公开(公告)号：US10079305B2

公开(公告)日：2018-09-18

申请号：US14861748

申请日：2015-09-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byeongchan Lee ,  Nam-Kyu Kim ,  JinBum Kim ,  Kwan Heum Lee ,  Choeun Lee ,  Sujin Jung

IPC: H01L29/06 ,  H01L29/165 ,  H01L29/78 ,  H01L21/02 ,  H01L21/76 ,  H01L29/08 ,  H01L29/66

CPC classification number: H01L29/7851 ,  H01L29/0649 ,  H01L29/0688 ,  H01L29/0847 ,  H01L29/165 ,  H01L29/66545 ,  H01L29/66636 ,  H01L29/66795 ,  H01L29/7848

Abstract: Provided are a semiconductor device and a method of fabricating the same. The device may include an active pattern protruding from a substrate, gate structures crossing the active pattern, and a source/drain region provided between adjacent ones of the gate structures. The source/drain region may include a source/drain epitaxial layer in a recessed region, which is formed in the active pattern between the adjacent ones of the gate structures. Further, an impurity diffusion region may be provided in the active pattern to enclose the source/drain epitaxial layer along inner surfaces of the recessed region.

公开(公告)号：US10068993B2

公开(公告)日：2018-09-04

申请号：US15871479

申请日：2018-01-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： JinBum Kim ,  Kang Hun Moon ,  Choeun Lee ,  Sujin Jung ,  Yang Xu

IPC: H01L29/66 ,  H01L29/06 ,  H01L21/8234 ,  H01L29/08 ,  H01L29/78

Abstract: Methods of forming an integrated circuit device are provided. The methods may include forming a gate structure on a substrate, forming a first etch mask on a sidewall of the gate structure, anisotropically etching the substrate using the gate structure and the first etch mask as an etch mask to form a preliminary recess in the substrate, forming a sacrificial layer in the preliminary recess, forming a second etch mask on the first etch mask, etching the sacrificial layer and the substrate beneath the sacrificial layer using the gate structure and the first and second etch masks as an etch mask to form a source/drain recess in the substrate, and forming a source/drain in the source/drain recess. A sidewall of the source/drain recess may be recessed toward the gate structure relative to an outer surface of the second etch mask.

公开(公告)号：US09853160B2

公开(公告)日：2017-12-26

申请号：US15135566

申请日：2016-04-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sujin Jung ,  JinBum Kim ,  Kang Hun Moon ,  Kwan Heum Lee ,  Byeongchan Lee ,  Choeun Lee ,  Yang Xu

IPC: H01L27/088 ,  H01L29/78 ,  H01L29/08 ,  H01L29/66

CPC classification number: H01L29/7851 ,  H01L29/0847 ,  H01L29/66795 ,  H01L29/7848

Abstract: A semiconductor device is disclosed. The device includes a substrate including an active region defined by a device isolation layer, a fin pattern protruding from the substrate and extending in a first direction, the fin pattern including a gate fin region and a source/drain fin region, a gate pattern disposed on the gate fin region to extend in a second direction crossing the first direction, and a source/drain portion provided on a sidewall of the source/drain fin region. When measured in the second direction, a width of the source/drain fin region is different from a width in the second direction of the gate fin region.