公开(公告)号：US11936732B2

公开(公告)日：2024-03-19

申请号：US17517235

申请日：2021-11-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jooyoo Kim ,  Jeongnam Kim ,  Jeongchoul Park ,  Jongwoon Park ,  Heekyung Yang ,  Jisoo Yeh ,  Miyoung Yoo ,  Jieun Lee ,  Jihyeon Jo

IPC: H04L67/12 ,  D06F34/04 ,  D06F34/06 ,  G05B13/02 ,  G16Y40/35 ,  G16Y40/60 ,  D06F105/56 ,  G16Y10/80

CPC classification number: H04L67/12 ,  D06F34/04 ,  D06F34/06 ,  G05B13/027 ,  G16Y40/35 ,  G16Y40/60 ,  D06F2105/56 ,  G16Y10/80

Abstract: A clothing processing apparatus included in an Internet of Things (IoT) system is provided. The clothing processing apparatus includes a communication interface and a processor configured to perform a process including at least one clothing processing operation.

公开(公告)号：US20230121734A1

公开(公告)日：2023-04-20

申请号：US17865497

申请日：2022-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongho Yu ,  Jieun Lee ,  Deoksung Hwang ,  Gisung Kim ,  Seungyoung Seo

IPC: H01L27/108

Abstract: A semiconductor device may include bit line structures on a substrate, a contact plug structure on the substrate between the bit line structures, and a capacitor electrically connected to the contact plug structure. The contact plug structure may include a first contact plug, a second contact plug, and a third contact plug sequentially stacked. An upper surface of the second contact plug includes an upper recess. The third contact plug may fill the upper recess, and may protrude above the upper recess. An upper surface of the third contact plug may be higher than a top surface of the bit line structures.