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公开(公告)号：US20190189804A1
公开(公告)日：2019-06-20
申请号：US16044691
申请日：2018-07-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jung Gun YOU , Dong Hyun KIM , Byoung-Gi KIM , Yun Suk NAM , Yeong Min JEON , Sung Chul PARK , Dae Won HA
IPC: H01L29/78 , H01L29/66 , H01L21/8238 , H01L21/762 , H01L23/532 , H01L29/06
CPC classification number: H01L29/7855 , H01L21/762 , H01L21/823821 , H01L21/823864 , H01L23/5329 , H01L29/0642 , H01L29/6681
Abstract: A semiconductor device includes first and second fin patterns on a substrate and extending apart from each other, a field insulating film on the substrate and surrounding parts of the first and second fin patterns, a first gate structure on the first fin pattern and intersecting the first fin pattern, a second gate structure on the second fin pattern and intersecting the second fin pattern, and a separating structure protruding from a top surface of the field insulating film and separating the first and second gate structures, the field insulating film and the separating structure including a same insulating material.
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公开(公告)号：US20180073819A1
公开(公告)日：2018-03-15
申请号：US15698984
申请日：2017-09-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dong Hyun KIM , Jun Kyu Jung , Young Min Kim , Hayase Gaku
Abstract: A heat exchanger includes a plurality of tubes having refrigerant flowing therein and arranged to exchange heat with outside air; and a header having a chamber adapted to distribute the refrigerant to the plurality of tubes, wherein the header includes, a base wall having a plurality of tube insertion holes into which the plurality of tubes are inserted, and a partition wall integrally formed with the base wall and configured to divide the chamber into a plurality of sections corresponding to the plurality of tubes. This structure helps reduce the number of parts of the heat exchanger, simplify processing and assembling, and improving the heat transfer performance by improving the distribution of the refrigerant.
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