公开(公告)号：US20210111056A1

公开(公告)日：2021-04-15

申请号：US16901228

申请日：2020-06-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kuihyun Yoon ,  Jaehak Lee ,  Yunhwan Kim ,  Jongkeun Lee ,  Kyohyeok Kim ,  Jewoo Han

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/67 ,  H01J37/32

Abstract: An etching apparatus includes a reaction chamber having an internal space; an upper electrode in the reaction chamber; a fixing chuck in the internal space of the reaction chamber and below the upper electrode; an electrostatic chuck above the fixing chuck and on which a wafer is configured to be placed; a focus ring surrounding the electrostatic chuck; and a plurality of sealing members configured to seal cooling gas provided to the focus ring and being in contact with the focus ring. The plurality of sealing members may be formed of a porous material. Each of the plurality of sealing members may include a body portion and an outer surface surrounding the body portion. Only the body portion may include voids and the outer surface may be smooth and free of voids.

公开(公告)号：US10006872B2

公开(公告)日：2018-06-26

申请号：US14955331

申请日：2015-12-01

Applicant: Samsung Electronics Co., Ltd. ,  Samsung Display Co., Ltd.

Inventor： Wonguk Seo ,  Kyoungchon Kim ,  Kuihyun Yoon ,  Kyunlae Kim ,  Jaeyoung Park ,  Kyoungho Yang ,  Young Heo

IPC: G01N21/958 ,  G01N21/88 ,  G01N21/94 ,  G01N21/95

CPC classification number: G01N21/94 ,  G01N21/8806 ,  G01N21/958 ,  G01N2021/9513

Abstract: Provided is an optical inspection system including a supporting unit, allowing a target object to be loaded thereon, a light source unit configured to emit a laser beam toward the target object, a light condensing unit collecting scattered light that is scattered at the target object when the laser beam is irradiated onto the target object, and a control unit controlling the light source unit and the light condensing unit and analyzing the scattered light to examine whether there are pollutants on the target object. The supporting unit may include a first supporting unit, on which the target object is disposed, and which is formed of a first material, and a second supporting unit, which is disposed under the first supporting unit and is formed of a second material different from the first material.