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公开(公告)号:US20170374182A1
公开(公告)日:2017-12-28
申请号:US15673097
申请日:2017-08-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyung Joo LEE , Gyu Sub KIM , Dong Yeon KIM , Chae Up YOO
IPC: H04M1/02 , H01Q5/328 , H01Q5/35 , H01Q1/24 , H01Q5/314 , H01Q1/52 , H01Q1/48 , H04B1/3827 , H04B1/48 , H04W84/12 , H04W4/00 , H04W84/04
CPC classification number: H04M1/0202 , H01Q1/243 , H01Q1/48 , H01Q1/521 , H01Q5/314 , H01Q5/328 , H01Q5/35 , H04B1/3833 , H04B1/48 , H04B2001/485 , H04W4/80 , H04W84/042 , H04W84/12
Abstract: An electronic device is provided. The electronic device includes a housing including a first surface, a second surface disposed facing an opposite side of the first surface, and a side surface configured to surround at least a portion of a space between the first surface and the second surface, a first elongated metal member configured to form a first portion of the side surface and including a first end and a second end, at least one communication circuit electrically connected to a first point of the first elongated metal member through a capacitive element, at least one ground member disposed in an interior of the housing, and a first conductive member configured to electrically connect a second point of the first elongated metal member to the ground member. The second point of the first elongated metal member is disposed closer to the second end than to the first point.
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公开(公告)号:US20180278731A1
公开(公告)日:2018-09-27
申请号:US15991568
申请日:2018-05-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyung Joo LEE , Gyu Sub KIM , Dong Yeon KIM , Chae Up YOO
IPC: H04M1/02 , H01Q1/52 , H01Q5/328 , H01Q5/35 , H01Q1/24 , H04B1/48 , H04B1/3827 , H01Q5/314 , H01Q1/48 , H04W4/80 , H04W84/04 , H04W84/12
Abstract: An electronic device is provided. The electronic device includes a housing including a first surface, a second surface disposed facing an opposite side of the first surface, and a side surface configured to surround at least a portion of a space between the first surface and the second surface, a first elongated metal member configured to form a first portion of the side surface and including a first end and a second end, at least one communication circuit electrically connected to a first point of the first elongated metal member through a capacitive element, at least one ground member disposed in an interior of the housing, and a first conductive member configured to electrically connect a second point of the first elongated metal member to the ground member. The second point of the first elongated metal member is disposed closer to the second end than to the first point.
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公开(公告)号:US20170048363A1
公开(公告)日:2017-02-16
申请号:US15234547
申请日:2016-08-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyung Joo LEE , Gyu Sub KIM , Dong Yeon KIM , Chae Up YOO
IPC: H04M1/02 , H04B1/48 , H04B1/3827
CPC classification number: H04M1/0202 , H01Q1/243 , H01Q1/48 , H01Q1/521 , H01Q5/314 , H01Q5/328 , H01Q5/35 , H04B1/3833 , H04B1/48 , H04B2001/485 , H04W4/80 , H04W84/042 , H04W84/12
Abstract: An electronic device is provided. The electronic device includes a housing including a first surface, a second surface disposed facing an opposite side of the first surface, and a side surface configured to surround at least a portion of a space between the first surface and the second surface, a first elongated metal member configured to form a first portion of the side surface and including a first end and a second end, at least one communication circuit electrically connected to a first point of the first elongated metal member through a capacitive element, at least one ground member disposed in an interior of the housing, and a first conductive member configured to electrically connect a second point of the first elongated metal member to the ground member. The second point of the first elongated metal member is disposed closer to the second end than to the first point.
Abstract translation: 提供电子设备。 电子设备包括壳体,其包括第一表面,面对第一表面的相对侧布置的第二表面和被配置为围绕第一表面和第二表面之间的空间的至少一部分的侧表面,第一细长 金属构件构造成形成侧表面的第一部分并且包括第一端和第二端,至少一个通过电容元件电连接到第一细长金属构件的第一点的通信电路,至少一个接地构件设置 在壳体的内部,以及构造成将第一细长金属构件的第二点电连接到接地构件的第一导电构件。 第一细长金属构件的第二点设置成比第一点更靠近第二端。
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