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公开(公告)号：US20220139889A1
公开(公告)日：2022-05-05
申请号：US17574104
申请日：2022-01-12
发明人： Doyoung KWAG , Eunhye KIM , Sangmoo PARK , Minsub OH , Yoonsuk LEE
IPC分类号： H01L25/075 , H01L23/00 , H01L33/62 , H01L33/48 , H01L25/16 , H01L33/38 , H01L33/32 , H01L33/06
摘要： A display apparatus includes a substrate in which a plurality of pads are disposed, a plurality of micro LEDs, wherein each micro LED from among the plurality of micro LEDs is electrically connected to a respective group of pads from among the plurality of pads and mounted on the substrate, and a plurality of protrusion members, wherein each protrusion member from among the plurality of protrusion members protrudes from the substrate and is formed adjacent to a respective pad from among the plurality of pads.
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2.发明申请公开(公告)号：US20200020740A1
公开(公告)日：2020-01-16
申请号：US16426846
申请日：2019-05-30
发明人： Doyoung KWAG , Eunhye KIM , Sangmoo PARK , Minsub OH , Yoonsuk LEE
摘要： An electronic apparatus is provided. The electronic apparatus includes a substrate including a plurality of electrodes in contact with at least part of electrodes of a plurality of micro LEDs disposed on a transparent substrate at a first pitch to apply a current to micro LEDs of the plurality of micro LEDs disposed at a second pitch, a camera disposed opposite to the substrate based on the transparent substrate, and a processor configured to apply a current to the plurality of electrodes on the substrate, control the camera to capture an image of the plurality of LEDs including a light emitting micro LED according to current applying, obtain characteristic information of the light emitting micro LED based on the captured image, and determine a target substrate on which each of the plurality of micro LEDs is disposed based on the obtained characteristic information.
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公开(公告)号：US20210050498A1
公开(公告)日：2021-02-18
申请号：US16926161
申请日：2020-07-10
发明人： Yoonsuk LEE , Eunhye KIM , Dongyeob LEE , Sangmoo PARK
IPC分类号： H01L33/62 , H01L25/075 , H01L23/00
摘要： A light emitting diode (LED) element is provided. The LED element includes: an active layer configured to generate light; a first semiconductor layer disposed on a first surface of the active layer and doped with an n-type dopant; a second semiconductor layer disposed on a second surface of the active layer opposite to the first surface, the second semiconductor layer being doped with a p-type dopant; a first electrode pad and a second electrode pad electrically connected to the first semiconductor layer and the second semiconductor layer, respectively, the first electrode pad comprising a first contact surface and the second electrode pad comprising a second contact surface; and a conductive filler disposed on at least one contact surface from among the first contact surface and the second contact surface to increase a contact area of the at least one contact surface.
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公开(公告)号：US20200343297A1
公开(公告)日：2020-10-29
申请号：US16861728
申请日：2020-04-29
发明人： Byungchul KIM , Doyoung KWAG , Eunhye Kim , Sangmoo PARK , Minsub OH , Dongyeob LEE , Yoonsuk LEE
摘要： A micro light emitting diode (LED) transferring method includes setting a micro LED transfer substrate and a target substrate to initial positions and transferring a plurality of micro LEDs arranged in a partial region of the micro LED transfer substrate to the target substrate. Once the micro LEDs in the partial region are transferred to the target substrate, the micro LED transfer substrate is rotated and a plurality of micro LEDs, arranged in a remaining region of the micro LED transfer substrate, are then transferred to the target substrate.
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公开(公告)号：US20200313035A1
公开(公告)日：2020-10-01
申请号：US16832884
申请日：2020-03-27
发明人： Yoonsuk LEE , Sangmoo PARK , Doyoung KWAG , Byungchul KIM , Eunhye KIM , Minsub OH , Dongyeob LEE
摘要： A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.
