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公开(公告)号:US10340358B2
公开(公告)日:2019-07-02
申请号:US15951639
申请日:2018-04-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sung In Suh , Hoon Joo Na , Min Woo Song , Byoung Hoon Lee , Chan Hyeong Lee , Hu Yong Lee , Sang Jin Hyun
Abstract: A semiconductor device and method for fabricating the same are provided. The semiconductor device includes a substrate, a first active pattern disposed on the substrate and spaced apart from the substrate, a gate insulating film which surrounds the first active pattern, a first work function adjustment film which surrounds the gate insulating film and includes carbon, and a first barrier film which surrounds the first work function adjustment film, in which a carbon concentration of the first work function adjustment film increases as it goes away from the first barrier film.
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公开(公告)号:US20190081152A1
公开(公告)日:2019-03-14
申请号:US15951639
申请日:2018-04-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sung In Suh , Hoon Joo Na , Min Woo Song , Byoung Hoon Lee , Chan Hyeong Lee , Hu Yong Lee , Sang Jin Hyun
CPC classification number: H01L29/4966 , H01L21/02164 , H01L21/28088 , H01L21/28167 , H01L21/28518 , H01L29/517 , H01L29/66545 , H01L29/785
Abstract: A semiconductor device and method for fabricating the same are provided. The semiconductor device includes a substrate, a first active pattern disposed on the substrate and spaced apart from the substrate, a gate insulating film which surrounds the first active pattern, a first work function adjustment film which surrounds the gate insulating film and includes carbon, and a first barrier film which surrounds the first work function adjustment film, in which a carbon concentration of the first work function adjustment film increases as it goes away from. the first barrier film.
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