公开(公告)号：US20160242289A1

公开(公告)日：2016-08-18

申请号：US15016945

申请日：2016-02-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Manho KIM ,  Hwajoong JUNG ,  Youngseok KIM ,  Youngkwon YOON ,  Kihuk LEE ,  Yonghwan CHOI ,  Sunhyoung PYO

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H04M1/0277 ,  H04M1/0202 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/182 ,  H05K1/183 ,  H05K3/301 ,  H05K3/341 ,  H05K2201/1028 ,  H05K2201/2009 ,  H05K2203/0465

Abstract: An electronic device that includes a circuit board which is arranged between a front cover and a back cover, and includes a conductive pattern inserted into the circuit board. A signal generation or power supply element is electrically connected with the conductive pattern. An adhesion layer is attached onto the circuit board and overlaps at least part of the conductive pattern when viewed from above the circuit board. A first structure is arranged on the adhesion layer and overlaps at least part of the adhesion layer when viewed from above the circuit board. A second structure is arranged on a top of the first structure, overlaps at least part of the first structure when viewed from above the circuit board, and the second structure includes a bottom surface including metal. A metal layer is inserted between the first structure and the bottom surface of the second structure to attach the second structure to the first structure.

Abstract translation: 一种电子设备，包括布置在前盖和后盖之间的电路板，并且包括插入到电路板中的导电图案。 信号产生或电源元件与导电图案电连接。 当从电路板上方观察时，粘合层附着在电路板上并与导电图案的至少一部分重叠。 当从电路板上方观察时，第一结构布置在粘合层上并与粘合层的至少一部分重叠。 第二结构设置在第一结构的顶部，当从电路板上方观察时，与第一结构的至少一部分重叠，并且第二结构包括包括金属的底表面。 金属层插入在第一结构和第二结构的底表面之间，以将第二结构附接到第一结构。