公开(公告)号：US12031032B2

公开(公告)日：2024-07-09

申请号：US17256467

申请日：2019-07-08

申请人： Mitsubishi Engineering-Plastics Corporation ,  Mitsubishi Chemical Corporation

发明人： Yasuyuki Irie ,  Satoshi Mochida ,  Takumi Watanabe ,  Noriaki Terada

IPC分类号： C08L69/00 ,  C08K5/42 ,  C08L9/00 ,  C08L27/12 ,  C08L33/08 ,  C08L83/04 ,  C08G77/00 ,  C08G77/16 ,  C08G77/18

CPC分类号： C08L83/04 ,  C08K5/42 ,  C08L9/00 ,  C08L27/12 ,  C08L33/08 ,  C08L69/00 ,  C08G77/16 ,  C08G77/18 ,  C08G77/80 ,  C08L2207/04 ,  C08L2207/53 ,  C08L69/00 ,  C08L83/04 ,  C08L51/04 ,  C08L27/18 ,  C08K5/42

摘要： A thermoplastic resin composition, may include a thermoplastic resin (A) and, per 100 parts by mass of the thermoplastic resin (A), from 0 to 0.2 parts by mass of a metal salt-containing flame retardant (B), and not less than 0.05 parts by mass and less than 3 parts by mass of an organopolysiloxane (C), wherein the organopolysiloxane (C) has a molecular weight distribution (Mw/Mn) in a range of from 1.01 to 1.4.

公开(公告)号：US20240201593A1

公开(公告)日：2024-06-20

申请号：US18284994

申请日：2022-03-30

申请人： NISSAN CHEMICAL CORPORATION

发明人： Satoshi TAKEDA ,  Wataru SHIBAYAMA ,  Shuhei SHIGAKI ,  Kodai KATO

IPC分类号： G03F7/11 ,  C08G77/00 ,  C08G77/14 ,  C09D183/06 ,  H01L21/027

CPC分类号： G03F7/11 ,  C08G77/14 ,  C09D183/06 ,  H01L21/0274 ,  C08G77/80

摘要： A composition forms a silicon-containing underlayer film, the composition being for forming a silicon-containing resist underlayer film that enables formation of a good resist pattern without pattern collapse even when having a thinner thickness compared to conventional products, such as a thickness of 10 nm or less. The composition for forming a silicon-containing underlayer film contains: [A] a polysiloxane having a weight average molecular weight of 1,800 or less as determined by gel permeation chromatography (GPC) analysis in terms of polystyrene, and the amount of a component having a molecular weight of more than 2,500 is less than 20% in an integral molecular weight distribution curve prepared by gel permeation chromatography (GPC) analysis in terms of polystyrene; and [B] a solvent.

公开(公告)号：US20240117143A1

公开(公告)日：2024-04-11

申请号：US18274768

申请日：2022-01-31

申请人： Bowling Green State University

发明人： Joseph Coy Furgal ,  Buddhima Rupasinghe

IPC分类号： C08J11/16 ,  C07F7/21 ,  C08G77/00 ,  C08G77/06

CPC分类号： C08J11/16 ,  C07F7/21 ,  C08G77/06 ,  C08G77/80 ,  C08J2383/04

摘要： Methods and kits for depolymerizing a siloxane polymer, and methods for recycling a material comprising silicone, are described.

公开(公告)号：US20240101764A1

公开(公告)日：2024-03-28

申请号：US18272440

申请日：2022-01-13

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Tatsuei HARA ,  Nobu KATO ,  Shigeru UBUKATA

IPC分类号： C08G77/20 ,  C08G77/00 ,  C08G77/08 ,  C08G77/12 ,  C08K3/36 ,  C08K5/3475 ,  C08L83/04

CPC分类号： C08G77/20 ,  C08G77/08 ,  C08G77/12 ,  C08G77/80 ,  C08K3/36 ,  C08K5/3475 ,  C08L83/04 ,  C08L2201/08

摘要： An oil-bleeding silicone rubber composition which comprises



100 parts by mass of (A) an organopolysiloxane containing an alkenyl group,
0.2-20 parts by mass of (B) an organohydrogenpolysiloxane containing a hydrogen atom bonded to a silicon atom,
(C) a catalyst based on a platinum-group metal, the amount of which is 0.5-500 ppm in terms of platinum-group metal amount (in mass) with respect to the total mass of the components (A) and (B),
1-10 parts by mass of (D) a specific phenyl-group-containing organopolysiloxane,
1-25 parts by mass of (E) a specific nonfunctional dimethylpolysiloxane, and
(F) a specific benzotriazole derivative, the amount of which is 2-100 mol per mol of the platinum atoms contained in the component (C).

