公开(公告)号：US11923209B2

公开(公告)日：2024-03-05

申请号：US17678233

申请日：2022-02-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunwoong Hwang ,  Chawon Koh ,  Seok Heo ,  Hyunwoo Kim

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/6715 ,  H01L21/68764

Abstract: A substrate processing apparatus includes a substrate support configured to support and rotate a substrate, at least one first lower cleaning nozzle configured to spray a first cleaning liquid on a lower surface of the substrate, at least one second lower cleaning nozzle configured to spray a second cleaning liquid on the lower surface of the substrate, a bowl assembly disposed around the substrate support, the bowl assembly including a cup body providing an annular shaped accommodating space and inner and outer collection portions sequentially arranged in a radial direction in a lower portion of the cup body, an annular shaped discharge guide plate disposed in the receiving space of the bowl assembly under the substrate and extending outwardly from a circumference of the substrate, and a discharge separation plate provided within the receiving space of the bowl assembly to be movable upward and downward.

公开(公告)号：US11599021B2

公开(公告)日：2023-03-07

申请号：US17736132

申请日：2022-05-04

Applicant: Samsung Electronics Co., Ltd. ,  Inpria Corporation

Inventor： Chawon Koh ,  Tsunehiro Nishi ,  Brian Cardineau ,  Sangyoon Woo ,  Jason Stowers ,  Soo Young Choi

IPC: G03F7/004 ,  G03F7/11 ,  H01L21/027 ,  H01L21/311 ,  G03F7/20 ,  G03F7/32

Abstract: Provided herein are photoresist compositions and methods for fabricating semiconductor devices using the same. A photoresist composition may include an organometallic material, a fluorine-containing material, and an organic solvent.