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    DISPLAY MODULE AND METHOD FOR MANUFACTURING DISPLAY MODULE
    1.
    发明申请
    DISPLAY MODULE AND METHOD FOR MANUFACTURING DISPLAY MODULE 有权

    公开(公告)号：US20220375907A1

    公开(公告)日：2022-11-24

    申请号：US17880027

    申请日：2022-08-03

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Wonsik CHOI ,  Doyoung KWAG ,  Byungchul KIM ,  Sangmoo PARK

    IPC: H01L25/075 ,  H01L33/62 ,  H01L33/00

    Abstract: A method for manufacturing a display module includes the steps of: transferring LEDs of a substrate to a first relay substrate; transferring the LEDs of the first relay substrate to a second relay substrate in a primary stretch array such that a gap between adjacent LEDs on the second relay substrate is greater than a gap between adjacent LEDs on the first relay substrate in one direction from among a row direction and a column direction; and transferring the LEDs of the second relay substrate to a target substrate in a secondary stretch array such that a gap between adjacent LEDs on the target substrate is greater than a gap between adjacent LEDs on the second relay substrate in a remaining direction from among the row direction and the column direction.

    MICRO LED ELEMENT AND MICRO LED DISPLAY MODULE HAVING THE SAME
    2.
    发明申请
    MICRO LED ELEMENT AND MICRO LED DISPLAY MODULE HAVING THE SAME 有权

    公开(公告)号：US20210050498A1

    公开(公告)日：2021-02-18

    申请号：US16926161

    申请日：2020-07-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yoonsuk LEE ,  Eunhye KIM ,  Dongyeob LEE ,  Sangmoo PARK

    IPC: H01L33/62 ,  H01L25/075 ,  H01L23/00

    Abstract: A light emitting diode (LED) element is provided. The LED element includes: an active layer configured to generate light; a first semiconductor layer disposed on a first surface of the active layer and doped with an n-type dopant; a second semiconductor layer disposed on a second surface of the active layer opposite to the first surface, the second semiconductor layer being doped with a p-type dopant; a first electrode pad and a second electrode pad electrically connected to the first semiconductor layer and the second semiconductor layer, respectively, the first electrode pad comprising a first contact surface and the second electrode pad comprising a second contact surface; and a conductive filler disposed on at least one contact surface from among the first contact surface and the second contact surface to increase a contact area of the at least one contact surface.

    MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFERRING METHOD USING THE SAME
    4.
    发明申请
    MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFERRING METHOD USING THE SAME 审中-公开

    公开(公告)号：US20200313035A1

    公开(公告)日：2020-10-01

    申请号：US16832884

    申请日：2020-03-27

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yoonsuk LEE ,  Sangmoo PARK ,  Doyoung KWAG ,  Byungchul KIM ,  Eunhye KIM ,  Minsub OH ,  Dongyeob LEE

    IPC: H01L33/00 ,  H01L33/62

    Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.

    DISPLAY MODULE AND LARGE FORMAT DISPLAY APPARATUS USING THE SAME
    6.
    发明申请
    DISPLAY MODULE AND LARGE FORMAT DISPLAY APPARATUS USING THE SAME 有权

    公开(公告)号：US20220069061A1

    公开(公告)日：2022-03-03

    申请号：US17523281

    申请日：2021-11-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Eunhye KIM ,  Doyoung KWAG ,  Sangmoo PARK ,  Minsub OH ,  Yoonsuk LEE

    IPC: H01L27/32

    Abstract: A display module includes a substrate; light emitting diodes, first connection pads, second connection pads, and side wirings. The light emitting diodes are arranged on one surface of the substrate. The first connection pads are formed on the one surface of the substrate. The second connection pads are formed on an opposite surface of the one surface. The side wirings are formed on each of a first edge of the substrate and a second edge of the substrate that is adjacent to the first edge. The side wirings electrically couple the first connection pads on the one surface of the substrate with respective ones of the second connection pads on the opposite surface.

    DISPLAY MODULE AND LARGE FORMAT DISPLAY APPARATUS USING THE SAME
    7.
    发明申请
    DISPLAY MODULE AND LARGE FORMAT DISPLAY APPARATUS USING THE SAME 审中-公开

    公开(公告)号：US20200161405A1

    公开(公告)日：2020-05-21

    申请号：US16681290

    申请日：2019-11-12

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Eunhye KIM ,  Doyoung KWAG ,  Sangmoo PARK ,  Minsub OH ,  Yoonsuk LEE

    IPC: H01L27/32

    Abstract: A display module and a large format display apparatus incorporating the display module are provided. The display module includes a thin film transistor substrate, light emitting diodes arranged on one surface of the thin film transistor substrate, and side wirings formed on each of a first edge of the thin film transistor substrate and a second edge of the thin film transistor substrate that is adjacent to the first edge, to electrically couple components on the one surface of the thin film transistor substrate with components on an opposite surface of the one surface respectively.

    CHIP TRANSFER DEVICE AND CHIP TRANSFERING METHOD USING THE SAME
    8.
    发明申请
    CHIP TRANSFER DEVICE AND CHIP TRANSFERING METHOD USING THE SAME 审中-公开

    公开(公告)号：US20190304816A1

    公开(公告)日：2019-10-03

    申请号：US16282581

    申请日：2019-02-22

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Doyoung KWAG ,  Sangmoo PARK ,  Yoonsuk LEE

    IPC: H01L21/67 ,  H01L21/687 ,  H01L33/62 ,  H01L25/075

    Abstract: A chip transfer device is provided. The chip transfer device according to an embodiment includes a support, a plurality of pick-up modules disposed on the support in a horizontal direction, and movably connected to the support, and a controller configured to control the plurality of pick-up modules, wherein each of the plurality of pick-up modules is movable while collectively picking up a plurality of chips on a corresponding wafer among a plurality of wafers, and wherein the controller moves and adjusts the plurality of pick-up modules in a horizontal direction.

    DISPLAY MODULE
    9.
    发明公开
    DISPLAY MODULE 审中-公开

    公开(公告)号：US20230352645A1

    公开(公告)日：2023-11-02

    申请号：US18197847

    申请日：2023-05-16

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sangmoo PARK ,  Donghwan KIM ,  Donghun LEE ,  Youngki JUNG

    IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12

    CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/124

    Abstract: A display module includes a substrate; a plurality of electrode pads provided on a surface of the substrate; a plurality of first barriers provided between the plurality of electrode pads; and a plurality of light-emitting diodes, each of the plurality of light-emitting diodes including device electrodes connected to corresponding electrode pads of the plurality of electrode pads, wherein each of the plurality of first barriers is provided between a pair of adjacent electrode pads corresponding to a light-emitting diode of the plurality of light-emitting diodes.

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