The oil-bleeding silicone rubber composition gives cured objects having improved heat resistance, without containing any of conventional additives for improving heat resistance.

公开(公告)号：US11879060B2

公开(公告)日：2024-01-23

申请号：US16966501

申请日：2019-02-06

申请人： DOW TORAY CO., LTD. ,  DOW SILICONES CORPORATION

发明人： Randall G. Schmidt ,  Kasumi Takeuchi

IPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/00 ,  H01L33/56

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08G77/80 ,  H01L33/56 ,  C08L2205/025 ,  C08L2205/035

摘要： A curable silicone composition is disclosed. The curable silicone composition comprises: (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group in a molecule; (B) a branched organopolysiloxane represented by the average unit formula; (C) an organosiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having good mechanical properties and good retention of transparency under conditions of high temperature.

公开(公告)号：US20230399479A1

公开(公告)日：2023-12-14

申请号：US18035018

申请日：2021-11-12

申请人： DAICEL CORPORATION

发明人： Masashi YOKOYAMA

IPC分类号： C08J7/04 ,  C08G77/04 ,  C09D183/10 ,  H10K77/10

CPC分类号： C08J7/042 ,  C08G77/045 ,  C09D183/10 ,  H10K77/111 ,  C08G77/80

摘要： Provided is a laminated film having a high level of surface hardness and excellent bendability, and also having antifouling performance that hardly deteriorates. A laminated film 1 of the present disclosure includes: a support 10; and a resin layer 11 laminated on at least one surface of the support, in which the resin layer satisfies the following Conditions 1, 2 and 3: Condition 1: in a pencil hardness test with a load of 750 g, a pencil hardness is F or greater on a surface of the resin layer of the laminated film; Condition 2: in a cylindrical mandrel test, where the surface of the resin layer of the laminated film is bent into a convex shape, no cracks occur on the surface of the resin layer with a curvature radius of 5 mm; and Condition 3: a surface of the resin layer of the laminated film has a water contact angle of 95° or greater before subjected to a steel wool abrasion test, and a water contact angle on tested areas of the surface is 90° or greater after subjected to the test.

公开(公告)号：US20230383062A1

公开(公告)日：2023-11-30

申请号：US18010616

申请日：2021-06-15

申请人： ForSight Vision6, Inc.

发明人： Matthew Clarke ,  Robert Grubbs ,  Phil Costanzo

IPC分类号： C08G77/00 ,  G02B1/04

CPC分类号： C08G77/80 ,  G02B1/041

摘要： Described herein, inter alia, are fluorosilicone polymers; compositions comprising fluorosilicone polymers; and lenses comprising the polymers, and compositions.

公开(公告)号：US11781016B2

公开(公告)日：2023-10-10

申请号：US17174480

申请日：2021-02-12

申请人： DuPont Toray Specialty Materials Kabushiki Kaisha ,  Rohm and Haas Electronic Materials LLC ,  Rohm and Haas Electronic Materials Korea Ltd.

