公开(公告)号：US20200020740A1

公开(公告)日：2020-01-16

申请号：US16426846

申请日：2019-05-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Eunhye KIM ,  Sangmoo PARK ,  Minsub OH ,  Yoonsuk LEE

IPC: H01L27/15 ,  H01L33/00 ,  G01N21/95 ,  H01L21/66

Abstract: An electronic apparatus is provided. The electronic apparatus includes a substrate including a plurality of electrodes in contact with at least part of electrodes of a plurality of micro LEDs disposed on a transparent substrate at a first pitch to apply a current to micro LEDs of the plurality of micro LEDs disposed at a second pitch, a camera disposed opposite to the substrate based on the transparent substrate, and a processor configured to apply a current to the plurality of electrodes on the substrate, control the camera to capture an image of the plurality of LEDs including a light emitting micro LED according to current applying, obtain characteristic information of the light emitting micro LED based on the captured image, and determine a target substrate on which each of the plurality of micro LEDs is disposed based on the obtained characteristic information.

公开(公告)号：US20220384675A1

公开(公告)日：2022-12-01

申请号：US17885164

申请日：2022-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungchul KIM ,  Doyoung KWAG ,  Sangmoo PARK ,  Wonsik CHOI

IPC: H01L33/00 ,  H01L25/075

Abstract: A method for repairing a display module and a display module repaired by the method are provided. The method for repairing a display module includes: detecting light-emitting diode (LED) missing positions on a target substrate; loading the target substrate onto a first stage; loading a transfer substrate onto a second stage; arranging the target substrate and the transfer substrate by operating the first stage and the second stage; and transferring a laser consecutively to the LED missing positions by moving the target substrate and the transfer substrate at a constant speed by operating the first stage and the second stage in a row direction or a column direction.

公开(公告)号：US20220181311A1

公开(公告)日：2022-06-09

申请号：US17677182

申请日：2022-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Byungchul KIM ,  Eunhye KIM ,  Sangmoo PARK ,  Minsub OH ,  Dongyeob LEE ,  Yoonsuk LEE

IPC: H01L25/13 ,  H01L33/00

Abstract: A display module is provided. The display module includes: a substrate; a thin film transistor (TFT) layer formed on one surface of the substrate; and a plurality of micro LEDs disposed on the TFT layer. The plurality of micro LEDs are transferred from a transfer substrate to the TFT layer by a laser beam radiated to the transfer substrate through openings of a mask. The openings correspond to regions in which the respective micro LEDs of the transfer substrate are arranged and the openings correspond to a width, a length, or a unit area of each of the micro LEDs.

公开(公告)号：US20210110748A1

公开(公告)日：2021-04-15

申请号：US17070581

申请日：2020-10-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungchul KIM ,  Doyoung KWAG ,  Sangmoo PARK ,  Minsub OH

IPC: G09G3/00 ,  H01L33/62 ,  H01L33/38 ,  H01L27/15

Abstract: A method of manufacturing a display apparatus includes performing a first repair process of detecting a first defective light emitting diode (LED) from among a plurality of LEDs provided on a sapphire substrate and removing the first defective LED; attaching the plurality of LEDs to electrode patterns of an interposer substrate and separating the sapphire substrate from the plurality of LEDs; and performing a second repair process of detecting a second defective LED among the plurality of LEDs attached to the electrode patterns and replacing the second defective LED.

公开(公告)号：US20210057258A1

公开(公告)日：2021-02-25

申请号：US16929311

申请日：2020-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doyoung KWAG ,  Byungchul KIM ,  Sangmoo PARK ,  Minsub OH

IPC: H01L21/683 ,  H01L21/67 ,  H01L25/075 ,  H01L27/12 ,  H01L33/62 ,  B23K26/08 ,  B23K26/04 ,  B23K26/03

Abstract: The application is related to a laser transfer apparatus and a method performed by the laser transfer apparatus. The laser transfer apparatus may include: a laser oscillator configured to perform irradiation with a laser beam; a first stage movably disposed below the laser oscillator; a second stage movably disposed below the first stage; a flatness measurement sensor; and a controller. The controller may be configured to control, once a transfer substrate on which a plurality of light emitting diodes (LEDs) are arranged is loaded on the first stage, and a target substrate is loaded on the second stage, the flatness measurement sensor to measure flatness of each of the transfer substrate and the target substrate, and adjust a height of at least one of the first stage or the second stage based on the flatness.

公开(公告)号：US20200243358A1

公开(公告)日：2020-07-30

申请号：US16731468

申请日：2019-12-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Eunhye KIM ,  Sangmoo PARK ,  Minsub OH ,  Yoonsuk LEE

IPC: H01L21/67 ,  H01L33/62 ,  H01L25/075 ,  H01L21/683

Abstract: A light-emitting diode (LED) transfer device is provided. The LED transfer device includes a transfer assembly configured to move a first substrate, on which a plurality of LEDs are provided, above a second substrate, a laser light source configured to emit a laser beam toward the first substrate, a mask that is disposed between the first substrate and the laser light source and has a plurality of openings that are configured to be selectively exposed and blocked and a processor configured to control the transfer assembly to move the first substrate to a predetermined position and selectively rotate the first substrate, and control the mask to expose and block the plurality of openings corresponding to the plurality of LEDs to be transferred from the first substrate to the second substrate.