公开(公告)号：US20210250014A1

公开(公告)日：2021-08-12

申请号：US17245545

申请日：2021-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hosoo PARK ,  Duck Hwan KIM ,  Chul Soo KIM ,  Sang Uk SON ,  In Sang SONG ,  Jeashik SHIN ,  Moonchul LEE

IPC: H03H9/54 ,  H01L41/047 ,  H01L41/29 ,  H03H9/02 ,  H03H9/13 ,  H03H9/17

Abstract: A resonance apparatus that processes an electrical loss using a conductive material and a method of manufacturing the resonance apparatus are provided. The resonance apparatus includes a lower electrode formed at a predetermined distance from a substrate, and a piezoelectric layer formed on the lower electrode. The resonance apparatus further includes an upper electrode formed on the piezoelectric layer, and a conductive layer formed on the upper electrode or the lower electrode.

公开(公告)号：US20200274521A1

公开(公告)日：2020-08-27

申请号：US16871316

申请日：2020-05-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hosoo PARK ,  Duck Hwan KIM ,  Chul Soo KIM ,  Sang Uk SON ,  In Sang SONG ,  Jeashik SHIN ,  Moonchul LEE

IPC: H03H9/54 ,  H01L41/047 ,  H01L41/29 ,  H03H9/02 ,  H03H9/13 ,  H03H9/17

Abstract: A resonance apparatus that processes an electrical loss using a conductive material and a method of manufacturing the resonance apparatus are provided. The resonance apparatus includes a lower electrode formed at a predetermined distance from a substrate, and a piezoelectric layer formed on the lower electrode. The resonance apparatus further includes an upper electrode formed on the piezoelectric layer, and a conductive layer formed on the upper electrode or the lower electrode.

公开(公告)号：US20170366159A1

公开(公告)日：2017-12-21

申请号：US15674025

申请日：2017-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jea Shik SHIN ,  In Sang SONG ,  Young Il KIM ,  Duck Hwan KIM ,  Chul Soo KIM ,  Sang Uk SON ,  Hyung Rak KIM ,  Jae Chun LEE

IPC: H03H9/02 ,  H03H9/58 ,  H03H9/17 ,  H03H9/70

CPC classification number: H03H9/02102 ,  H03H9/171 ,  H03H9/173 ,  H03H9/174 ,  H03H9/588 ,  H03H9/706

Abstract: A bulk acoustic wave resonator (BAWR) includes a bulk acoustic resonance unit and at least one compensation layer. The bulk acoustic resonance unit includes a first electrode, a second electrode, and a piezoelectric layer disposed between the first electrode and the second electrode. The first electrode, the second electrode, and the piezoelectric layer each include a material that modifies a resonance frequency based on a temperature, and the at least one compensation layer includes a material that adjusts the resonance frequency modified based on the temperature in a direction opposite to a direction of the modification.

公开(公告)号：US20160033435A1

公开(公告)日：2016-02-04

申请号：US14881819

申请日：2015-10-13

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY

Inventor： Sang Uk SON ,  Duck Hwan KIM ,  In Sang SONG ,  Seong Chan JUN ,  Ho Soo PARK ,  Jea Shik SHIN ,  Moon Chul LEE

IPC: G01N27/08 ,  A61B5/05 ,  A61B5/053 ,  G01N27/07 ,  G01N27/22

CPC classification number: G01N27/08 ,  A61B5/05 ,  A61B5/053 ,  A61B5/14532 ,  A61B5/14546 ,  G01N27/02 ,  G01N27/07 ,  G01N27/226

Abstract: A method of measuring biological sample properties and a biological sample property measuring apparatus is provided. A method of measuring biological sample properties includes disposing a biomaterial to contact a sensing unit, detecting a radio frequency (RF) signal flowing through the sensing unit, and obtaining an RF property indicator of the biomaterial based on the detected RF signal.

公开(公告)号：US20150137906A1

公开(公告)日：2015-05-21

申请号：US14605044

申请日：2015-01-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Duck Hwan KIM ,  In Sang SONG ,  Chul Soo KIM ,  Young Il KIM ,  Jea Shik SHIN

IPC: H03H7/38 ,  H03H9/54

CPC classification number: H03H7/38 ,  H03H9/54 ,  H03H2007/386

Abstract: Provided are a matching segment circuit, to which a radio frequency (RF) is applied, and an RF integrated device using the matching segment circuit. The matching segment circuit to which an RF is applied may include an input end connected to a first RF device, a parallel segment having a first capacitor and a first inductor connected in parallel, a second inductor connected to the parallel segment in series, and an output end connected to a second RF device. The first capacitor, the first inductor, and the second inductor may be configured so that an impedance of the first RF device and an impedance of the second RF device may match.

Abstract translation: 提供了应用射频（RF）的匹配段电路和使用匹配段电路的RF集成设备。 施加RF的匹配段电路可以包括连接到第一RF器件的输入端，具有并联连接的第一电容器和第一电感器的并联段，串联连接到并联段的第二电感器， 输出端连接到第二RF设备。 第一电容器，第一电感器和第二电感器可以被配置为使得第一RF器件的阻抗和第二RF器件的阻抗匹配。