the substrate having the concavo-convex pattern, wherein a convex portion extending in one direction and a concave portion extending in one direction are alternately disposed in the concavo-convex pattern.

公开(公告)号：US20200335870A1

公开(公告)日：2020-10-22

申请号：US16802798

申请日：2020-02-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Chin Mo KIM ,  Ji Hyung JUNG ,  Sung Nam CHO ,  Sung Yong AN

IPC: H01Q9/04 ,  H01Q1/38 ,  H01Q1/48

Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.