公开(公告)号：US10240002B2

公开(公告)日：2019-03-26

申请号：US15346876

申请日：2016-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Hongkyoon Choi ,  Chanjae Ahn ,  Hyunjeong Jeon ,  Sang Soo Jee ,  Sungwon Choi ,  Sung Woo Hong ,  Byunghee Sohn

IPC: C08G73/14 ,  B32B27/00 ,  C09D179/08 ,  C09J179/08 ,  C08G73/10

Abstract: A poly(imide-amide) copolymer including a structural unit represented by Chemical Formula 1; a structural unit represented by Chemical Formula 2; and any one of a structural unit represented by Chemical Formula 3, an amic acid precursor of the structural unit represented by Chemical Formula 3, and a combination thereof; wherein a cured material of the poly(imide-amide) copolymer may have a tensile modulus of greater than or equal to about 5.5 GPa, and a yellowness index of less than or equal to about 5: wherein, groups and variables in Chemical Formulae 1 and 3 are the same as described in the specification.

公开(公告)号：US09988493B2

公开(公告)日：2018-06-05

申请号：US14741959

申请日：2015-06-17

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Chanjae Ahn ,  Sungwon Choi ,  Sungwoo Hong ,  Byunghee Sohn ,  Sun Jin Song ,  Kyeong-sik Ju

IPC: C08G73/00 ,  C08G73/14 ,  C08G73/10

CPC classification number: C08G73/14 ,  C08G73/1039

Abstract: A poly(amide-imide) copolymer including a structural unit represented by Chemical Formula 1; a structural unit represented by Chemical Formula 2, and/or an amic acid precursor structural unit which forms the structural unit represented by Chemical Formula 2 through imidization; and a structural unit represented by Chemical Formula 3, and/or an amic acid precursor structural unit which forms the structural unit represented by Chemical Formula 3 through imidization, wherein the poly(amide-imide) copolymer has a modulus of greater than or equal to about 5.5 giga Pascals after being cured, a yellowness index YI of less than or equal to about 3.5, and an increase in yellowness index ΔYI of less than or equal to about 0.7 after being exposed to ultraviolet light for 72 hours: wherein in Chemical Formulae 1 to 3, groups and variables are the same as described in the specification.

公开(公告)号：US09975997B2

公开(公告)日：2018-05-22

申请号：US15081468

申请日：2016-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjeong Jeon ,  Min Sang Kim ,  Sang Soo Jee ,  Byunghee Sohn

IPC: C08G77/455 ,  C08G73/10 ,  C08G73/14 ,  C08G77/00 ,  C08L79/08

CPC classification number: C08G73/106 ,  C08G73/10 ,  C08G73/1007 ,  C08G73/1017 ,  C08G73/1039 ,  C08G73/1067 ,  C08G73/14 ,  C08G77/455 ,  C08G77/80 ,  C08L79/08 ,  C08L83/04

Abstract: A composition including a polyamic acid modified with an alkoxysilane group; and an oligo silica compound, wherein the polyamic acid modified with an alkoxysilane group includes a reaction product of (i) a condensation reaction product of an acid anhydride and a diamine, and (ii) a reactive organosilane compound, wherein the oligo silica compound includes a condensation reaction product of an organosilane diol and a an alkoxysilane compound, wherein an amount of silicon atoms in the composition is less than or equal to about 15 wt % based on a total weight of solid contents in the composition.