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公开(公告)号：US20220069061A1
公开(公告)日：2022-03-03
申请号：US17523281
申请日：2021-11-10
发明人： Eunhye KIM , Doyoung KWAG , Sangmoo PARK , Minsub OH , Yoonsuk LEE
IPC分类号： H01L27/32
摘要： A display module includes a substrate; light emitting diodes, first connection pads, second connection pads, and side wirings. The light emitting diodes are arranged on one surface of the substrate. The first connection pads are formed on the one surface of the substrate. The second connection pads are formed on an opposite surface of the one surface. The side wirings are formed on each of a first edge of the substrate and a second edge of the substrate that is adjacent to the first edge. The side wirings electrically couple the first connection pads on the one surface of the substrate with respective ones of the second connection pads on the opposite surface.
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公开(公告)号：US20200161405A1
公开(公告)日：2020-05-21
申请号：US16681290
申请日：2019-11-12
发明人： Eunhye KIM , Doyoung KWAG , Sangmoo PARK , Minsub OH , Yoonsuk LEE
IPC分类号： H01L27/32
摘要： A display module and a large format display apparatus incorporating the display module are provided. The display module includes a thin film transistor substrate, light emitting diodes arranged on one surface of the thin film transistor substrate, and side wirings formed on each of a first edge of the thin film transistor substrate and a second edge of the thin film transistor substrate that is adjacent to the first edge, to electrically couple components on the one surface of the thin film transistor substrate with components on an opposite surface of the one surface respectively.
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公开(公告)号：US20190304816A1
公开(公告)日：2019-10-03
申请号：US16282581
申请日：2019-02-22
发明人： Doyoung KWAG , Sangmoo PARK , Yoonsuk LEE
IPC分类号： H01L21/67 , H01L21/687 , H01L33/62 , H01L25/075
摘要： A chip transfer device is provided. The chip transfer device according to an embodiment includes a support, a plurality of pick-up modules disposed on the support in a horizontal direction, and movably connected to the support, and a controller configured to control the plurality of pick-up modules, wherein each of the plurality of pick-up modules is movable while collectively picking up a plurality of chips on a corresponding wafer among a plurality of wafers, and wherein the controller moves and adjusts the plurality of pick-up modules in a horizontal direction.
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公开(公告)号：US20240313183A1
公开(公告)日：2024-09-19
申请号：US18663886
申请日：2024-05-14
发明人： Yoonsuk LEE , Seungryong HAN
IPC分类号： H01L33/62 , H01L25/075 , H01L33/00 , H01L33/42
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/0093 , H01L33/42
摘要： A display module is provided and includes an inorganic light emitting device; a first electrode at a first side of the inorganic light emitting device; a second electrode at a second side of the inorganic light emitting device, opposite to the first side; a first film layer including first conductive particles, the first film layer being between the first substrate and the inorganic light emitting device; and a second film layer including second conductive particles, the second film layer being between the second substrate and the inorganic light emitting device, wherein the first film layer is configured to connect the first electrode and the inorganic light emitting device through at least one of the first conductive particles, and wherein the second film layer is configured to connect the second electrode and the inorganic light emitting device through at least one of the second conductive particles.
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公开(公告)号：US20220181311A1
公开(公告)日：2022-06-09
申请号：US17677182
申请日：2022-02-22
发明人： Doyoung KWAG , Byungchul KIM , Eunhye KIM , Sangmoo PARK , Minsub OH , Dongyeob LEE , Yoonsuk LEE
摘要： A display module is provided. The display module includes: a substrate; a thin film transistor (TFT) layer formed on one surface of the substrate; and a plurality of micro LEDs disposed on the TFT layer. The plurality of micro LEDs are transferred from a transfer substrate to the TFT layer by a laser beam radiated to the transfer substrate through openings of a mask. The openings correspond to regions in which the respective micro LEDs of the transfer substrate are arranged and the openings correspond to a width, a length, or a unit area of each of the micro LEDs.
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