发明人： Shunya Takeuchi ,  Anna Ya Ching Feng ,  Yutaka Oka ,  Jung Hye Chae

IPC分类号： C08L83/04 ,  C08G77/20 ,  C08G77/28 ,  C08G77/00 ,  C08K5/132 ,  C08K5/18 ,  C08K5/5397

CPC分类号： C08L83/04 ,  C08G77/20 ,  C08G77/28 ,  C08G77/80 ,  C08K5/132 ,  C08K5/18 ,  C08K5/5397 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/16 ,  C08L2203/206 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2312/06

摘要： A UV curable silicone composition has exceptional curability by ultraviolet irradiation.
The UV curable silicone composition includes



(A) an organopolysiloxane composition selected from the following:

(A-1) an organopolysiloxane composition comprising a linear organopolysiloxane in which both ends of the molecular chain are capped with alkenyl groups and/or a branched organopolysiloxane containing at least 2 alkenyl groups at the ends of the molecular chain, and an organopolysiloxane containing at least 2 thiol groups in side-chains of the molecular chain, wherein the thiol group content is 1% by mass or more per molecule,
(A-2) an organopolysiloxane composition comprising a linear organopolysiloxane in which both ends of the molecular chain are capped with thiol groups, wherein the thiol group content is 1% by mass or more per molecule, and an organopolysiloxane containing at least 2 alkenyl groups in side-chains of the molecular chain and/or a resinous organopolysiloxane containing at least 2 alkenyl groups at the ends of the molecular chain, or
(A-3) an organopolysiloxane composition comprising an alkenyl group- and aryl group-containing organopolysiloxane and a multifunctional thiol compound, but furthermore comprising an alkenyl group-containing resinous organopolysiloxane when the multifunctional thiol compound contains only a bifunctional thiol compound, and


(B) a silicone-compatible photo-initiator comprising a compound selected from the following:

(B-1) an alpha-hydroxyacetophenone,
(B-2) a combination of an alpha-hydroxyacetophenone and an alpha-aminoalkylphenone, or
(B-3) a combination of an alpha-hydroxyacetophenone and a mono-acylphosphine oxide, wherein the ratio between the thiol groups and alkenyl groups (SH/Vi ratio) included in the organopolysiloxane composition is 0.6 or more.

公开(公告)号：US11732168B2

公开(公告)日：2023-08-22

申请号：US16489757

申请日：2018-03-02

申请人： NOLAX AG

发明人： Markus Läpple ,  Claude Hosotte ,  Barbara Niederberger

IPC分类号： C09J183/04 ,  B32B5/02 ,  B32B7/12 ,  B32B15/14 ,  B32B15/20 ,  B32B37/12 ,  B32B37/18 ,  C09J5/00 ,  C09J5/04 ,  C08G77/00

CPC分类号： C09J183/04 ,  B32B5/02 ,  B32B7/12 ,  B32B15/14 ,  B32B15/20 ,  B32B37/1284 ,  B32B37/18 ,  C09J5/00 ,  C09J5/04 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2262/101 ,  B32B2307/304 ,  B32B2311/24 ,  B32B2315/085 ,  C08G77/80 ,  C09J2423/04 ,  C09J2425/00 ,  C09J2433/00 ,  C09J2475/00 ,  C09J2483/00 ,  C09J183/04 ,  C08L33/08 ,  C09J183/04 ,  C08L75/04

摘要： A water-based adhesive which comprises a dispersed polymer and an emulsified silicone resin polymer. The adhesive is postcrosslinkable via reactive groups.

公开(公告)号：US20230245936A1

公开(公告)日：2023-08-03

申请号：US18010288

申请日：2021-06-18

申请人： SEKISUI CHEMICAL CO., LTD.

发明人： Taro SHIOJIMA ,  Kenichiro SATO ,  Hidenobu DEGUCHI ,  Hideaki ISHIZAWA ,  Munehiro HATAI ,  Tokushige SHICHIRI

IPC分类号： H01L23/29 ,  C08G77/44 ,  C09J5/02 ,  C09J183/10 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L23/296 ,  C08G77/44 ,  C09J5/02 ,  C09J183/10 ,  H01L24/05 ,  H01L24/08 ,  H01L24/80 ,  H01L24/03 ,  H01L21/56 ,  C08G77/80

摘要： The present invention aims to provide a stack having high electrical connection reliability, a curable resin composition used for the stack, a method for producing the stack, a method for producing a substrate having a bonding electrode used for producing the stack, a semiconductor device including the stack, and an imaging device including the stack. Provided is a stack sequentially including: a first substrate having an electrode; an organic film; and a second substrate having an electrode, the electrode of the first substrate and the electrode of the second substrate are electrically connected via a through-hole extending through the organic film.